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NcodiN

Photonic interposers enabling ultra-fast optical links

Analog/Mixed Signal Design Engineer for High-Speed Optical Transceivers

Silicon & ASIC DesignConfirmed live in the last 24 hours
Full-timeNo salary listed

About the Job

Requirements

  • A master's degree or Ph.D. in Electrical Engineering focused on high-speed analog/mixed-signal integrated circuits, radio-frequency integrated circuits, or electro-optical integrated circuits.
  • At least five years of industry experience for master's candidates or three years for Ph.D. candidates designing analog/mixed-signal, radio-frequency, or electro-optical integrated circuits.
  • Hands-on experience with industry-standard design and simulation tools such as Cadence Virtuoso/Spectre, Keysight ADS, and Ansys HFSS/Momentum.
  • Strong design expertise in at least two areas among laser drivers, transimpedance amplifiers, continuous-time linear equalizers, filters, low-noise amplifiers, and phase-locked loops.
  • A solid understanding of non-return-to-zero and pulse-amplitude modulation 4 schemes, link-budget analysis, and high-speed signaling concepts.
  • Proficiency with high-speed test and measurement equipment, including oscilloscopes, vector network analyzers, spectrum analyzers, bit-error-rate testers, and optical characterization instruments.

Responsibilities

  • Design, simulate, and model high-speed analog/mixed-signal circuits for optical transceiver front ends, including transimpedance amplifiers, continuous-time linear equalizers, drivers, phase-locked loops, process-voltage-temperature sensors, digital-to-analog and analog-to-digital converters, and bias circuits, in advanced CMOS or SiGe BiCMOS processes targeting multi-tens-of-gigahertz bandwidth and ultra-low-power operation.
  • Collaborate with photonics engineers to derive system-level and block-level specifications for electrical integrated circuits supporting high-speed electro-optical links.
  • Work with system architects to partition functions between analog, digital, and photonic domains.
  • Perform integrated-circuit floor-planning, provide layout guidance, and model parasitics for high-speed signal paths.
  • Model package parasitics and co-optimize electrical and optical performance for co-packaged optics or integrated optical engines.
  • Evaluate, characterize, and debug electrical and optical building blocks in laboratory environments using high-speed measurement equipment.
  • Support development of automated test setups for device- and system-level validations.
  • Work with manufacturing and product engineering teams on production testing, qualification, and reliability validation of electronic and photonic integrated circuit components.

Desired Qualifications

  • Experience designing circuits for SerDes, UCIe, or optical interconnects with bandwidths exceeding 10 to 30 GHz.
  • Experience characterizing and validating electronic and photonic integrated-circuit performance for high-speed optical transceivers.
  • Knowledge of advanced packaging technologies for optical engines, co-packaged optics, and heterogeneous integration.

About the Company

NcodiN

Photonic interposers enabling ultra-fast optical links

NcodiN develops photonic interposers with integrated nanolasers to enable ultra-fast, energy-efficient die-to-die links for AI and advanced computing. Its NConnect approach swaps copper interconnects with light-on-silicon, using the world’s smallest laser and nanolasers that can run under 0.1 pJ/bit, alongside integrated nanodetectors and full optical links. The system is designed to be compatible with existing processor architectures and supported by an independent cleanroom for rapid prototyping. This makes NcodiN different from competitors by combining extremely low-energy optical links, on-chip lasers and detectors, and easy integration with current chips, plus a hands-on prototyping capability. The company’s goal is to scale energy-efficient AI-chip interconnects, enabling faster communications between dies and reducing power consumption, supported by its Seed funding round to grow the technology and bring optical interconnects closer to commercial use.

Company size
11-50
Company stage
Seed
Total funding
$24M
Headquarters
Palaiseau, France
Founded
2023

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