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ASM International

Semiconductor deposition equipment and ALD tech

Director – Technical - Advanced Packaging

Implementation & Technical Account ManagementConfirmed live in the last 24 hours
Full-timeIcheon-si, Gyeonggi-do, South KoreaNo salary listedIn-person

About the Job

Requirements

  • At least 15 years of experience in semiconductor capital equipment; experience working with the SK Hynix Process Development Team is preferred.
  • A specific focus on deposition systems in the semiconductor field is required.
  • Knowledge of thin-film and diffusion deposition systems is required.
  • A degree in an engineering discipline is preferred; a Master’s degree in Engineering or above is preferred, and a Ph.D. is preferred.
  • Ability to communicate with customer research and development, manufacturing, and purchasing stakeholders, with an understanding of technology and products.
  • Good internal communication and reporting skills in English are required.
  • Maintain an interest in new technology in semiconductor device manufacturing.
  • Demonstrate results orientation, decision-making, execution, business acumen, strategic thinking, analytical and problem-solving skills, and a customer-focused mindset.
  • Build strategic partnerships and ensure the organization understands and responds to business needs.
  • Communicate at all levels of the customer organization to deepen business relationships.
  • Demonstrate strategic thinking and operational excellence.
  • Coach and develop talent, and build a strong selling culture, organization, and support structure.
  • Understand the commercial landscape, including customers, brand owners, and competitors, and develop short-term commercial offers and long-term strategic alignment.
  • Use creative problem-solving, negotiation, and conflict-resolution skills.
  • Demonstrate integrity, business ethics, communication and presentation skills, leadership and motivation skills, and interpersonal and influencing skills.

Responsibilities

  • Manage the SK Hynix account globally for technology-related matters, focusing on advanced packaging applications within ASM’s product suite.
  • Build strong technical relationships with customers and related stakeholders.
  • Understand the customer’s advanced packaging roadmap and align product strengths and competitive insights with account strategy.
  • Monitor program progress and potential issues, and adjust strategies as needed.
  • Align with the business unit on progress and issues and develop follow-up plans.
  • Anticipate future advanced packaging needs and foster long-term innovation and customer partnerships.
  • Develop, maintain, and ensure the relevance of technical information for internal and external stakeholders.
  • Ensure communication channels, including telephone, email, and presentations, facilitate efficient and consistent customer follow-up.
  • Improve the customer experience through team, process, and support-tool development.
  • Build cross-functional and matrixed relationships and collaborate with Product Marketing, Product Development, Service Engineering, and other groups to support a positive customer experience.
  • Drive projects across multiple customer sites to secure business and build trust in ASM’s capabilities.
  • Coordinate management reviews and alignment.
  • Serve as a technical expert and leader to build customer trust.
  • Revitalize and motivate a successful sales and operational team.

Desired Qualifications

  • Experience working with the SK Hynix Process Development Team.
  • Advanced packaging development experience.
  • A Ph.D.

About the Company

ASM International

Semiconductor deposition equipment and ALD tech

ASM International designs and supplies equipment and technologies for semiconductor fabrication, focusing on thin-film deposition processes such as chemical vapor deposition (CVD) and atomic layer deposition (ALD). Its products are used in making microchips by depositing ultra-thin material layers with precise control at the atomic level, enabling smaller and more powerful devices. The company built a global footprint through operations in the Netherlands, the US, Hong Kong, and Japan, and separated ASML Lithography (a joint venture with Philips) to focus on deposition while ASML develops photolithography systems. In recent years, ASM has sharpened its strategy around ALD, a process that creates uniformly thin layers one atomic layer at a time, allowing continued scaling of semiconductor devices. The goal is to be a core supplier of deposition technology and tools that enable chip manufacturers to produce smaller, faster, and more energy-efficient semiconductors.

Company size
1,001-5,000
Company stage
IPO
Headquarters
Almere, Netherlands
Founded
1968

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