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Renesas Electronics

Automotive-focused MCUs, SoCs, analog devices

Process Engineer

Process EngineeringUpdated on Nov 12
Full-timeBayan Lepas, Penang, MalaysiaNo salary listedIn-person

About the Job

Requirements

  • Bachelor's degree in Chemical Engineering, Materials Engineering, Manufacturing Engineering, or a related field.
  • Knowledge of electroplating, surface finishing, wet chemistry, and materials science.
  • Experience with Design of Experiments (DOE), Statistical Process Control (SPC), Six Sigma, Process Failure Mode and Effects Analysis (PFMEA), and root-cause analysis.
  • Experience in semiconductor assembly plating, lead frame plating, Atomic Absorption Spectroscopy (AAS) machine chemical analysis, or metal-finishing processes is preferred.

Responsibilities

  • Develop, optimize, and control plating processes to achieve high product quality, yield, and manufacturing efficiency.
  • Develop and maintain process specifications, work instructions, Failure Mode and Effects Analysis (FMEA), Control Plans, Key Process Input Variables (KPIV), Key Process Output Variables (KPOV), and troubleshooting guides.
  • Support continuous improvement, cost reduction, automation, and productivity initiatives.
  • Evaluate and qualify new plating equipment, chemicals, and process technologies.
  • Collaborate with equipment, quality, maintenance, and production teams to implement corrective and preventive actions for quality issues and customer complaints.
  • Support new package and product qualifications, process transfers, and customer requirements.

About the Company

Renesas Electronics

Automotive-focused MCUs, SoCs, analog devices

Renesas manufactures and sells MCUs, SoCs, and analog/power semiconductor devices to OEMs, focusing on automotive, industrial, infrastructure, and IoT markets. Its chips are building blocks that run embedded software and manage power and signals, and its Winning Combinations offer pre-tested system architectures to speed up design. It differentiates itself by growing through acquisitions to offer a broad, integrated portfolio and by moving toward a unified digital design platform to reduce integration work. Its goal is to become a leading supplier of these components and provide a single platform for electronics design that speeds time-to-market.

Company size
10,001+
Company stage
IPO
Headquarters
Tokyo, Japan
Founded
2002

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