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Renesas Electronics

Automotive-focused MCUs, SoCs, analog devices

Industrial Engineer

Full-Time
No salary listed
Mid
Bachelor's
Bayan Lepas, Penang, Malaysia
In Person
Manufacturing & Process EngineeringManufacturing Engineering

About the job

Requirements
  • Bachelor's degree in Industrial Engineering, Manufacturing Engineering, Electrical/Electronics Engineering, or a related technical field.
  • Two to four years of experience in semiconductor backend test manufacturing, or a strong internship/co-op background in a similar environment.
  • Working knowledge of OEE analysis, capacity/UPH studies, and floor layout concepts.
  • Data analysis skills and proficiency with Excel; exposure to SQL, Minitab, or similar tools is a plus.
  • Basic understanding of Lean Manufacturing or Six Sigma principles.
  • Ability to work on the production floor and collaborate across shifts and functions.
Responsibilities
  • Collect and analyze test output entitlement versus actual performance data to support improvement initiatives.
  • Track equipment OEE against target and support root-cause gap analysis.
  • Support test floor layout improvements to enhance material flow, equipment utilization, and floor efficiency.
  • Assist in shop floor layout design, including material mobility tools such as carts and AMRs/AGVs, and WIP staging areas.
  • Support daily shop floor planning activities in coordination with Production and Planning teams.
  • Conduct regular audits of device UPH to validate test time accuracy and flag deviations.
  • Identify opportunities for factory internal process optimization across man and machine utilization.
  • Support factory automation initiatives to reduce manual intervention and improve throughput and consistency.
  • Assist with ISO and other factory quality/compliance audits by preparing data, documentation, and process evidence.
  • Participate in benchmarking activities to help harmonize test floor practices and KPIs across sites.
  • Support equipment movement activities, including internal relocations and external transfers.
  • Assist with asset tracking and basic lifecycle record-keeping for test equipment.
  • Coordinate with Equipment, Quality, Planning, and Production teams to help resolve floor-level issues.
  • Prepare performance data and reports to support management review and decision-making.
Desired Qualifications
  • Familiarity with semiconductor test equipment and factory MES/data systems.
  • Lean Six Sigma Yellow Belt or Green Belt certification.
  • Exposure to factory automation projects, including robotics, AMRs/AGVs, or equipment integration.
  • Prior exposure to structured problem-solving tools such as 8D, DMAIC, and PDCA.
  • Experience with CMMS or factory data collection systems.
  • Ability to present findings clearly to a team.

About the company

Renesas Electronics designs and manufactures semiconductor components, including microcontrollers, system-on-a-chip solutions, and analog and power devices for automotive, industrial, infrastructure, and IoT markets. Its chips serve as building blocks inside customers’ electronic products, and it offers Winning Combinations—pre-tested system architectures that combine Renesas parts with technologies from its acquisitions to speed development. The company differentiates itself through a broad, integrated portfolio built via acquisitions and a planned unified digital design platform that streamlines integration with hardware and software. Its goal is to be a leading supplier of MCUs, SoCs, and analog/power devices while providing a single, connected design ecosystem that shortens customers’ development cycles.

Company Size

10,001+

Company Stage

IPO

Headquarters

Tokyo, Japan

Founded

2002

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Simplify's Take

What believers are saying

  • Renesas launched 650V dual-side-cooled GaN on September 30, 2026 for megawatt AI data centers.
  • Renesas completed Altium on May 29, 2026 and Pictorus on June 18, 2026.
  • TIER IV collaboration on August 20, 2026 expands Renesas into open autonomous-driving platforms.

What critics are saying

  • Renesas sued Navitas on July 22, 2026, and Navitas countersued August 10, 2026.
  • Takasaki factory production ends within two to three years, signaling legacy manufacturing strain.
  • GaN and autonomous-driving bets face execution risk if AI-data-center and SDV wins slip.

What makes Renesas Electronics unique

  • Altium plus Pictorus unify Renesas 365, spanning design, simulation, and deployment.
  • R-Car Gen 5 anchors open Autoware partnerships across Level 2+ to Level 4 autonomy.
  • Renesas leads automotive MCU, analog, and power silicon for high-reliability embedded systems.

