Deposition & Etch Equipment and Production Engineer

The role

You join as a Tool Owner and hands-on production engineer on the deposition and etch scope: superconductor deposition, metal evaporation (including shadow-angle evaporation), and dry etching. These are the long-run tools the weekly output depends on — when a chamber goes down, the line feels it within a day.

You're accountable for a defined set of tools: their uptime, maintenance, utilization, and the qualified recipes that run on them at industrial cadence. For each tool, you form a binome with a Process Owner from Process Development Engineering — you own the asset and its execution, they own the recipe and its process window; you solve the hard problems and qualify operators together.

You're joining a team at its creation, reporting to the Cleanroom Operations Manager. You'll build the operation rather than inherit one.

Two Tool Owner positions are open in parallel — one on lithography, one on deposition and etching. If your experience spans both, apply to whichever fits best; the team will route you accordingly.

Responsabilities

• Working in Tandem with Process Development — Partner with a Process Development Process Owner on each tool: they own the recipe and process window, you own making it run reliably and at cadence in production.
• Your tools — Keep your process equipment running: uptime, maintenance, troubleshooting, spares, and acting on drift before it turns into scrap. Cross-train at least two qualified operators per tool so none depends on a single person.
• Process transfer and control — Take each process from R&D to production: freeze the recipe, define spec limits, write the SOP, qualify operators and tools. Build control plans with your Process Owner, run SPC monitoring, conduct process FMEAs, and apply change control on qualified recipes.
• The weekly load plan — Turn the wafer launch plan into a tool-level plan, level the load across technicians, and flag early when output and plan diverge.
• Execution at cadence and quality — Run qualified recipes on experimental and test wafers, stop and escalate out-of-spec steps, decide on affected wafers with Process Development, and keep full MES traceability.
• Documentation & training — Write and improve SOPs, and qualify and train technicians alongside your Process Owner counterpart.
• Continuous improvement — Remove bottlenecks, track KPIs, contribute to failure analysis, and use process data to propose and validate improvements with your Process Owner.
• Safety — Apply cleanroom and equipment safety rules, and contribute to risk assessments, including for unattended operation.

Requirements

• 3+ years hands-on in a semiconductor cleanroom, pilot line, or micro/nanofabrication facility, with direct equipment operation and maintenance experience (not just supervision)
• Experience with process control in production/pilot-line settings (SPC, control plans, FMEA, or R&D-to-production transfer)
• Preventive maintenance, troubleshooting, and supplier coordination on capital equipment
• Hands-on command of at least one of: UHV sputtering/deposition (cryo pumping, chamber/source maintenance), metal evaporation (ideally shadow-angle), or plasma etching (ICP-RIE, endpoint detection)
• Solid grounding in semiconductor unit processes and vacuum systems
• Comfortable with production/equipment data (MES, spreadsheets, basic statistical analysis)
• Experience building and reporting against a load plan under equipment, maintenance, and personnel constraints
• Experience writing SOPs and training others on them
• Strong ownership mindset, sound judgment to stop and escalate, and early, factual communication
• Willingness to train on and back up tools outside your core scope
• Master's or engineering degree in microelectronics, materials science, physics, or related field — or equivalent experience
• Fluent English; French not required (fab teams work in English)

Also valued — superconducting materials, Josephson junction or quantum device fabrication; thin film characterization (thickness, resistivity, uniformity); R&D or pilot-line environments where production and development share the same tools; commissioning or qualifying tools in a new facility.

Working conditions

On site in Aubervilliers, in cleanroom garment daily. Standard working hours — no shift work and no night work.

Recruitment process

1. Screening call with Alexandra, Talent Acquisition (30 min)
2. Interview with the Cleanroom Operations Manager (45 min)
3. Technical interview with the team (60 min)
4. Leadership and fit interview (60 min)