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Micron Technology

Makes memory and storage chips for AI and PCs

Pathfinding Device Integration Engineer

Hardware EngineeringConfirmed live in the last 24 hours
Full-timeBoise, ID, USANo salary listedIn-person

About the Job

Requirements

  • A Master of Science or PhD in Electrical Engineering, Materials Science, Applied Physics, or a related field is required.
  • Strong knowledge of semiconductor device physics and process integration is required.
  • Demonstrated innovation through patents, publications, or technology development contributions is required.
  • Strong analytical and quantitative problem-solving skills are required.
  • Excellent written and verbal communication skills are required.

Responsibilities

  • Evaluate novel device concepts, material systems, and integration schemes to enable future technology scaling and performance improvements.
  • Lead process integration efforts by aligning materials and process flows into actionable technology solutions.
  • Design and implement experiments in the research and development fabrication facility to optimize device performance and manufacturability.
  • Analyze inline, parametric, and probe data to identify operating mechanisms, variability drivers, and process opportunities.
  • Collaborate with modeling, characterization, reliability, and device teams to assess technology trade-offs and communicate recommendations.

Desired Qualifications

  • Experience with advanced semiconductor nodes or emerging device architectures is preferred.
  • Working knowledge of semiconductor processing, device architecture, or materials characterization techniques is preferred.
  • Familiarity with technology computer-aided design, physics-based modeling, and statistical analysis tools is preferred.
  • Experience working in semiconductor research and development, technology pathfinding, or early-stage development environments is preferred.
  • Experience using artificial intelligence-assisted analytics to enhance data interpretation, anomaly detection, and yield improvement initiatives is preferred.

About the Company

Micron Technology

Makes memory and storage chips for AI and PCs

Micron Technology designs and manufactures memory and storage chips, mainly DRAM and NAND flash, used in data centers, PCs, phones, cars and industrial equipment. It is one of only three companies that make HBM, the stacked high-bandwidth memory placed beside processors in AI servers, and it is the largest memory chipmaker based in the United States. Unlike chip designers that outsource production, Micron runs its own fabs and assembly sites in the United States and across Asia. It earns money by selling chips, memory modules and solid-state drives to cloud providers, device makers and distributors. Micron was founded in 1978 and is headquartered in Boise, Idaho.

Company size
10,001+
Company stage
IPO
Headquarters
Boise, ID
Founded
1978

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