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Micron Technology

Makes memory and storage chips for AI and PCs

Development Quality Engineer - DRAM Design Development Quality

Quality EngineeringConfirmed live in the last 24 hours
Full-timeTaichung City, TaiwanNo salary listedIn-person

About the Job

Requirements

  • Knowledge of CMOS logic, digital logic, and VLSI design.
  • Knowledge of DRAM architecture and functioning.
  • Experience with semiconductor device physics.
  • Experience with reliability items for CMOS and array.
  • Strong facilitation skills and the ability to clearly communicate complex topics.
  • Project management, multitasking, and analytical skills.
  • Ability to deliver and communicate data and findings.
  • Master's or higher degree in Electrical or Electronics Engineering with at least 2 years of experience.

Responsibilities

  • Work with development partners in Design, Product Engineering, Technology Development, Quality Assurance, and Manufacturing to identify and mitigate potential quality and reliability issues during the design and pre-qualification phase of new products.
  • Identify design-specific risks for new High Performance Memory products and collaborate with Design, Product Engineering, Technology Development, and Quality Assurance teams to ensure verification, validation, and detection specifications provide visibility into mitigation progress and success.
  • Drive deep-dive problem solving and mitigation/resolution alignment across the portfolio for DRAM-related quality and reliability issues.
  • Act as the subject matter expert on design-related quality and Live Die reliability issues and advise Global Quality leadership on risk and mitigation strategies.
  • Partner with Design, Product Engineering, and Quality Assurance to align and recommend changes to verification and validation flows to meet quality and reliability needs.
  • Represent Quality Assurance in Customer Usage Model and Design Review forums to provide current model feedback for design success.
  • Assess feedback from critical customer issues requiring development solutions and monitor mitigation effectiveness to ensure affected and future products are sufficiently de-risked.
  • Drive validation of CMOS reliability specifications on Live Die and identify gaps and initiatives to build margins around structural, electrical, quality, and reliability performance.
  • Partner with Quality and Product Engineering teams to define and perform failure analysis through wafer- and component-level circuit and device characterization, detailed DRAM analysis, and improvements to operation, testability, end-user performance, and reliability.
  • Maintain effective communication between Design, Technology Development, Product Engineering, Manufacturing, and Quality for key quality issues.
  • Resolve Outgoing Live Die Reliability failures and solve and align on High Volume Manufacturing DRAM problems.
  • Provide quality-focused technical outreach and mentoring within Global Quality and outside it.

Desired Qualifications

  • Knowledge of Python and/or C++.
  • Experience in design or circuit simulation.
  • Knowledge of reliability statistics.
  • Experience using, applying, or leveraging artificial intelligence.

About the Company

Micron Technology

Makes memory and storage chips for AI and PCs

Micron Technology designs and manufactures memory and storage chips, mainly DRAM and NAND flash, used in data centers, PCs, phones, cars and industrial equipment. It is one of only three companies that make HBM, the stacked high-bandwidth memory placed beside processors in AI servers, and it is the largest memory chipmaker based in the United States. Unlike chip designers that outsource production, Micron runs its own fabs and assembly sites in the United States and across Asia. It earns money by selling chips, memory modules and solid-state drives to cloud providers, device makers and distributors. Micron was founded in 1978 and is headquartered in Boise, Idaho.

Company size
10,001+
Company stage
IPO
Headquarters
Boise, ID
Founded
1978

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