PMTS Application Engineering
About the job
- A Bachelor of Science in Electrical Engineering is required; a Master of Science in Electrical Engineering is preferred.
- At least 7 years of relevant experience in system-on-chip or application-specific integrated circuit design and architecture.
- Good understanding of reduced instruction set computer and digital signal processor architectures.
- Good communication and presentation skills, and experience working with customers in a pre-sales process.
- Willingness to travel up to 30% within Japan.
- Act as the primary technical interface for customers during pre-sales and early development phases.
- Support customer engineering teams in evaluating and adopting MIPS solutions.
- Provide hands-on technical guidance on processor intellectual property integration, software toolchains, development environments, and system architecture considerations.
- Support technical discussions to secure project and design wins for processor intellectual property licenses, software tools, and custom silicon programs and solutions; assist customers in transitioning from evaluation to design execution.
- Troubleshoot and resolve customer technical issues across hardware and software domains during pre-sales engagements.
- Work closely with internal engineering teams to address and resolve complex challenges during pre-sales engagements, ensuring timely resolution of customer issues.
- Partner with Business Development to support opportunity creation through closure.
- Provide technical input to evaluations, proposals, requests for information, and customer presentations.
- Translate customer requirements into actionable feedback for product and engineering teams.
- Support engagement with ecosystem partners in software, electronic design automation, and design services.
- Participate in customer workshops, demonstrations, and industry events.
- Help position MIPS solutions within the broader semiconductor ecosystem in Japan.
- Experience in multiple stages of a system-on-chip design, from architecture definition through register-transfer-level coding in Verilog and synthesis to physical design.
- Hands-on experience in embedded system design, debugging, or firmware/software development.
- Understanding of digital signal processing algorithms for wireless communication, LiDAR/radar, image processing, and advanced sensors.
- Understanding of artificial intelligence/machine learning-based system design and use-case requirements.
- Understanding of system-on-chip design requirements for automotive functional safety.
- Understanding of security concepts and standards-based building blocks for secure system-on-chip design.
- Good written and verbal communication skills and the ability to break down complex problems into manageable tasks.
- Ability to clearly communicate technical information in meetings, presentations, seminars, product demonstrations, and customer training, and to provide guidance to the sales team.
About the company
GlobalFoundries is a semiconductor foundry that manufactures chips for a broad range of customers, focusing on feature-rich, reliable technologies for cars, IoT, 5G, and other high-growth markets. It operates by fabricating silicon wafers for customer designs, offering mature, specialized processes rather than chasing the most advanced nodes. This makes it different from peers that prize the latest process nodes; GlobalFoundries emphasizes diversification across a global manufacturing footprint (U.S., Europe, Singapore) and stable supply for essential applications. Its goal is to be a leading supplier of high-volume, specialty manufacturing that enables reliable chips for everyday devices and growing tech markets.
Company Size
10,001+
Company Stage
IPO
Headquarters
Town of Malta, New York
Founded
2009
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Simplify's Take
What believers are saying
- Marvell expanded SiGe capacity on September 17, 2026, signaling demand through 2027.
- Commerce finalized a $375 million R&D award on September 8, 2026, plus a July $300 million framework.
- SMART Photonics partnered with GF on September 21, 2026, widening its photonics platform and customer funnel.
What critics are saying
- Smart mobile is 36% of revenue, and management expects low-teens decline in 2026.
- Tower Semiconductor litigation in Texas and the ITC risks injunctions, distraction, and patent retaliation.
- If AI photonics demand normalizes before 2027, GF's growth story reverts to commoditized mature-node fabs.
What makes GlobalFoundries unique
- GlobalFoundries abandoned bleeding-edge nodes in 2018, specializing in feature-rich chips for autos and connectivity.
- Its Malta, Burlington, Dresden, and Singapore footprint sells trusted regional supply to governments and enterprises.
- GF owns uncommon SiGe, silicon photonics, and FDX process depth for optical and edge chips.
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Benefits
Professional Development Budget
Growth & Insights and Company News
6 month growth
0%1 year growth
0%2 year growth
0%GF has been selected as the technology provider and operator for two new fabs at its Malta, New York, site under a U.S.-Japan initiative.
GlobalFoundries will build two new chip factories at its existing site in upstate New York, according to a deal announced on October 14. Japan's government will provide up to $21 billion in funding. The US government will buy about 4% of the company's shares. The two plants will be jointly held by the US and Japan. The new factories will make basic chips, reducing reliance on suppliers in East Asia.
GlobalFoundries Inc. plans to build two new chip plants with backing of as much as $21 billion from the Japanese government. The arrangement is part of a US-Japan deal that also includes the US taking a 4% stake in the company.
GlobalFoundries shares rose nearly 6% Thursday after announcing a $2 billion manufacturing deal with Taiwan Semiconductor Manufacturing Company to produce silicon interposers at its New York facility. The five-year agreement will support expanded manufacturing capacity, with volume production expected to begin in the first half of 2028. The facility is set to become the first US-based source of silicon interposers for advanced packaging technologies. These components are crucial for TSMC's Chip-on-Wafer-on-Substrate technology, which connects AI processors with high-bandwidth memory. The deal addresses constraints in TSMC's CoWoS packaging capacity, which has become a bottleneck for AI chip production. Counterpoint Research estimates the supply-demand gap could remain around 20% in 2026 before narrowing to roughly 10% in 2027.
Marvell Technology and GlobalFoundries expanded their partnership to boost production of silicon germanium (SiGe), a semiconductor technology used in high-speed optical connections for data centres. Following the announcement on 17 September, Marvell shares rose over 4% whilst GlobalFoundries climbed more than 6%. The multi-year agreement will increase SiGe manufacturing capacity at GlobalFoundries' Burlington, Vermont facility. The technology enables semiconductor devices to operate at higher speeds with reduced energy consumption. GlobalFoundries reported strong demand for SiGe, with CEO Tim Breen noting the company is "oversubscribed throughout 2027". The firm's communications infrastructure and data centre segment revenue jumped 62% year over year in Q2 2026. Marvell posted record revenue of $2.739 billion in Q2 fiscal 2027, up 37% year over year, driven by AI data centre demand.