S

SiTime

Fabless MEMS timing solutions provider

Package Development Engineer

Manufacturing EngineeringConfirmed live in the last 24 hours
Full-timeRemote in Thailand

About the Job

Requirements

  • A Bachelor’s, Master’s, or PhD degree in Materials Science, Chemical Engineering, Electrical Engineering, Mechanical Engineering, or a related discipline.
  • At least 5 years of experience in semiconductor packaging process engineering, with strong knowledge of QFN/LGA and flip-chip bonding technologies.
  • In-depth understanding of packaging process flows, equipment, and materials, including photoresists, polymers, solders, and underfills.
  • Proficiency in statistical analysis software such as JMP or Minitab and data interpretation.
  • Experience with failure analysis techniques such as SEM, EDX, optical microscopy, and X-ray.
  • Fluency in English.
  • Ability to work independently and manage multiple projects simultaneously in a fast-paced environment.

Responsibilities

  • Develop, optimize, and characterize packaging processes for QFN and LGA technologies, including wafer thinning, dicing, and flip-chip bonding processes.
  • Conduct process capability analysis (Cp/Cpk), implement statistical process control (SPC), and drive continuous improvement initiatives to enhance yield, quality, and cost-efficiency.
  • Perform root cause analysis and implement corrective and preventive actions using the 8D methodology for process-related issues and defects.
  • Collaborate with R&D, design, equipment, and manufacturing teams to support seamless process transfer from development to high-volume manufacturing.
  • Define and maintain process specifications, control plans, and standard operating procedures (SOPs).
  • Evaluate and qualify new materials, equipment, and processes to support technology roadmaps and production requirements.
  • Lead or participate in cross-functional teams for new product introduction (NPI) and process improvement projects.
  • Provide technical support and training for manufacturing operators and technicians.
  • Stay updated with industry trends and advancements in packaging technologies.
  • Work onsite at OSATs in Bangkok/Ayutthaya 60% of the time and travel 10% in Asia/US.

Desired Qualifications

  • Strong problem-solving skills and a data-driven approach to decision-making.
  • Excellent communication, interpersonal, and teamwork skills.

About the Company

SiTime

Fabless MEMS timing solutions provider

SiTime designs MEMS-based timing solutions (oscillators, network synchronizers, and jitter cleaners) as a fabless semiconductor company. MEMS resonators on silicon replace quartz to generate precise clocks and synchronize networks, with manufacturing handled by third-party foundries. The approach offers smaller size, lower power consumption, and better temperature stability, supported by scalable, design-focused development rather than in-house fabrication. Its goal is to expand MEMS timing adoption across automotive, industrial, IoT, mobile, aerospace, and telecom markets worldwide.

Company size
501-1,000
Company stage
IPO
Headquarters
Santa Clara, CA
Founded
2005

Recently Posted Jobs

Explore more opportunities at SiTime

See more jobs