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Micron Technology

Makes memory and storage chips for AI and PCs

Member of Technical Staff - HIG-HBM Product System Engineering, Media Health Manufacturing

Process EngineeringConfirmed live in the last 24 hours
Full-timeSingaporeNo salary listed

About the Job

Requirements

  • A bachelor's or master's degree in Electrical and Electronics Engineering and 8+ years of experience in the semiconductor industry.
  • Strong leadership and technical skills, particularly problem-solving, root-cause analysis, and in-depth circuit analysis.
  • Knowledge of statistics, data-analysis tools, and scripting.
  • Ability to adapt to different roles in a dynamic work environment, including leading a team and leading technical programs.
  • A proven record of collaborative work within and across teams to address complex business and engineering problems.
  • A strong sense of responsibility and accountability for the assigned role, with a professional work ethic.
  • Excellent communication and presentation skills.
  • Passion for people leadership and ongoing learning and development in this area.
  • Ability to work on site in Singapore and travel internationally to the United States, Taiwan, and Japan.

Responsibilities

  • Lead and develop a high-performing team driving Media Health Manufacturing and activities for Micron's latest HBM products, covering DRAM, interface die, and stacked products.
  • Lead a portfolio of next-generation HBM products focused on quality, cost, cycle time, and scale.
  • Develop and validate manufacturing test flows; improve device and stacked-die yield and reliability through circuit debugging, test-coverage optimization, strategy innovation, manufacturing test-time improvement, and design-for-test strategy.
  • Optimize test coverage across current and future HIG HBM design architectures and process nodes for high-volume manufacturing.
  • Develop, validate, characterize, and qualify next-generation HBM products to ensure reliability and readiness for market.
  • Support design verification and in-depth circuit analysis for new products using computer-aided design tools and Verilog simulations.
  • Improve manufacturing test yields for DRAM, interface, and stacked-die issues; reduce test time and resolve yield-related issues to reduce costs and meet targets.
  • Find root causes and resolve manufacturing test-flow, qualification, and return-material-authorization device issues.
  • Promote innovation and implement changes that provide Micron with a technical advantage.
  • Mentor and develop team members.
  • Develop project-management skills within the team to support timely execution and delivery of technology solutions.
  • Make final decisions on risk analysis and project prioritization.
  • Collaborate with Fab, HBM Technology Development, HBM Design, System Development, and Quality/Reliability teams to develop and ship end products.
  • Identify, test, and share AI-enabled improvements within the scope of work to support continuous improvement.

Desired Qualifications

  • Product Engineering experience is preferred.

About the Company

Micron Technology

Makes memory and storage chips for AI and PCs

Micron Technology designs and manufactures memory and storage chips, mainly DRAM and NAND flash, used in data centers, PCs, phones, cars and industrial equipment. It is one of only three companies that make HBM, the stacked high-bandwidth memory placed beside processors in AI servers, and it is the largest memory chipmaker based in the United States. Unlike chip designers that outsource production, Micron runs its own fabs and assembly sites in the United States and across Asia. It earns money by selling chips, memory modules and solid-state drives to cloud providers, device makers and distributors. Micron was founded in 1978 and is headquartered in Boise, Idaho.

Company size
10,001+
Company stage
IPO
Headquarters
Boise, ID
Founded
1978

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