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Micron Technology

Makes memory and storage chips for AI and PCs

Material Engineer - Advanced Packaging Technology Development

Manufacturing EngineeringConfirmed live in the last 24 hours
Full-timeTaichung City, TaiwanNo salary listedIn-person

About the Job

Responsibilities

  • Identify, diagnose, and resolve assembly material-related problems.
  • Coordinate and execute process, equipment, and material evaluation and optimization initiatives, and implement changes at the process step.
  • Lead or participate in continuous yield-improvement and cost-reduction activities.
  • Validate and fan out newly qualified materials, including new processes and/or tools for new product introduction.
  • Support SPC, FDC, RMS, and APC.
  • Support site-to-site portability.
  • Manage and audit material suppliers to achieve quality, cost, and risk-management objectives.
  • Support internal and external audits.

About the Company

Micron Technology

Makes memory and storage chips for AI and PCs

Micron Technology designs and manufactures memory and storage chips, mainly DRAM and NAND flash, used in data centers, PCs, phones, cars and industrial equipment. It is one of only three companies that make HBM, the stacked high-bandwidth memory placed beside processors in AI servers, and it is the largest memory chipmaker based in the United States. Unlike chip designers that outsource production, Micron runs its own fabs and assembly sites in the United States and across Asia. It earns money by selling chips, memory modules and solid-state drives to cloud providers, device makers and distributors. Micron was founded in 1978 and is headquartered in Boise, Idaho.

Company size
10,001+
Company stage
IPO
Headquarters
Boise, ID
Founded
1978

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