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Micron Technology

Makes memory and storage chips for AI and PCs

Adtt Dry Etch Master

Process EngineeringConfirmed live in the last 24 hours
Full-timeTaichung City, TaiwanNo salary listedIn-person

About the Job

Requirements

  • A Ph.D. or Master's degree in Electrical Engineering, Materials Science, Chemical Engineering, Physics, or a related field is required.
  • At least 10 years of hands-on experience in Dry Etch process development is required, preferably in DRAM or advanced memory technologies.
  • A proven track record of technical leadership in semiconductor process engineering is required.
  • Deep understanding of plasma etch mechanisms, process control, and defect mitigation is required.
  • Experience with advanced etch tools such as Lam, TEL, and AMAT, and process characterization techniques is required.
  • Strong analytical, problem-solving, and communication skills are required.
  • Ability to lead cross-functional teams and manage complex projects is required.

Responsibilities

  • Lead the development, characterization, and optimization of Dry Etch processes for advanced DRAM structures.
  • Collaborate with integration, metrology, equipment, and R&D teams to ensure process robustness and manufacturability.
  • Define and execute technical roadmaps aligned with DRAM scaling requirements and yield improvement goals.
  • Evaluate and implement new etch technologies, chemistries, and hardware platforms.
  • Mentor and guide junior engineers, fostering a culture of innovation and technical excellence.
  • Interface with equipment vendors and external partners to co-develop solutions.
  • Drive root cause analysis and continuous improvement initiatives for process-related issues.
  • Present findings and recommendations to executive leadership and global teams.

Desired Qualifications

  • Experience with high aspect ratio etching, critical dimension control, and selectivity challenges in DRAM is preferred.
  • Familiarity with data analytics, Design of Experiments (DOE) methodologies, and Statistical Process Control (SPC) tools is preferred.
  • Knowledge of integration challenges in sub-20nm DRAM nodes is preferred.

About the Company

Micron Technology

Makes memory and storage chips for AI and PCs

Micron Technology designs and manufactures memory and storage chips, mainly DRAM and NAND flash, used in data centers, PCs, phones, cars and industrial equipment. It is one of only three companies that make HBM, the stacked high-bandwidth memory placed beside processors in AI servers, and it is the largest memory chipmaker based in the United States. Unlike chip designers that outsource production, Micron runs its own fabs and assembly sites in the United States and across Asia. It earns money by selling chips, memory modules and solid-state drives to cloud providers, device makers and distributors. Micron was founded in 1978 and is headquartered in Boise, Idaho.

Company size
10,001+
Company stage
IPO
Headquarters
Boise, ID
Founded
1978

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