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Benefits

  • Health Insurance
  • Life Insurance
  • Mental Health Support
  • Professional Development Budget
  • Meal Benefits

Growth & Insights and Company News

Headcount

6 month growth

-21%

1 year growth

-30%

2 year growth

-30%
Business Wire
Oct 22nd, 2026
Renesas launches 600MHz RX74M and RX74N MCUs, its first RX chips on 22nm with MRAM

Renesas Electronics Corporation today launched the RX74M and RX74N, two 32-bit microcontrollers (MCUs) that run at up to 600MHz. They are the first in the RX Family built on a 22nm process with embedded MRAM, and deliver more than twice the performance of the 240MHz RX72M and RX72N. The RX74M targets industrial automation equipment such as AC drives, robots, and programmable logic controllers. The RX74N is aimed at smart meters, power conditioners, and heating, ventilation, and air conditioning systems. MRAM writes data without a prior erase step, which speeds updates and cuts downtime. The RX74M also combines EtherCAT, Ethernet TSN, and CAN FD on one chip. Both devices add hardware security features, including support for post-quantum cryptography. Versions at 300MHz use more than 20% less power. Both MCUs are available now.

Business Wire
Oct 6th, 2026
Renesas launches 100V GaN FETs for AI data centres with 63% lower soft-switching losses

Renesas Electronics has launched its first 100V gallium nitride (GaN) power transistors for low-voltage applications. The new family of GaN FETs targets AI data centres, humanoid robotics, factory automation, industrial motor drives, power tools, and solar microinverters. The devices deliver up to 35% lower hard-switching figure-of-merit and up to 63% lower soft-switching figure-of-merit compared to comparable GaN products. They maintain silicon-compatible footprints for easy integration into existing designs. The transistors support the transition to 800V direct current power distribution and 48V bus architectures in AI servers and industrial infrastructure. They enable megahertz-class switching speeds whilst reducing passive component size, switching losses, and cooling requirements. The GaN FETs are available now in FCLGA and FCLGA-DSC packages, with corresponding evaluation boards.

Yahoo Finance
Sep 30th, 2026
Renesas launches industry's first 650V GaN chip with dual-side cooling for megawatt-scale AI data centres

Renesas Electronics has launched the industry's first 650V gallium nitride device with dual-side cooling for AI data centres. The TP65H020G4PLSGBD delivers 20 milliohms on-resistance in an 8x8mm package, 57% smaller than existing alternatives. The device targets 800V DC/DC intermediate bus converters in megawatt-scale data centres, addressing space and thermal constraints as rack power approaches megawatt levels. Dual-side cooling reduces top-side thermal impedance by 10% whilst maintaining compatibility with standard silicon gate drivers. Renesas is currently sampling the device to major data centre manufacturers. A 6kW reference design achieved 2.6 kW/in³ power density with 0.21% higher efficiency than equivalent alternatives. Mass production is planned for mid-2027. The device will be showcased at OCP Global Summit in San Jose, California, from 12-15 October.

PR Newswire
Sep 1st, 2026
Autoware Foundation partners with Renesas to deliver open-source end-to-end AI for ADAS and autonomous driving

The Autoware Foundation has partnered with Renesas Electronics to deliver open-source AI software for advanced driver assistance systems and autonomous driving. Renesas has joined the foundation at its highest membership tier. The collaboration integrates Autoware's end-to-end AI stack with Renesas R-Car system-on-chip platforms. This enables automotive manufacturers and Tier-1 suppliers to develop scalable solutions ranging from entry-level L2 driver assistance to L2++ hands-free autopilot and L4 robotaxis. The partnership allows OEMs to customise the Apache 2.0-licensed software for specific vehicles and use cases, offering a flexible alternative to in-house development or commercial solutions. The companies describe this as a watershed moment for the industry, comparing it to Linux's impact on computing. "This is the Linux moment for the ADAS and autonomous driving industry," said Christian John, board director at the Autoware Foundation.

Business Wire
Aug 27th, 2026
Renesas opens Physical AI & Robotics Lab in Beijing to advance humanoid robot development

Renesas Electronics has opened a Physical AI & Robotics Lab in Beijing to help customers develop and validate next-generation robotic systems. The facility will support the company's physical AI strategy, focusing on systems that perceive, decide and act in real time in physical environments. Physical AI represents AI's evolution beyond digital applications into robotics and other real-world systems. The lab will integrate hardware, software, AI modelling, control, power supply and sensing to support complete solution development. Renesas currently addresses roughly 30% of the humanoid robot bill of materials and aims to expand that to 70%. The company established a Physical AI Division on 1 July 2026 to focus on this growth area. The Beijing lab will serve as a platform connecting customers, ecosystem partners, universities and startups to accelerate robotics innovation in China's thriving robotics market.