Vishay Intertechnology

Manufactures discrete semiconductors and passive components

Implant/RTP Process Engineer

Process EngineeringConfirmed live in the last 24 hours

Full-timeNewport, UKNo salary listedIn-person

About the Job

Requirements

Three or more years of wafer fabrication experience.
Ability to work flexible hours.
Detailed knowledge of wafer fabrication manufacturing processes and systems.
Familiarity with modern manufacturing concepts including Just-in-Time, Kaizen, Zero Defects, Statistical Process Control, Total Quality Management, and Total Productive Maintenance.
Experience driving continuous improvement activities and projects for assigned measurables.
Experience with Applied Materials XR9500 and/or Axcelis GSD 200 or Purion implanters, Mattson 2800 rapid thermal anneal tools, or 3D Micromac laser anneal equipment.

Responsibilities

Improve, sustain, and troubleshoot Implant/RTP processes and manage all aspects of wafer processing within the fabrication area.
Implement and qualify technology and process transfers from sister sites.
Drive cost reduction, yield enhancement, capacity, and process optimization activities while adhering to company safety procedures.
Liaise with other groups within the company.
Maintain and develop processes on the assigned tool set across RTP/Implant.
Ensure operating specifications, OCAPs, and other required documentation are in place.
Communicate effectively with shift personnel and other groups as required.
Ensure M.I.S. (Promis) process flows are correct through each owned equipment set.
Implement improvement projects to achieve company and group goals.
Qualify processes for new or relocated equipment.
Use Design of Experiment to develop robust processes and achieve above-target capability indices (Cp/Cpk) on etch processes.
Ensure robust process-control checks, in-line product measurement, and process-control charts are in place to sustain process robustness.
Optimize production process recipes for cost, tool capacity, and robustness.
Generate and maintain process failure mode and effects analyses (FMEAs) to drive proactive scrap prevention across RTP/Implant.

Desired Qualifications

A degree or HND in a scientific or engineering discipline is preferred.
Ability to work effectively in teams.
Ability to empower and listen to others.
Highly motivated and results-, customer-service-, and communication-oriented, with strong leadership skills.

Job Summary:

This position is a key member of the Engineering team, in charge of improving, sustaining and troubleshooting Implant/RTP processes.

Responsible for all aspects of wafer processing within the Fab area. Implement and qualify technology/process transfers from sister sites. Drive cost reduction, yield enhancement, capacity and process optimization activities in a team environment, whilst adhering to all aspects of the company’s safety procedures. Liaising with other groups within the company.

Duties and responsibilities will include the following:

Maintenance and development of processes on assigned tool set across RTP/Implant.
Ensure correct documentation is in place, i.e. operating specifications, OCAP’s etc.
Effective communication to shift personnel and other groups as required.
Ensure M.I.S (Promis) process flows are correct through each owned equipment set.
Implementation of improvement projects to achieve company and group goals.
Process qualification of new or relocated equipment.
Develop robust processes through use of Design of Experiment, in order to achieve above target capability indices (Cp/Cpk) on etch processes.
Ensure appropriate and robust process control checks, in-line product measurement and process control charts are in place to sustain process robustness.
Optimize production process recipes in terms of cost and tool capacity and robustness.
Generate and maintain process FMEA’s to drive proactive scrap prevention across RTP/Implant.

Qualifications and Education Requirements

· Degree/HND in Scientific/Engineering discipline is preferred.

Desired Skills

· 3 years plus wafer fab experience.

· Ability to work flexible hours.

· Ability to work effectively in teams.

· Ability to empower and listen to others.

· Detailed knowledge of wafer fab manufacturing processes and systems

· Familiar with all modern manufacturing concepts such as; JIT, Kaizen, Zero Defects, SPC, TQM and TPM.

· Experienced in driving continuous improvement activities and projects for assigned measurables.

· Highly motivated, results orientated customer service orientated, strong leadership and communication skills.

Experience on the following equipment:

- Applied Materials XR9500 and/or Axcelis GSD 200, Purion implanters.

- Mattson 2800 rapid thermal anneal tools.

- 3D Micromac Laser anneal.

About the Company

Vishay Intertechnology

Manufactures discrete semiconductors and passive components

Vishay Intertechnology makes a very large range of discrete semiconductors and passive electronic components, such as resistors, capacitors, diodes, transistors, and inductors. These parts are used in products across automotive, industrial, computing, consumer, telecom, military, aerospace, and medical markets to control and manage electrical signals and power. The company sells its components worldwide and provides the supply, quality, and engineering support needed for customers to design and build electronic systems. What sets Vishay apart is its scale and breadth: one of the world’s largest portfolios of both discrete semiconductors and passive components, with a global footprint and established track record as a longtime supplier to many industries. Its goal is to power progress by supplying reliable, compatible components that enable customers to design and manufacture complex electronic devices.

Company size: 5,001-10,000
Company stage: IPO
Headquarters: Malvern, PA
Founded: 1962

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