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ASM International

Semiconductor deposition equipment and ALD tech

Principal Engineer - Systems Engineering, Sensor & Laser Technologies

Electrical EngineeringPosted on Nov 9
Full-timePhoenix, AZ, USANo salary listedIn-person

About the Job

Requirements

  • Experience with laser-based measurement systems, laser heating technologies, and optical metrology systems.
  • Experience with pyrometry, thermal metrology, wafer alignment, laser triangulation, or optical positioning systems.
  • Knowledge of laser beam delivery, optical design, laser safety, and semiconductor thermal processing applications.
  • Experience integrating lasers and optical subsystems into semiconductor manufacturing equipment.
  • Demonstrated technical leadership of complex, multidisciplinary development programs.
  • Strong understanding of laser technologies and their application to process control, thermal management, temperature measurement, and wafer positioning.
  • Ability to connect laser-based measurements with process behavior and equipment performance.
  • Demonstrated experience developing innovative laser-enabled solutions that improve semiconductor manufacturing outcomes.
  • Strong experimental and analytical skills in optics, thermal systems, and precision metrology.
  • Ability to influence technical direction across multiple organizations without direct authority.
  • Proven track record of converting technology concepts into deployed product capabilities.

Responsibilities

  • Lead development and integration of laser-enabled technologies for semiconductor manufacturing equipment.
  • Define system architectures, performance requirements, interfaces, and validation strategies for laser heating, laser-assisted temperature measurement, wafer leveling, and wafer centering subsystems.
  • Evaluate and select laser sources, beam-delivery architectures, optical components, and metrology technologies for advanced process-control applications.
  • Drive development of laser-assisted pyrometry solutions to improve temperature measurement accuracy under varying emissivity and process conditions.
  • Develop laser-based solutions for wafer alignment, leveling, centering, and geometry measurement applications.
  • Lead proof-of-concept activities, technology demonstrations, and product qualification programs.
  • Support thermal characterization, process optimization, and advanced process-control initiatives through innovative laser technologies.
  • Identify emerging laser technologies and assess their applicability to future products.
  • Establish best practices for laser subsystem integration, characterization, reliability, safety, and performance validation.
  • Influence product roadmaps through strategic laser technology development and technical leadership.
  • Define system requirements and develop measurement and control solutions with Mechanical, Electrical, Firmware, Software, Process, Manufacturing, and Product Engineering teams.
  • Translate emerging technologies into differentiated product capabilities that support the technology roadmap.

Desired Qualifications

  • An MS or PhD in Optical Engineering, Physics, Mechanical Engineering, Electrical Engineering, Systems Engineering, or a related technical discipline.

About the Company

ASM International

Semiconductor deposition equipment and ALD tech

ASM International designs and supplies equipment and technologies for semiconductor fabrication, focusing on thin-film deposition processes such as chemical vapor deposition (CVD) and atomic layer deposition (ALD). Its products are used in making microchips by depositing ultra-thin material layers with precise control at the atomic level, enabling smaller and more powerful devices. The company built a global footprint through operations in the Netherlands, the US, Hong Kong, and Japan, and separated ASML Lithography (a joint venture with Philips) to focus on deposition while ASML develops photolithography systems. In recent years, ASM has sharpened its strategy around ALD, a process that creates uniformly thin layers one atomic layer at a time, allowing continued scaling of semiconductor devices. The goal is to be a core supplier of deposition technology and tools that enable chip manufacturers to produce smaller, faster, and more energy-efficient semiconductors.

Company size
1,001-5,000
Company stage
IPO
Headquarters
Almere, Netherlands
Founded
1968

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