Yield / Integration Engineering
About the job
- B.E./B.Tech with 4-6 years or M.Sc./M.Tech. with 2-5 years of relevant experience in Electrical (Microelectronics)/ Electronics Engineering or Applied Physics
- A strong working knowledge of Statistical Process Control (SPC), Structured Problem Solving (SPS) skills and Failure Mode & Effect Analytical (FMEA) methods would be essential
- Good understanding of semiconductor process technology and devices
- Strong interpersonal skills and ability to work effectively within a globally matrixed team or environment
- Organized, proactive, excellent analytical skills, on-time delivery of work assigned, and good verbal and written communication
- Good knowledge of MS Office (Word, Excel and PowerPoint)
- Production Sustaining: Monitoring electrical performance tends, disposition of holds at electrical and sort test, support general/urgent fab operational issues, scrap investigation, analysis for process change review boards
- Candidate will drive yield enhancement for multiple products by analyzing failing electrical parameters and rapidly data mining to investigate root causes and containing excursions and protecting supply
- Develop and improve yield characterization and data analysis methodologies to rapidly determine yield limiters, correlation to in-line defectivity and metrology, and electrical parametric signals
- Support process module engineering activities through electrical test, inline metrology, and yield analysis to improve cost, cycle-time, and manufacturing robustness
- Clear reporting and communication of issues to home teams on a daily basis
- Must be flexible in job assignment and ready to work on weekend shifts on a rotational basis as required by the business
- Experience in high volume manufacturing preferably in semiconductors/ electronics industry in process module/ equipment (200mm/ 300mm) are strongly desired
- Scripting and coding skills (especially R and Python) are desirable
About the company
GlobalFoundries is a semiconductor foundry that manufactures chips for a broad range of customers, focusing on feature-rich, reliable technologies for cars, IoT, 5G, and other high-growth markets. It operates by fabricating silicon wafers for customer designs, offering mature, specialized processes rather than chasing the most advanced nodes. This makes it different from peers that prize the latest process nodes; GlobalFoundries emphasizes diversification across a global manufacturing footprint (U.S., Europe, Singapore) and stable supply for essential applications. Its goal is to be a leading supplier of high-volume, specialty manufacturing that enables reliable chips for everyday devices and growing tech markets.
Company Size
10,001+
Company Stage
IPO
Headquarters
Town of Malta, New York
Founded
2009
Get referred to GlobalFoundries
See people who can refer or advise you
Simplify's Take
What believers are saying
- Marvell expanded SiGe capacity on September 17, 2026, signaling demand through 2027.
- Commerce finalized a $375 million R&D award on September 8, 2026, plus a July $300 million framework.
- SMART Photonics partnered with GF on September 21, 2026, widening its photonics platform and customer funnel.
What critics are saying
- Smart mobile is 36% of revenue, and management expects low-teens decline in 2026.
- Tower Semiconductor litigation in Texas and the ITC risks injunctions, distraction, and patent retaliation.
- If AI photonics demand normalizes before 2027, GF's growth story reverts to commoditized mature-node fabs.
What makes GlobalFoundries unique
- GlobalFoundries abandoned bleeding-edge nodes in 2018, specializing in feature-rich chips for autos and connectivity.
- Its Malta, Burlington, Dresden, and Singapore footprint sells trusted regional supply to governments and enterprises.
- GF owns uncommon SiGe, silicon photonics, and FDX process depth for optical and edge chips.
Help us improve and share your feedback! Did you find this helpful?
Benefits
Professional Development Budget
Growth & Insights and Company News
6 month growth
↑ 0%1 year growth
↑ 0%2 year growth
↑ 0%Marvell Technology and GlobalFoundries expanded their partnership to boost production of silicon germanium (SiGe), a semiconductor technology used in high-speed optical connections for data centres. Following the announcement on 17 September, Marvell shares rose over 4% whilst GlobalFoundries climbed more than 6%. The multi-year agreement will increase SiGe manufacturing capacity at GlobalFoundries' Burlington, Vermont facility. The technology enables semiconductor devices to operate at higher speeds with reduced energy consumption. GlobalFoundries reported strong demand for SiGe, with CEO Tim Breen noting the company is "oversubscribed throughout 2027". The firm's communications infrastructure and data centre segment revenue jumped 62% year over year in Q2 2026. Marvell posted record revenue of $2.739 billion in Q2 fiscal 2027, up 37% year over year, driven by AI data centre demand.
Kepler Computing has raised $468 million from investors including GlobalFoundries, Intel Capital, AMD Ventures, and Bill Gates to develop memory chips that bypass expensive extreme ultraviolet lithography. The San Jose startup uses ferroelectric materials and 3D stacking to increase high-bandwidth memory and SRAM density whilst working with existing semiconductor fabs. The company claims it can convert a fab to next-generation capability in eight months versus the typical 24-month timeline. However, the technology faces contamination challenges because its composite material includes iron, requiring dedicated equipment or encapsulation. Kepler has been testing at GlobalFoundries facilities in Singapore and Vermont, producing chips on approximately 2,000 wafers. The US Department of Commerce committed up to $245 million in July to support domestic development. First HBM samples are planned for late 2025, with US production targeted for 2028.
Kepler Computing lands $245 million in CHIPS Act funding for ferroelectric RAM technology it claims can solve the AI-driven memory shortage with
GlobalFoundries and RAAAM Memory Technologies have announced a collaboration to develop Gain-Cell RAM (GCRAM) technology on GlobalFoundries' FDX platform. The partnership has achieved a significant milestone with the successful tape-out of a GCRAM test vehicle. The technology addresses growing on-chip memory demands for edge AI, automotive, and IoT devices. Using RAAAM's patented GCRAM, the companies achieved a 40% memory area reduction and up to 60% power savings compared to SRAM. The firms have jointly designed and taped out a GCRAM test chip. They plan to provide GCRAM design access to lead customers in early 2027. NXP Semiconductors is evaluating the solution. Victor Wang, vice president of front end innovation at NXP, noted the technology's potential for increasing on-chip memory capacities and improving system-level efficiency.
QuickLogic has released an enhanced embedded FPGA Hard IP for GlobalFoundries' 12LP process. The new offering includes a DSP Multiply-and-Accumulate unit with enhanced preadder, cascade connections, and SIMD functionality for applications such as phased array radar, electronic warfare, and satellite communications. The eFPGA fabric can now scale beyond 250,000 LUTs for designs requiring larger embedded programmable logic. An optional Configuration Bit Health Monitor detects and corrects errors induced by Single Event Upsets whilst the design is active. The technology enables programmable logic to be embedded directly within SoCs, allowing hardware functions and interfaces to be updated post-manufacturing. QuickLogic showcased the enhanced IP at the GlobalFoundries Technology Summit North America in Santa Clara, California, on 2 September 2026.