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Volantis Semiconductor

Designs photonic AI compute hardware

Photonics Packaging Engineer

Hardware Systems IntegrationConfirmed live in the last 24 hours
Full-timeNo salary listedHybrid

About the Job

Requirements

  • Experience with integrated photonics package assemblies involving multiple dies.
  • Experience with integrated circuit multi-chip module assemblies using multiple heterogeneous materials, including compound semiconductors.
  • Understanding of photonics concepts such as mode field diameters, mode mismatch, and polarization.

Responsibilities

  • Contribute to and own aspects of the A-0 and A-1 packages.

Desired Qualifications

  • Experience with large device-count photonic assemblies.
  • Experience with clear underfill.
  • Experience with high-density fiber attach.
  • Experience with large-substrate-size photonic multi-chip module assemblies.
  • Hands-on experience with photonic integrated circuit design.

About the Company

Volantis Semiconductor

Designs photonic AI compute hardware

Volantis Semiconductor designs photonic computing hardware for AI workloads, centered on the Volantis Photonic Motherboard. Its technology directly modulates low-cost VCSELs and densely parallel optical waveguides directly on the chip to replace electrical interconnects, enabling a chip-scale package with massive bandwidth and energy efficiency. This approach differs from traditional silicon photonics by wafer-scale integration and laser-based optics, focusing on scalable interconnect bandwidth and compute efficiency rather than simply adding more silicon cores. The company aims to deliver faster, cheaper AI compute with reduced energy use, with pre-orders expected in early 2026 as it engages early customers.

Company size
11-50
Company stage
Series A
Total funding
$97M
Headquarters
San Mateo, CA
Founded
2022

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