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Nexthop.ai

AI-driven cloud networking hardware and software

Thermal Process Engineer

Manufacturing EngineeringConfirmed live in the last 24 hours
Full-timeBắc Ninh, Bac Ninh, VietnamNo salary listedIn-person

About the Job

Requirements

  • A Master's degree in Mechanical Engineering, Manufacturing Engineering, or a related field.
  • At least 7 years of experience in manufacturing and process engineering, including at least 2 years of liquid-cooling experience.
  • Hands-on experience with thermal or fluid-handling hardware.
  • Strong understanding of mechanical tolerances and torque control, assembly processes and tooling, manufacturing quality systems, thermodynamics, and heat transfer.
  • Experience with liquid-cooled servers, network switches, or high-performance computing systems.
  • Experience working in or with startups.

Responsibilities

  • Define end-to-end manufacturing processes for direct-to-chip cold plates; manifolds and distribution plates; tubing, hoses, and quick-disconnects; and thermal interface material application, in collaboration with engineering.
  • Develop process flow diagrams, control plans, and work instructions.
  • Ensure processes comply with design for manufacturing, assembly, and service, and are serviceable in field environments.
  • Enable fast prototyping and rapid iterative development cycles.
  • Drive development of Design Failure Mode and Effects Analysis with engineering.
  • Support thermal hardware from early engineering validation test through high-volume manufacturing ramp.
  • Identify and mitigate process risks, including leak paths, torque variation, flatness and coplanarity, and particulate contamination.
  • Lead process validation builds and define the golden line.
  • Partner with original design manufacturers to ensure manufacturability at scale.
  • Specify and qualify torque tools and sequencing strategies, dispensing systems for thermal interface materials and sealants, and air, helium, or liquid pressure and leak-test equipment.
  • Drive semi-automated and automated solutions for cold-plate installation, hose routing and retention, and quick-disconnect engagement verification.
  • Define mistake-proofing mechanisms to prevent mis-builds.
  • Own Process Failure Mode and Effects Analysis and control plans for liquid-cooling processes.
  • Define acceptance criteria for leak rate, pressure decay, flow resistance, and thermal performance.
  • Support highly accelerated life testing, highly accelerated stress screening, thermal cycling, vibration, and shock testing.
  • Lead root-cause analysis for field and factory issues, including leaks, clogging, and corrosion.
  • Establish process key performance indicators for leak parts per million, torque process capability, thermal interface material thickness uniformity, yield, and rework rates.
  • Integrate test data into manufacturing execution systems and quality dashboards.
  • Drive yield improvement and cost reduction through data-driven analysis.
  • Work with cold-plate suppliers, hose and quick-disconnect vendors, thermal interface material and sealant suppliers, and original design and equipment manufacturer manufacturing teams.
  • Qualify suppliers and define incoming quality requirements.
  • Support dual-sourcing and cost-reduction initiatives.

Desired Qualifications

  • Familiarity with cold-plate design and materials, including copper, aluminum, and nickel plating.
  • Familiarity with thermal interface material characterization and dispensing.
  • Familiarity with leak detection methods, including helium mass spectrometry and pressure decay.
  • Experience working with hyperscalers or large original design manufacturers.
  • Knowledge of data-center cooling architectures, including direct liquid cooling, coolant distribution units, and facility interfaces.

About the Company

Nexthop.ai

AI-driven cloud networking hardware and software

Nexthop AI develops networking hardware and software designed for AI-driven cloud infrastructure. Its products combine specialized routers and software that optimize data-center networks for AI workloads, built through close co-development with large cloud operators. The company works by partnering with hyperscalers to tailor and deploy scalable networking solutions, rather than selling generic gear. This approach sets Nexthop AI apart from competitors by focusing on deep, collaborative development with cloud providers and delivering integrated hardware-software systems that fit specific AI cloud needs. The goal is to meet the rising demand for advanced cloud infrastructure by delivering efficient, scalable networking solutions through strategic partnerships and joint development.

Company size
201-500
Company stage
Series B
Total funding
$610M
Headquarters
Santa Clara, CA
Founded
2024

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