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ASM International

Semiconductor deposition equipment and ALD tech

Senior Engineer, Field Process

Process EngineeringConfirmed live in the last 24 hours
Full-timeNo salary listed

About the Job

Requirements

  • An MS degree and 4 years of experience, or a PhD and 0 years of experience, in materials science, chemical engineering, or physics.
  • Experience processing, developing, or characterizing thin films in thermal atomic layer deposition (ALD), plasma ALD, plasma chemical vapor deposition (CVD), epitaxy, or low-pressure CVD (LPCVD) reactors.
  • Strong troubleshooting and structured problem-analysis skills using methods such as KT, failure mode and effects analysis (FMEA), Ishikawa, or 7-step problem-solving.
  • Experience designing, running, and interpreting design of experiments (DOEs) and statistical experiments.
  • Familiarity with semiconductor device applications, vacuum techniques, metrology, and thin-film characterization.
  • Ability to travel as needed for training and customer engagement, and flexibility to support extended hours or weekends during qualifications or escalations.
  • Strong verbal and written communication skills and the ability to explain complex concepts clearly.
  • Ability to maintain confidentiality and uphold intellectual property boundaries.
  • Willingness to work on-site at customer locations in Austin, Texas, train for 6–9 months in Hillsboro, Oregon, and travel as needed.

Responsibilities

  • Support New Product Introduction (NPI) by training with the Business Unit to gain expertise in new deposition processes and hardware.
  • Lead the introduction and transfer of new processes to the customer site.
  • Partner with field hardware engineers and Business Unit teams to troubleshoot new products and develop proposals for process or hardware improvements.
  • Design and execute on-site experiments with the customer, driving development, integration, and continuous-improvement projects.
  • Escalate issues in a timely manner to maintain project scope, timelines, and customer alignment.
  • Document key learnings during NPI and ensure effective knowledge transfer to local service and manufacturing teams.
  • Analyze baseline system and process performance to identify gaps relative to technology-node requirements.
  • Perform structured problem-solving and root-cause analysis on process or system nonconformances.
  • Collaborate with customer teams to identify and grow opportunities for ASM hardware and process adoption.
  • Support process transfer to high-volume manufacturing (HVM) fabs, creating and sharing best-known methods (BKMs) and documentation.
  • Maintain discipline in intellectual property boundaries, customer communication, and escalation leadership.
  • After a 6–9 month training assignment in Hillsboro, Oregon, relocate to Austin, Texas to support the startup of a new fab.
  • Provide expert-level tool support, drive startup readiness, lead structured problem-solving efforts, coordinate escalations, and mentor newer engineers.
  • Build trusted customer relationships, establish technical and operational standards, and help scale the new operation.

Desired Qualifications

  • Experience with ASM ALD, plasma-enhanced ALD (PEALD), plasma-enhanced CVD (PECVD), epitaxy, or vertical-furnace LPCVD equipment.
  • Demonstrated success optimizing deposition processes in development or high-volume manufacturing environments.
  • Experience leading customer-facing technical discussions or escalations.
  • Background in transferring processes into high-volume manufacturing and supporting local service teams.
  • Experience coordinating cross-functional action plans during escalations.

About the Company

ASM International

Semiconductor deposition equipment and ALD tech

ASM International designs and supplies equipment and technologies for semiconductor fabrication, focusing on thin-film deposition processes such as chemical vapor deposition (CVD) and atomic layer deposition (ALD). Its products are used in making microchips by depositing ultra-thin material layers with precise control at the atomic level, enabling smaller and more powerful devices. The company built a global footprint through operations in the Netherlands, the US, Hong Kong, and Japan, and separated ASML Lithography (a joint venture with Philips) to focus on deposition while ASML develops photolithography systems. In recent years, ASM has sharpened its strategy around ALD, a process that creates uniformly thin layers one atomic layer at a time, allowing continued scaling of semiconductor devices. The goal is to be a core supplier of deposition technology and tools that enable chip manufacturers to produce smaller, faster, and more energy-efficient semiconductors.

Company size
1,001-5,000
Company stage
IPO
Headquarters
Almere, Netherlands
Founded
1968

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