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Onto Innovation

Semiconductor process-control metrology and inspection equipment

Field Service Engineer 2

Equipment Field ServicePosted on Nov 10
Full-timeSingapore

About the Job

Requirements

  • Preferred 3 to 5 years of Field Service experience in the semiconductor business.
  • Previous knowledge of equipment fault detection, with experience in electrical, mechanical, and software.
  • Preferred experience in semiconductor applications.
  • A college or university degree in engineering.
  • Ability to work unsupervised while contributing within a team setting.
  • Ability to efficiently utilize Microsoft Office products, including PowerPoint, Word, and Excel.
  • Ability to travel regularly throughout Southeast Asia, approximately 60% of the time.

Responsibilities

  • Install, repair, and maintain Onto Innovation products, including metrology and inspection tools.
  • Install new tools within the Southeast Asia region, completing both engineering and applications tasks.
  • Respond to down-tool situations within Southeast Asia and provide maintenance when required.
  • Provide requested documentation and feedback to the US factory as needed.
  • Provide feedback to the sales team and help identify possible leads for future sales.
  • Provide applications feedback to support ongoing product improvement.

About the Company

Onto Innovation

Semiconductor process-control metrology and inspection equipment

Onto Innovation provides semiconductor capital equipment and software for process control, metrology, and inspection. Its products include 3D metrology, macro defect inspection, unpatterned wafer quality assessment, and factory analytics software; these tools measure nanoscale transistor features and micron-level die interconnects, while software analyzes the data to give actionable manufacturing insights and customers buy equipment with ongoing service contracts and licenses. The company differentiates itself by offering an end-to-end process-control portfolio that spans front-end fabrication and back-end packaging, a result of the 2019 merger of Nanometrics and Rudolph Technologies, with integrated hardware and analytics that support complex architectures like chiplets. Its goal is to help semiconductor manufacturers increase device yield, boost productivity, and lower total production costs, aligning with capital spending cycles in AI workloads and advanced node technologies.

Company size
1,001-5,000
Company stage
IPO
Headquarters
Wilmington, MA
Founded
2019

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