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Micron Technology

Makes memory and storage chips for AI and PCs

Mechanical/Thermal Principal Design Engineer

Thermal & Fluids EngineeringConfirmed live in the last 24 hours
Full-timeBoise, ID, USANo salary listedIn-person

About the Job

Requirements

  • A Bachelor's or Master's degree or equivalent experience in Mechanical Engineering, with 7+ years of mechanical and thermal engineering experience, including 7+ years in the electronics, storage, or semiconductor industry.
  • A proven track record of architecting, developing, and delivering mechanical and thermal solutions for product development and customer applications.
  • Strong expertise in SolidWorks, thermal modeling, and computational fluid dynamics simulation tools such as ANSYS Icepak, Fluent, or similar platforms, including AI-enabled design and validation workflows.
  • Hands-on experience with thermal management technologies, including heatsinks, thermal interface materials, vapor chambers, heat pipes, and liquid cooling solutions, as well as thermal and mechanical testing, validation, and failure analysis.
  • Deep understanding of mechanical design principles, heat transfer, fluid dynamics, geometric dimensioning and tolerancing, tolerance analysis, design for manufacturing and assembly, product qualification methodologies, and demonstrated technical leadership across multifunctional teams.

Responsibilities

  • Design, develop, test, validate, and release mechanical and thermal solutions for advanced electronic systems, modules, and emerging memory technologies.
  • Develop innovative cooling solutions, including heat spreaders, heatsinks, vapor chambers, heat pipes, and liquid cooling technologies.
  • Define mechanical, thermal, reliability, and manufacturability requirements to meet product performance, quality, and customer objectives.
  • Perform and lead thermal computational fluid dynamics and mechanical finite element analysis to optimize product performance, reliability, cost, and design efficiency.
  • Develop and implement validation strategies, including thermal characterization, shock and vibration testing, thermal cycling, humidity testing, design failure mode and effects analysis, derating analysis, and reliability assessments.
  • Drive design reviews, risk assessments, root cause investigations, and corrective actions throughout the product lifecycle.
  • Collaborate with electrical, package, printed circuit board, system, manufacturing, and reliability teams to deliver optimized and manufacturable solutions while contributing to JEDEC and industry standards development.
  • Mentor engineers, establish engineering guidelines, serve as the mechanical and thermal domain expert across multiple programs, and champion AI-enabled engineering workflows to enhance simulation, design optimization, validation, and productivity.
  • Perform design and development engineering assignments related to hardware products and systems, including development of new products or updates to existing products. Work may encompass electronic design, mechanical design, or other related engineering fields.
  • Research, evaluate, develop, and apply new processes and methods to products.
  • Establish and conduct testing routines; develop or implement project plans, budgets, and schedules; and document work and results.

Desired Qualifications

  • Experience with DDR, LPDDR, PCIe, HBM, memory modules, storage subsystems, and AI accelerator platforms.
  • A solid understanding of JEDEC standards and data center/server hardware architectures.
  • Expertise in advanced thermal and cooling technologies for AI and high-performance computing environments.
  • Familiarity with finite element analysis, mechanical reliability modeling, and product performance optimization.
  • Ability to collaborate with global suppliers and manufacturing partners, demonstrated by a history of innovation through patents, publications, or significant technical contributions.

About the Company

Micron Technology

Makes memory and storage chips for AI and PCs

Micron Technology designs and manufactures memory and storage chips, mainly DRAM and NAND flash, used in data centers, PCs, phones, cars and industrial equipment. It is one of only three companies that make HBM, the stacked high-bandwidth memory placed beside processors in AI servers, and it is the largest memory chipmaker based in the United States. Unlike chip designers that outsource production, Micron runs its own fabs and assembly sites in the United States and across Asia. It earns money by selling chips, memory modules and solid-state drives to cloud providers, device makers and distributors. Micron was founded in 1978 and is headquartered in Boise, Idaho.

Company size
10,001+
Company stage
IPO
Headquarters
Boise, ID
Founded
1978

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