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Renesas Electronics

Automotive-focused MCUs, SoCs, analog devices

Principal Engineer, GaN Device Engineer

Silicon & ASIC DesignConfirmed live in the last 24 hours
Full-timeZhubei City, TaiwanNo salary listed

About the Job

Requirements

  • A Ph.D. or an M.S. in Electrical Engineering or a related field, with 10 or more years of semiconductor device research and development experience focused primarily on GaN technology.
  • Hands-on experience with characterization techniques and trap analysis, including pulsed current-voltage measurements (gate-lag and drain-lag), transient drain current, and metal-oxide-semiconductor interface trap analysis.
  • Technical leadership experience and ability to work effectively across multidisciplinary teams.
  • Fluency in both English and Chinese.
  • Ability to travel for business.

Responsibilities

  • Drive technical understanding of GaN device physics, charge trapping mechanisms, and device reliability behavior.
  • Define and evaluate new device architectures to improve performance, robustness, and competitive differentiation.
  • Provide technical leadership in advanced device characterization, data analysis, and root-cause investigation to improve performance, yield, and reliability.
  • Collaborate with cross-functional teams to guide technology development and accelerate commercialization of GaN products.

Desired Qualifications

  • Experience with TCAD simulation tools such as Sentaurus or Silvaco.
  • Knowledge of reliability failure models and degradation mechanisms.
  • Familiarity with the AEC-Q101 standard.

About the Company

Renesas Electronics

Automotive-focused MCUs, SoCs, analog devices

Renesas manufactures and sells MCUs, SoCs, and analog/power semiconductor devices to OEMs, focusing on automotive, industrial, infrastructure, and IoT markets. Its chips are building blocks that run embedded software and manage power and signals, and its Winning Combinations offer pre-tested system architectures to speed up design. It differentiates itself by growing through acquisitions to offer a broad, integrated portfolio and by moving toward a unified digital design platform to reduce integration work. Its goal is to become a leading supplier of these components and provide a single platform for electronics design that speeds time-to-market.

Company size
10,001+
Company stage
IPO
Headquarters
Tokyo, Japan
Founded
2002

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