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Black Semiconductor

Graphene photonics enable optical chip interconnects

Working Student Intern - Data & AI

Data EngineeringPosted on Nov 13
InternshipAachen, GermanyNo salary listedHybrid

About the Job

Requirements

  • Current enrolment in a bachelor's or master's programme in computer science, data science, physics, electrical engineering, mathematics, business informatics or another quantitative field.
  • An interest in artificial intelligence, data technologies, deep tech or the semiconductor industry.
  • Curiosity, reliability and a strong willingness to learn.
  • A structured approach to work and the confidence to ask questions when something is unclear.
  • Good communication and teamwork skills.
  • Good English skills.
  • Some programming experience with Python or SQL.
  • Familiarity with Jupyter, Git or GitLab.
  • Experience with Microsoft 365, Teams, Miro or PowerPoint.
  • Familiarity with LLM tools or agent frameworks.

Responsibilities

  • Support the setup, configuration and testing of data and machine-learning platforms.
  • Help create, structure and maintain ontologies and knowledge graphs.
  • Assist with configuring agentic platforms, LLM tools and other AI technologies.
  • Perform data preparation, analysis and data-pipeline tasks under guidance.
  • Support research and other administrative activities related to Data & AI projects.
  • Prepare clear documentation so that work and findings can be understood and reused by others.
  • Record meeting notes and help keep project information structured and up to date.
  • Participate in stand-ups and team meetings, sharing progress, questions and blockers openly.
  • Collaborate with a mentor and other team members while developing technical skills.

Desired Qualifications

  • German language skills.

About the Company

Black Semiconductor

Graphene photonics enable optical chip interconnects

Black Semiconductor develops graphene-based photonics that integrate optical components into the outer layers of CMOS-like chips, enabling direct optical chip-to-chip communication. It works by using graphene as a translator to convert electronic signals to optical signals and back, so electrons on silicon can talk to photons through integrated photonic interconnects. This approach differs from traditional silicon photonics or pure electronic interconnects by being CMOS-compatible, wafer-scale, and capable of linking multiple chips as a single high-performance unit while reducing production steps by about 60%. The company aims to move from pilot production to mass manufacturing, building a 300mm wafer facility (FabONE) in Aachen, with pilot production by 2027 and mass production by 2031, backed by a large European funding round and investors.

Company size
51-200
Company stage
Growth Equity (Non-Venture Capital)
Total funding
$287.4M
Headquarters
Aachen, Germany
Founded
2020

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