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Micron Technology

Makes memory and storage chips for AI and PCs

HBM IO Design Architecture Engineer - Architecture

Silicon & ASIC DesignConfirmed live in the last 24 hours
Full-timeRichardson, TX, USANo salary listedIn-person

About the Job

Requirements

  • A Master of Science or PhD in Electrical Engineering.
  • At least 10 years of relevant engineering or design engineering experience with high-speed input/output, phase-locked loops, transmitters, receivers, equalization, or clock trees.
  • A good input/output circuit design background, familiarity with both analog and digital design, and simulation experience.
  • Experience with circuit verification and optimization, including layout verification and parasitic extraction of circuits.
  • A good understanding of state-of-the-art device characteristics and hands-on design experience.
  • Knowledge of one or more high-speed interfaces such as High Bandwidth Memory, Double Data Rate, Universal Chiplet Interconnect Express, Peripheral Component Interconnect Express, or Mobile Industry Processor Interface.

Responsibilities

  • Develop high-speed input/output design architecture for High Bandwidth Memory products.
  • Define and standardize input/output design quality processes from architecture through silicon.
  • Define input/output architecture, Through-Silicon Via input/output performance targets, and design quality requirements for future High Bandwidth Memory products.
  • Develop input/output and Through-Silicon Via modeling methodologies to support architecture tradeoff analysis, signal integrity and power integrity evaluation, and design optimization.
  • Drive simulation-to-silicon correlation and post-silicon learning feedback to improve design quality across High Bandwidth Memory product generations.
  • Use AI-assisted analytics to accelerate root cause identification from complex multivariable silicon data.

Desired Qualifications

  • Prior circuit debug experience through Product Engineering or equivalent.
  • Knowledge of advanced packaging environments such as CoWoS, High Bandwidth Memory stacks, and die-to-die interfaces.
  • Excellent problem-solving and analytical skills.
  • Strong documentation skills.
  • Strong communication skills, including the ability to clearly convey sophisticated technical concepts to design peers verbally and in writing.

About the Company

Micron Technology

Makes memory and storage chips for AI and PCs

Micron Technology designs and manufactures memory and storage chips, mainly DRAM and NAND flash, used in data centers, PCs, phones, cars and industrial equipment. It is one of only three companies that make HBM, the stacked high-bandwidth memory placed beside processors in AI servers, and it is the largest memory chipmaker based in the United States. Unlike chip designers that outsource production, Micron runs its own fabs and assembly sites in the United States and across Asia. It earns money by selling chips, memory modules and solid-state drives to cloud providers, device makers and distributors. Micron was founded in 1978 and is headquartered in Boise, Idaho.

Company size
10,001+
Company stage
IPO
Headquarters
Boise, ID
Founded
1978

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