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Renesas Electronics

Automotive-focused MCUs, SoCs, analog devices

Principal AI Software Architecture Engineer

Systems Software EngineeringConfirmed live in the last 24 hours
Full-timeDüsseldorf, GermanyNo salary listed

About the Job

Requirements

  • A master's degree or PhD in Computer Science, Computer Engineering, Electrical Engineering, or a related technical field is required; equivalent technical achievement may be considered with substantial industry experience and recognized architecture leadership.
  • At least 10 years of experience in complex software systems, AI infrastructure, compiler technologies, embedded software, deployment platforms, or related domains; 15 or more years is preferred for the target profile.
  • At least 5 years of technical leadership, architecture ownership, or cross-team technical influence.
  • Experience leading architecture decisions affecting multiple teams, product generations, platforms, or customer-facing software ecosystems.
  • Experience working in globally distributed engineering environments.
  • Fluent spoken and written English.
  • Expertise in large-scale software architecture and platform evolution.
  • Expertise in AI model deployment workflows and AI software toolchains.
  • Experience with compiler ecosystems such as LLVM, MLIR, IREE, XLA, TVM, OpenXLA, or comparable technologies.
  • Programming expertise in C++ and Python.
  • Experience with AI frameworks and model formats such as PyTorch, TensorFlow, ONNX, and TFLite.
  • Expertise in runtime integration, performance engineering, profiling, memory optimization, and latency/throughput analysis.
  • Experience with embedded and edge computing environments, including memory, power, performance, and deployment workflow constraints.
  • Knowledge of heterogeneous hardware architectures including CPUs, MCUs, MPUs, NPUs, DSPs, GPUs, and accelerator-based systems.

Responsibilities

  • Define and drive long-term AI software architecture strategy across model translation, compiler, runtime, and deployment layers.
  • Lead architecture decisions for heterogeneous AI deployment across CPUs, MCUs, MPUs, NPUs, DSPs, GPUs, and future accelerator technologies.
  • Guide the evolution of compiler and runtime technologies, including integration with LLVM/MLIR or equivalent compiler ecosystems where appropriate.
  • Collaborate with hardware, software, product, application engineering, and customer-facing teams to translate platform needs into executable technical roadmaps.
  • Drive hardware/software co-design discussions to influence future AI acceleration and software platform capabilities.
  • Mentor senior engineers and technical leads, helping shape architecture thinking across globally distributed teams.
  • Represent technical direction in architecture reviews, roadmap discussions, customer workshops, partner discussions, and executive-level technical reviews.
  • Travel internationally up to 30% to support global engineering collaboration, architecture reviews, customer workshops, technical roadmap discussions, partner engagement, conferences, and executive technical reviews.

Desired Qualifications

  • Experience defining multi-year technical roadmaps.
  • Experience with customer-facing technical leadership, strategic workshops, or partner ecosystem discussions.
  • Experience mentoring senior engineers, technical leads, or future architects.
  • Contributions to compiler, AI deployment, runtime, embedded software, or open-source ecosystems.
  • Patents, publications, or recognized technical contributions are advantageous but not required if strong architecture ownership is demonstrated.
  • Additional language capabilities such as Japanese, German, French, or other business-relevant languages are beneficial but not mandatory.

About the Company

Renesas Electronics

Automotive-focused MCUs, SoCs, analog devices

Renesas manufactures and sells MCUs, SoCs, and analog/power semiconductor devices to OEMs, focusing on automotive, industrial, infrastructure, and IoT markets. Its chips are building blocks that run embedded software and manage power and signals, and its Winning Combinations offer pre-tested system architectures to speed up design. It differentiates itself by growing through acquisitions to offer a broad, integrated portfolio and by moving toward a unified digital design platform to reduce integration work. Its goal is to become a leading supplier of these components and provide a single platform for electronics design that speeds time-to-market.

Company size
10,001+
Company stage
IPO
Headquarters
Tokyo, Japan
Founded
2002

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