Full-Time
Process Engineer Lithography
Lithography
Posted on 8/22/2025
onsemi
10,001+ employees
Semiconductors for intelligent power and sensing
Compensation Overview
$98.7k - $133.2k/yr
Wappingers Falls, NY, USA
In Person
 Process Engineering |
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- Bachelor’s or Master’s degree in Chemical Engineering, Electrical Engineering, Mechanical Engineering, Material Science, Physics, or a related degree
- 2+ years of direct Lithography work experience in the semiconductor industry preferred
- Direct experience with ASML or TEL equipment and processes is preferred
- Fundamental understanding of semiconductor device physics
- Demonstrated ability to apply and practice SPC and DOE methodology
- Demonstrated experience with continuous fab improvement in yield, throughput, and cost reduction, preferably in a lean manufacturing environment
- Fundamental understanding of standard metrology, inspection, and failure analysis methods, and their applications
- Advanced data analysis skills
- Energetic, self-motivated, and results-oriented attitude with a strong attention to detail
- Approachable with an internal customer focus, integrity, and initiative
- Articulate written and verbal communication skills
- Demonstrated track record of being able to work well in a team environment, as well as the drive and desire to provide hands-on support for the site’s operators, technicians, and engineers when needed
- Understand and optimize processes and procedures in the Lithography area
- Plan and execute experiments for new technologies and processes
- Drive activities such as yield and reliability improvements, throughput optimization, cost reduction, and safety improvements
- Perform advanced data analysis
- Understand and apply SPC principles to establish and sustain robust processes
- Respond in an appropriate and timely manner to out-of-control process conditions
- Manage the disposition of non-conforming material
- Prioritize production support and other responsibilities
- Generate written process instruction specifications
- Communicate established processing procedures with production operators and process technicians
- Contribute to factory operational efficiency by supporting operators, technicians, and engineers
- 2+ years of direct Lithography work experience in the semiconductor industry preferred
- Direct experience with ASML or TEL equipment and processes is preferred
onsemi designs and manufactures semiconductors with a focus on intelligent power and sensing technologies for automotive and industrial use. Its products include power management ICs and sensors that regulate energy and provide precise control signals for systems like EVs, ADAS, factory automation, robotics, and energy infrastructure. These chips work by efficiently handling electrical power, converting energy, and delivering sensing data and control outputs that enable safer, more capable machines. The company differentiates itself by specializing in intelligent power and sensing across both automotive and industrial markets and selling through direct OEM partnerships plus a global distributor network to support scalable deployment with energy efficiency at the core of its offerings.
Company Size
10,001+
Company Stage
IPO
Headquarters
Scottsdale, Arizona
Founded
1999
Simplify's Take
What believers are saying
- AI infrastructure business expected to grow high-teen percentages through 2026.
- Gross margins expanding for third consecutive quarter, reaching 38.5% in Q1.
- Automotive demand stabilizing signals cyclical trough behind company, supporting recovery.
What critics are saying
- U.S. export restrictions block onsemi's 900V SiC supply to Chinese OEMs.
- Inventory days rose to 200, signaling customer destocking in automotive segment.
- STMicroelectronics' new Geneva fab undercuts onsemi pricing in 900V EV market.
What makes onsemi unique
- EliteSiC M3e technology enables 900V EV architectures with superior switching efficiency.
- AI data center revenue surged 100% YoY, reaching $250M in 2025.
- Expanded Nio partnership secures long-term demand for advanced SiC chips.
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Benefits
Health Insurance
Dental Insurance
Vision Insurance
Life Insurance
Disability Insurance
Health Savings Account/Flexible Spending Account
Paid Vacation
Paid Sick Leave
Paid Holidays
401(k) Retirement Plan
401(k) Company Match
Growth & Insights and Company News
6 month growth
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↑ 0%Czech chip designer Codasip is being acquired by semiconductor manufacturer Onsemi in a deal that will see the company split into two parts. Onsemi will acquire Codasip's energy-efficient processor design division, which focuses on RISC-V technology, an open alternative to ARM architecture. The acquisition is considered strategic for Onsemi, which manufactures chips for automotive and industrial applications. The deal will add several dozen specialised engineers to Onsemi's existing Czech team, with plans to hire over 100 additional experts in the near future. Onsemi will also gain Codasip Studio software for chip design. The remaining part of Codasip will operate independently under CEO Ron Black, focusing on chip security using Cheri technology. Codasip employs approximately 250 people and generates annual revenues of around CZK 2 billion.
Onsemi has surged 30.7% to $66.51 per share since October 2025, outpacing the S&P 500's 2.1% decline during the same period. Despite this momentum, analysts remain cautious about the semiconductor company's prospects. The firm's revenue grew at just 2.7% compounded annually over the past five years, below industry benchmarks. Wall Street forecasts predict 5% revenue growth over the next 12 months, still below sector averages. Profitability concerns also weigh on the stock. Onsemi's operating margin decreased by 17.7 percentage points over five years, falling to 1.4% for the trailing 12 months. The decline raises questions about expense management despite revenue growth. Trading at 21.8× forward P/E, onsemi's valuation appears reasonable, but analysts suggest better opportunities exist elsewhere in the market.
