Analog/Mixed Signal Design Engineer for High-Speed Optical Transceivers
NcodiN
Analog/Mixed Signal Design Engineer for High-Speed Optical Transceivers
NcodiN
Photonic interposers enabling ultra-fast optical links
About the Role
At NcodiN, we are redefining the future of AI computing. Our breakthrough optical interposer enables the next generation of AI system to scale beyond the copper wall. With the world’s smallest laser integrated on silicon, we eliminate traditional driver and modulator overhead and redefine system power and area efficiency. Joining NcodiN today means becoming part of a bold, fast-growing company backed by industry leaders.
We are seeking highly motivated and technically strong Analog/Mixed-Signal IC Design Engineers to join our high-speed optical transceiver development team. The position title and level will be determined based on the candidate's experience and qualifications. You will work closely with photonics, systems, packaging, and product engineering groups to architect, design, and productize cutting‑edge electro‑optical interconnects that enable Ncodin’s optical I/O platform.
This role is ideal for an engineer who thrives in fast‑moving startup environments, enjoys owning architecture‑to‑silicon execution, and wants to help build transformative optical interconnect technology.
Work sites
Santa Clara, CA, or Portland, OR. Hybrid or fully remote position will be considered
Responsibilities
Qualifications
NcodiN develops photonic interposers with integrated nanolasers to enable ultra-fast, energy-efficient die-to-die links for AI and advanced computing. Its NConnect approach swaps copper interconnects with light-on-silicon, using the world’s smallest laser and nanolasers that can run under 0.1 pJ/bit, alongside integrated nanodetectors and full optical links. The system is designed to be compatible with existing processor architectures and supported by an independent cleanroom for rapid prototyping. This makes NcodiN different from competitors by combining extremely low-energy optical links, on-chip lasers and detectors, and easy integration with current chips, plus a hands-on prototyping capability. The company’s goal is to scale energy-efficient AI-chip interconnects, enabling faster communications between dies and reducing power consumption, supported by its Seed funding round to grow the technology and bring optical interconnects closer to commercial use.
Explore more opportunities at NcodiN