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Micron Technology

Makes memory and storage chips for AI and PCs

Memory System Architect New Grad - HBM Generative AI

Hardware Systems IntegrationConfirmed live in the last 24 hours
Full-timeIn-person

About the Job

Requirements

  • The candidate must have 0–2 years of relevant experience through research, internships, academic projects, publications, or industry experience in computer architecture, memory systems, AI hardware, or high-performance computing.
  • The candidate must have a Master's degree, PhD, or equivalent experience in Computer Architecture, Electrical Engineering, Computer Engineering, Computer Science, or a related technical field.
  • The candidate must have a strong understanding of GPU, TPU, AI accelerator, or large-scale computing architectures.
  • The candidate must know memory hierarchy concepts, including caches, HBM, DRAM, storage systems, and memory performance optimization.
  • The candidate must have experience with performance modeling, architectural simulation, system analysis, or related research methodologies.
  • The candidate must have programming experience in Python, C++, and/or AI computing frameworks such as CUDA, TensorFlow, or similar technologies.
  • The candidate must have strong analytical, problem-solving, communication, and collaboration skills.
  • The candidate must be familiar with AI-enabled tools and large language models such as Copilot, Claude, or similar technologies.

Responsibilities

  • Research and evaluate advanced memory architecture concepts for AI accelerators, including GPU, TPU, and emerging compute platforms.
  • Develop and analyze system-level models to assess performance, power, scalability, and efficiency across memory and compute architectures.
  • Investigate memory hierarchy optimizations involving HBM, DRAM, cache, storage, and interconnect technologies.
  • Evaluate architectural trade-offs and emerging technologies, including compute-near-memory concepts, to support future product development.
  • Collaborate with cross-functional teams to translate research findings into architecture recommendations and long-term technology roadmaps.

Desired Qualifications

  • Research experience in AI accelerators, computer architecture, memory systems, high-performance computing, or large-scale distributed systems.
  • Experience with compute-near-memory, processing-in-memory, or advanced memory architecture concepts.
  • Publications, conference presentations, patents, or demonstrated technical contributions in relevant research areas.
  • Familiarity with industry-standard memory technologies, interfaces, and protocols.
  • Experience developing architectural roadmaps, technology strategies, or long-term product planning recommendations.
  • Knowledge of rack-scale systems, AI infrastructure, networking, or large-scale training and inference environments.

About the Company

Micron Technology

Makes memory and storage chips for AI and PCs

Micron Technology designs and manufactures memory and storage chips, mainly DRAM and NAND flash, used in data centers, PCs, phones, cars and industrial equipment. It is one of only three companies that make HBM, the stacked high-bandwidth memory placed beside processors in AI servers, and it is the largest memory chipmaker based in the United States. Unlike chip designers that outsource production, Micron runs its own fabs and assembly sites in the United States and across Asia. It earns money by selling chips, memory modules and solid-state drives to cloud providers, device makers and distributors. Micron was founded in 1978 and is headquartered in Boise, Idaho.

Company size
10,001+
Company stage
IPO
Headquarters
Boise, ID
Founded
1978

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