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Qnity

Publicly-traded provider of semiconductor materials

Manufacturing Engineer - Adhesive Development and Dispensing Process

Process EngineeringUpdated on Nov 14
Full-timeShanghai, ChinaNo salary listedIn-person

About the Job

Requirements

  • A bachelor's degree or above in Polymer Materials, Materials Science and Engineering, Applied Chemistry, Chemical Engineering, Mechanical Automation, or a related major.
  • More than 5 years of experience in adhesive development, adhesive application engineering, or dispensing-process development, with deep expertise in adhesive materials or dispensing processes and the ability to drive engineering validation independently in the other area.
  • Hands-on experience in adhesive formulation or modification development and understanding of how resins, curing agents, fillers, and additives affect viscosity, thixotropy, curing, and bonding performance.
  • Familiarity with dispensing equipment and adhesive-supply systems, and ability to design experiments independently and optimize dispense paths and key process parameters.
  • Familiarity with adhesive and bonding test methods, including viscosity and rheology, curing, shear and peel, cross-section analysis, temperature and humidity resistance, and aging tests, with problem-analysis and failure-localization capability.
  • Practical experience applying DOE, MSA, SPC, PFMEA, Control Plan, and 8D; knowledge of ISO 9001 and IATF 16949 quality-management systems.
  • Project-management, cross-functional coordination, and supplier-management capability, including independently developing solutions, conducting validation, preparing process documentation, and delivering production launches.
  • Proficiency in Microsoft Office for data analysis and report preparation.
  • Good written and verbal communication skills in both Chinese and English.

Responsibilities

  • Lead adhesive development and application, including requirement decomposition, raw material screening, formulation design, sample preparation, performance testing, failure analysis, formulation optimization, and transition to mass production.
  • Select or develop adhesive systems based on product structure, substrates, and application environment; evaluate viscosity, thixotropy, open time, curing conditions, bond strength, temperature and humidity resistance, aging, and reliability.
  • Lead dispensing-process development, including dispense-path design; define adhesive volume, bead width, and bead height; select needles or nozzles; optimize pressure, speed, temperature, and spacing; and establish a production-capable process window.
  • Evaluate, select, commission, accept, and continuously optimize dispensing equipment, adhesive-supply systems, valves, fixtures, and inspection solutions; resolve stringing, bubbles, interrupted flow, overflow, misalignment, clogging, and inadequate curing.
  • Develop material and process validation plans; apply DOE, MSA, SPC, and Cp/Cpk to evaluate process capability and establish data-driven technical conclusions and release criteria.
  • Participate in customer-requirement and product-drawing reviews; identify adhesive-application and dispensing-process risks; and assess materials, equipment, capacity, labor, tooling, and cost.
  • Lead new-project pilot runs and process validation, transitioning adhesives, dispensing equipment, and post-curing processes from prototype stage to stable mass production.
  • Prepare and maintain BOMs, routings, flow charts, work instructions, PFMEAs, and process-parameter specifications, and drive engineering changes.
  • Drive continuous improvement in yield, efficiency, material loss, and equipment stability to reduce adhesive consumption, scrap, and manufacturing cost.
  • Provide technical support for production, quality, and customer complaints; organize root-cause analysis; validate corrective actions; and standardize lessons learned.
  • Collaborate with R&D, suppliers, and cross-functional teams on the development, validation, and introduction of adhesive materials and dispensing technologies.
  • Participate in quality activities and customer audits; fulfill position-specific safety responsibilities concerning chemical use and storage, occupational health, and equipment-operation safety.
  • Monitor and drive factory implementation of adhesive technologies, dispensing equipment, related automation equipment, and new materials, technologies, and processes.

Desired Qualifications

  • Experience with electrically conductive elastomers.
  • Experience in precision dispensing, jet dispensing, or automated dispensing.
  • Experience with AutoCAD, SolidWorks, Minitab, JMP, or similar tools.

About the Company

Qnity

Publicly-traded provider of semiconductor materials

Qnity will be an independent, publicly traded electronics materials company spun off from DuPont, serving the semiconductor and electronics industries. It offers materials and solutions for chip manufacturing and high-speed data transmission, with brands such as Pyralux laminates for flexible circuits, Laird thermal interface materials, Kalrez sealants, and Circuposit copper for interconnects. As a standalone company, it aims to differentiate itself through focused strategies, scale (about 10,000 employees, roughly 40 manufacturing sites, and 20 labs) and a broad global reach to support AI, high-performance computing, and advanced connectivity. Its goal is to become a leading global provider of electronic materials across sectors like data centers, automotive, aerospace, consumer electronics, and healthcare.

Company size
11-50
Company stage
IPO
Headquarters
Wilmington, DE
Founded
2024

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