Fifteen tracked analog semiconductors stocks reported satisfactory Q4 results, with revenues beating consensus estimates by 0.7% and next quarter guidance above expectations. However, share prices have declined 4.7% on average since the latest earnings. Onsemi reported revenues of $1.53 billion, down 11.2% year on year, meeting analysts' expectations. The company's next quarter revenue guidance slightly missed expectations. The stock has fallen 2.6% since reporting and trades at $63.40. Skyworks Solutions posted the strongest results amongst peers, with revenues of $1.04 billion, down 3.1% year on year but beating estimates by 3.4%. Despite outperforming on earnings per share and adjusted operating income, the stock declined 1.7% following the announcement and trades at $55. Analog chip demand remains linked to overall economic growth.
Onsemi has secured a design win with Sineng Electric to power its 430 kW liquid-cooled energy storage systems and 320 kW utility-scale solar inverter. The deal will feature onsemi's latest-generation hybrid power integrated module combining FS7 insulated-gate bipolar transistor and EliteSiC technology. The technology delivers improved efficiency and higher power density, enabling Sineng's systems to increase power output by 32% within the same footprint. In benchmark testing, onsemi's module achieved a 0.07% efficiency improvement and reduced losses by 225 W in a 320 kW solar inverter configuration. The collaboration aims to deliver high-performance solutions for renewable energy and AI infrastructure markets. Onsemi's F5BP package modules reduce power dissipation by up to 8% and switching losses by 10% compared to previous generations.
Infineon and Subaru partner on next-generation ADAS safety and real-time vehicle control. Published: 3.18.2026. Key takeaways. * Infineon and Subaru are collaborating on an automotive MCU for an integrated ECU in future Subaru vehicles. * Subaru plans to use Infineon's AURIX TC4x in an ECU coordinating next-generation EyeSight, vehicle motion control, and AWD control. * Infineon says the MCU will help deliver faster, more reliable processing of data from camera, radar, and other sensors shifting toward centralized, safety-critical compute in ADAS and software-defined vehicles. Infineon and Subaru are deepening their collaboration on automotive safety, with a new design partnership centered on the microcontroller that will help power future Subaru ADAS and vehicle motion control. According to the two companies, the effort focuses on an automotive MCU that will be installed in an integrated electronic control unit coordinating next-generation EyeSight and vehicle motion functions in future Subaru vehicles. Subaru said it has been working with Infineon from the early development stage of the AURIX TC4x to optimize the chip's design specifications. The automaker plans to use the MCU in an integrated ECU that coordinates next-generation EyeSight, vehicle motion control, and all-wheel drive control. This architecture is intended to further evolve ADAS and vehicle dynamics control while improving the fundamentals of "driving, turning, and stopping." The AURIX TC4x is positioned as the main controller for next-generation ADAS functions inside that ECU. The company said the MCU enables real-time sensor data fusion, decision-making, and control using inputs from camera, radar, and other sensors, helping deliver faster and more reliable driver assistance functions. Infineon also said the TC4x combines up to six cores at 500 MHz in lockstep operation and supports automotive functional safety up to ASIL-D as safety-oriented compute increasingly required in modern vehicles. The announcement also fits Subaru's broader push to modernize its vehicle electronics, developing its new E/E architecture that can be shared across battery electric vehicles, gasoline vehicles, and hybrid vehicles, while aiming for "ultra-low latency and low power consumption" in vehicle-control computation. Automakers are increasingly focused on how quickly and reliably a vehicle can process sensor inputs and translate them into safe control actions across braking, steering, stability, and traction-related systems. This collaboration with Infineon also appears to be part of Subaru's broader next-generation EyeSight roadmap. In 2024, Subaru announced a separate collaboration with AMD to design an SoC that integrates stereo-camera recognition processing with AI inference for future EyeSight systems. Later that year, Subaru also announced a collaboration with onsemi on optimized image sensors for next-generation EyeSight. Taken together, these moves suggest Subaru is building a more integrated ADAS stack spanning perception, AI inference, and real-time vehicle control. The trend points to rising importance for automotive-grade MCUs that combine functional safety, real-time performance, cybersecurity, and strong in-vehicle networking support. Subaru has publicly tied its technology roadmap to a goal of zero fatal road accidents in 2030, and its official safety materials show the company is using fatal-accident analysis to guide future development priorities. In that context, tighter integration between ADAS and vehicle motion control is not just a feature upgrade, reflecting a broader push to reduce latency, improve system-level reliability, and strengthen the vehicle's ability to respond correctly in real-world driving conditions. Stay up to date Read industry news, product offers, and events. Join email list