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Micron Technology

Makes memory and storage chips for AI and PCs

HBM Design Architect New Grad

Silicon & ASIC DesignConfirmed live in the last 24 hours
Full-timeRichardson, TX, USANo salary listedIn-person

About the Job

Requirements

  • A BSEE or related field with 0–2 years of relevant experience, or an MS/PhD with 0–2+ years of experience.
  • A solid foundation in CMOS circuit design and device physics.
  • Working knowledge of DRAM fundamentals, including cell/array operation, sensing, and basic timing.
  • Understanding of power delivery and power analysis, including CV²f, leakage, and IR drop, and thermal concepts for semiconductor dies.
  • Hands-on experience with circuit simulation such as SPICE/HSPICE or FineSim, or equivalent, and Cadence Virtuoso or similar CAD environments.
  • Proficiency in Python, Tcl, Perl, or another scripting language.

Responsibilities

  • Perform architecture-level analysis for HBM/DRAM products, including dynamic and static power, PDN/IR drop, thermal behavior, timing, and area trade-offs.
  • Build first-principles models and contributor breakdowns for array, periphery, datapath, I/O, and TSV, and correlate them with simulation and silicon data.
  • Set up and run circuit simulations using SPICE/HSPICE, FineSim, PrimeSim, Spectre, or equivalent, and associated CAD flows, including schematic setup, parasitic extraction, and post-layout simulation, to validate architectural assumptions.
  • Assess the impact of new technologies on product metrics, including advanced DRAM nodes, 3D stacking, scaled-pitch hybrid bonding, and BEOL/TSV changes.
  • Partner with circuit designers, process technologists, and packaging engineers to develop and quantify architectural solutions.
  • Develop scripts, calculators, and automation using Python or equivalent, leveraging AI-assisted workflows such as LLMs, Code Assist, and agentic AI tools to accelerate modeling, simulation setup, and data analysis.
  • Communicate results in architecture reviews and cross-functional working groups.

Desired Qualifications

  • Coursework, research, or experience in DRAM/HBM design, TSV-based 3D integration, or advanced packaging.
  • Exposure to PDN/power analysis tools or thermal simulation, including compact thermal models and FEA/CFD.
  • Familiarity with semiconductor process technology, including FEOL/BEOL, interconnect materials, and bonding.
  • Experience using AI-enabled tools such as LLMs, AI assistants, Code Assist/Roo Code, or agentic AI solutions for engineering automation and analysis.
  • Ability to communicate technical trade-offs clearly to designers and technologists.

About the Company

Micron Technology

Makes memory and storage chips for AI and PCs

Micron Technology designs and manufactures memory and storage chips, mainly DRAM and NAND flash, used in data centers, PCs, phones, cars and industrial equipment. It is one of only three companies that make HBM, the stacked high-bandwidth memory placed beside processors in AI servers, and it is the largest memory chipmaker based in the United States. Unlike chip designers that outsource production, Micron runs its own fabs and assembly sites in the United States and across Asia. It earns money by selling chips, memory modules and solid-state drives to cloud providers, device makers and distributors. Micron was founded in 1978 and is headquartered in Boise, Idaho.

Company size
10,001+
Company stage
IPO
Headquarters
Boise, ID
Founded
1978

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