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Echodyne

Develops solid-state metamaterials electronically scanned radar

Principal PCB/A Materials & Process Engineer

Hardware EngineeringConfirmed live in the last 24 hours
Full-timeKirkland, WA, USA

About the Job

Requirements

  • Knowledge of printed circuit board materials, fabrication processes, stackups, and design-for-manufacturing, quality, and reliability practices for radio-frequency, high-speed, or mixed-signal products.
  • Experience working directly with printed circuit board fabricators, material suppliers, and electronics manufacturing suppliers.
  • Ability to evaluate printed circuit board and printed circuit board assembly designs, fabrication documentation, supplier design rules, and manufacturing tradeoffs, and prioritize activities based on this analysis.
  • Experience with radio-frequency printed circuit board materials, polytetrafluoroethylene or mixed-material stackups, rigid-flex construction, metal-backed boards, or complex multilayer fabrication.
  • Experience with advanced printed circuit board processes such as sequential lamination, blind or buried vias, filled vias, controlled-depth drilling, or controlled-impedance structures.
  • Experience with electronics manufacturing, supplier development, product manufacturing engineering, or technical supplier management.
  • Bachelor of Science degree or higher in Engineering, Material Science, or Physics, or equivalent industry experience.
  • Ten or more years of experience in design and manufacture of circuit boards for radio-frequency applications.
  • Ability to travel up to 25% domestically and internationally to support development efforts.

Responsibilities

  • Serve as the technical authority in development for printed circuit board materials, stackups, fabrication processes, and manufacturability tradeoffs for complex radio-frequency, high-speed, and mixed-signal designs.
  • Partner with design engineering, program management, operations, supply chain, and suppliers during new product introduction to align product requirements with practical printed circuit board and printed circuit board assembly manufacturing capabilities.
  • Lead technical engagement with printed circuit board fabricators, material suppliers, and electronics manufacturing suppliers to assess advanced or emerging materials and new fabrication capabilities and processes, identify and resolve process gaps, and support supplier development.
  • Support supplier selection, qualification builds, production readiness, yield improvement, and root-cause analysis related to printed circuit board fabrication, materials, and assembly manufacturing processes before production release.
  • Provide practical design and process guidance to improve manufacturability, reliability, cost, and supplier execution.

Desired Qualifications

  • Experience supporting new product introduction, supplier qualification, manufacturability reviews, production readiness, or process improvement activities.
  • Knowledge of printed circuit board assembly processes, manufacturing constraints, common failure modes, and supplier process controls.
  • Familiarity with electronic computer-aided design, design for manufacturing, or manufacturing analysis tools such as Valor or equivalent.
  • Experience supporting failure analysis, yield improvement, corrective actions, or production process development.

About the Company

Echodyne

Develops solid-state metamaterials electronically scanned radar

Echodyne builds compact, high-performance radar systems for defense, security, and autonomous applications. Its EchoGuard and EchoShield combine metamaterial-based electronically scanned radar with software to detect and track objects for surveillance, counter-UAS, border security, and autonomous sensing. The MESA technology steers beams electronically without costly phase shifters, delivering solid-state, low SWaP-C radars that are easy to deploy and integrate with customers' systems. By expanding manufacturing capacity and product lines, Echodyne aims to make advanced radar accessible to a wide range of commercial, government, and defense customers.

Company size
201-500
Company stage
Acquired
Total funding
$199M
Headquarters
Kirkland, WA
Founded
2014

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