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Fractile

Specialized AI inference chips and software

Semiconductor Test Engineering Team Leader

Engineering LeadershipConfirmed live in the last 24 hours
Full-timeIn-person

About the Job

Requirements

  • At least 8 years of semiconductor test engineering experience, including leadership or technical lead roles.
  • Deep experience with ATE test development, such as Advantest 93K or Teradyne.
  • Strong understanding of design for test (DFT), including scan, automatic test pattern generation (ATPG), logic built-in self-test (LBIST), and memory built-in self-test (MBIST), as well as memory testing and high-speed interface testing.
  • Experience managing external test development partners or outsourced semiconductor assembly and test providers (OSATs).
  • Ability to lead and mentor test engineering teams.
  • Solid background in advanced CMOS nodes and familiarity with advanced packaging test challenges.
  • Expertise in silicon debug, characterization, and correlation across ATE and system-level environments.
  • Ability to collaborate across design, architecture, product engineering, packaging, and operations.

Responsibilities

  • Drive the manufacturing test strategy for an AI accelerator chip featuring PCIe Gen6, LPDDR, advanced CMOS nodes, and advanced packaging such as 2.5D/3D and chiplets.
  • Lead and manage a team of chip test engineers responsible for test planning, test program development, pattern bring-up, silicon characterization, debug, and optimization.
  • Manage subcontracted test development partners, including OSATs, ATE vendors, and external engineering services, covering scoping, technical oversight, schedule tracking, and quality control of deliverables.
  • Define and drive test software architecture, DFT usage, and test pattern development strategies for high-speed logic, SRAM, DRAM, and high-speed I/O blocks.
  • Work with design, DFT, product engineering, packaging, and validation teams to ensure robust test coverage, manufacturability, and successful yield ramp.
  • Oversee test development for high-speed interfaces such as PCIe Gen6 and multi-GHz LPDDR.
  • Guide development of structural and functional test content, including scan, MBIST, JTAG, high-speed I/O tests, and system-level tests.
  • Lead silicon bring-up and development on ATE, including correlation, failure analysis, shmooing, corner testing, stress testing, and yield improvement activities.
  • Define KPIs and metrics for subcontractor performance, test coverage, yield, time-to-test, and cost optimization.
  • Drive continuous improvement in test methodologies, automation, data analytics, and debug infrastructure.
  • Ensure robust test flows for advanced packaging, including thermal testing, interposer/bridge connections, TSV integrity, and die-to-die I/O testing.
  • Support qualification, reliability testing, and high-volume manufacturing transfer.

Desired Qualifications

  • Experience with AI/ML accelerator chips or other high-performance compute ICs.
  • Prior involvement with PCIe Gen5/Gen6 or LPDDR4/5/6 test methodologies.
  • Familiarity with signal-integrity-aware test development and high-speed I/O margining.
  • Experience with chiplets, 2.5D/3D IC test flows, or heterogeneous integration.

About the Company

Fractile

Specialized AI inference chips and software

Fractile designs specialised AI inference chips, systems, and software to run very large AI models. Its approach packs DRAM directly on top of logic to boost memory bandwidth and capacity, offering an alternative to HBM and SRAM-based designs. The company operates full-stack across research, hardware, software, and systems, delivering an integrated hardware-software stack. Its goal is to enable scalable, high-performance model inference by meeting demanding memory needs with a complete solution.

Company size
51-200
Company stage
Series C
Total funding
$984.1M
Headquarters
London, United Kingdom
Founded
2022

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