Principal Package Competence Engineer

At Nexperia, innovation starts with deep technical expertise. As a Principal Package Competence Engineer, you will play a key role in advancing semiconductor packaging technologies that enhance the performance, reliability, and competitiveness of our Power MOSFET portfolio. You will act as a subject matter expert, providing technical leadership across package development, assembly technologies, industrialization activities, and strategic technology initiatives.

Working closely with product lines, assembly sites, and R&D teams, you will lead the development of new package solutions, evaluate emerging technologies, and help shape Nexperia's future packaging roadmap.

What you will do

• Lead package design studies and development activities for new and existing semiconductor products
• Serve as a recognized expert in semiconductor packaging and assembly technologies
• Evaluate emerging package and process technologies to maintain technology leadership and competitive advantage
• Support the validation of new package concepts through simulation and technical studies
• Contribute to package strategy development and long-term technology roadmaps
• Act as a key technical interface between Business Groups and assembly manufacturing sites
• Provide expert support on package development, assembly processes, and industrialization activities
• Lead technical projects related to package development, qualification, and process freeze activities
• Mentor and develop junior engineers while promoting knowledge sharing across the organization
• Generate innovative package concepts and contribute to patentable ideas and future technology developments
• Lead high-profile technical initiatives aligned with strategic business objectives

What you will need

• PhD with 5+ years of industry experience, or Bachelor's/Master's degree with 8+ years of relevant semiconductor experience
• Extensive experience in semiconductor packaging and assembly technologies
• Experience in power semiconductor technologies and applications
• Proven track record of package innovation, technology development, or patent generation
• Experience supporting global manufacturing and assembly organizations
• Customer-facing experience and participation in technical discussions with external stakeholders
• Strong understanding of semiconductor package materials, assembly processes, and reliability requirements
• Experience with failure analysis, reliability testing, and root-cause investigations
• Expertise in design of experiments (DOE), data analysis, and technical problem solving
• Experience using advanced package design and simulation tools
• Strong technical documentation and technical presentation skills
• Ability to lead technical teams and influence stakeholders across multiple functions

Why work for us?

Remuneration & Reward – Competitive base salary, Annual Incentive Plan, excellent contributory pension scheme, recognition rewards scheme, income protection, 12 x salary life assurance, visa sponsorship and relocation assistance where applicable.

Health & Wellbeing – Hybrid working policy, 33 days annual leave including bank holidays, flexible benefits scheme, enhanced sick pay, on-site medical centre, subsidised canteen, employee assistance programme, retail and entertainment reductions and a variety of sports and social clubs.

Professional Development – Possibility for funded academic support up to PhD level, employee goal setting and development plans, huge growth potential both internally and globally within the business, opportunity to contribute and work with cutting edge technologies.

Corporate Social Responsibility & Sustainability – A global commitment to becoming carbon neutral by 2035, working with suppliers who embrace and comply with the Nexperia Supplier Code of Conduct, paid time off for every employee to support charitable work.

Diversity, Equity, and Inclusion – Corporate members of Neurodiversity in Business, Disability Confident Employer, dedicated Employee Resource Groups for Women and Neuroinclusion, commitment to increase women in management positions to 30% by 2030.