Wideband Balun Technologies and Advanced IC Packaging PhD Intern

PhD  - Wideband Balun Technologies and Advanced IC Packaging
 

About Tyndall

Tyndall National Institute is an international leader in semiconductors, photonics and deep-tech research and innovation. As a leading collaborative European research institute, Tyndall is a key actor and hosting partner in the delivery of the ‘Chips for Europe Initiative’ (EU Chips Act).

Tyndall is Ireland’s leading research and innovation organisation and it is the national focal point for excellence in deep-tech research, development and graduate training at the convergence of nanotechnology, microelectronics, photonics, electronics and AI. Tyndall is recognised as an international research leader in semiconductor, chip and digital technologies, particularly as applied to the fields of Information & Communications, Health & Life Sciences, Agritech & Food Security, Energy and Climate Mitigation, emerging fields such as quantum, and novel computing paradigms.

The Institute’s key objective is to see frontier research activities having a significant impact on economic development and societal challenges in Ireland, Europe and beyond. Central to Tyndall’s mission is delivering economic impact through research excellence in partnership with industry and academia. With an annual turnover of more than €50m, the Institute has a community of over 600 researchers, engineers, support staff, postgraduate students, interns and industry researchers-in-residence.

With significant committed Irish government support, Tyndall will grow to be 1,000 people by 2030, with approximately 750 researchers, including 250 PhD students. A new 17,000 m2 research building is under development adjacent to the Cork headquarters and there are developing plans to expand Tyndall’s existing Dublin research labs and to establish other research sites within Ireland.

Tyndall’s expansion is also supported by recent national and EU funding wins for significant (M€10’s) additional research equipment across a range of areas such as semiconductor processing, microscopy, quantum technologies, heterogeneous integration, ultra-high speed optical communications and RF through THz characterisation.

About the Role
Tyndall National Institute, University College Cork, in collaboration with AMD, is offering a fully funded PhD opportunity as part of a joint research programme between the two organisations. The programme is designed to foster close collaboration and knowledge exchange between Tyndall National Institute and AMD, while developing advanced RF technologies for next-generation integrated circuits and packaging.

The PhD study will focus on the investigation, design, characterisation, fabrication, and optimisation of wideband balun technologies and their integration into advanced IC packages. Baluns are critical components in many RF and high-frequency systems, providing balanced-to-unbalanced signal conversion and enabling efficient interfacing between various circuit architectures. As operating frequencies and bandwidth requirements continue to increase, the integration of high-performance baluns within compact IC packages presents significant challenges in terms of bandwidth, insertion loss, impedance matching, parasitic effects, electromagnetic coupling, and manufacturability.

The project will investigate innovative approaches to addressing these challenges, with research spanning:

• Investigation of different balun architectures and their performance limits
• Electromagnetic modelling and RF/mm-wave characterisation of balun structures
• Fabrication and experimental validation of prototype structures
• Investigation of electromagnetic interactions and parasitic effects associated with IC packaging
• Optimisation of balun performance for package-level integration
• Development and validation of simulation and measurement methodologies
• Evaluation of the resulting technologies for relevant high-frequency integrated-circuit applications

The project will combine electromagnetic simulation, RF/mm-wave measurements, device fabrication and advanced packaging, providing the candidate with broad multidisciplinary research experience.

Industrial Collaboration
A key feature of this PhD is close collaboration with AMD. The successful candidate will have the opportunity to engage with researchers and engineers from AMD and gain exposure to industrial research and development practices. The collaboration will provide an environment in which fundamental research can be translated towards practical semiconductor and packaging applications. The candidate will benefit from knowledge exchange between academia and industry and will have the opportunity to develop an understanding of the challenges associated with taking advanced RF technologies from concept through to experimental validation and integration.

Research Environment
The research will be conducted at Tyndall National Institute, one of Europe's leading research centres in integrated ICT technologies. The candidate will have access to Tyndall's extensive research infrastructure for RF, microwave and mm-wave device development, simulation, fabrication and characterisation. The student will join a multidisciplinary research environment involving researchers working across RF and mm-wave technologies, integrated circuits, advanced materials, semiconductor devices, packaging, electromagnetics and wireless systems.

Key Responsibilities
This is an exciting PhD project in a rapidly evolving and highly industrially relevant area of RF/mm-wave technologies and advanced IC packaging. The successful candidate will work under the direction of the Principal Investigator and co-supervisors and will become an integral member of a collaborative research team at Tyndall National Institute, working closely with researchers and engineers from AMD.

The candidate will take a hands-on role in the day-to-day execution of the research programme, while developing the independence and expertise expected from a PhD researcher. Key responsibilities will include:
 

• Conduct a comprehensive and ongoing review of the state-of-the-art in wideband balun technologies, RF/mm-wave circuits and advanced IC packaging
• Undertake independent research into the modelling, design, fabrication, characterisation and optimisation of wideband baluns for high-frequency applications
• Perform electromagnetic and circuit-level modelling, simulation and optimisation of balun structures and their integration within IC packages
• Design and fabricate prototype devices and test structures for experimental validation
• Perform RF/mm-wave measurements and characterisation using appropriate laboratory equipment, including vector network analysers, spectrum analysers and probe stations
• Develop and validate appropriate measurement, modelling and characterisation methodologies
• Contribute to the development of demonstrator devices and experimental prototypes for internal and external demonstration
• Work closely with AMD, contributing to knowledge exchange and the translation of research outcomes towards practical industrial applications
• Prepare technical documentation, literature reviews, research reports and regular project updates
• Disseminate research findings through peer-reviewed journal publications, conference presentations, workshops and technical meetings
• Participate in project meetings and present research progress to academic and industrial collaborators
• Undertake appropriate administrative and organisational activities associated with the research programme and ensure that agreed milestones and deliverables are supported and achieved in a timely manner
• Undertake national and international travel, where required, for research meetings, conferences, workshops and collaboration activities
• Perform other duties relevant to the successful delivery of the research programme.
• Participate and support in Education and Public Engagement activities, as required.
• Ensure support of and compliance with Tyndall’s Quality Management Systems, Health and Safety standards, and other regulations.
• To carry out any additional duties that may reasonably be required within the general scope and level of the post.

The successful candidate will be expected to work effectively both independently and as part of a multidisciplinary team. Strong communication and interpersonal skills will be important, as the candidate will liaise closely with academic researchers, technical staff and industrial partners throughout the project.

Essential Criteria
The successful candidate should have:

• Have or expect to obtain, a First-Class Honours (or equivalent) degree in Electrical/Electronic Engineering, Physics, Applied Physics, or a closely related discipline.
• A strong foundation in electromagnetics, electronic circuits, RF/microwave engineering, or related subjects
• A demonstrated interest in RF, microwave and mm-wave technologies, with an appreciation of the challenges associated with high-frequency circuit and package design
• Good mathematical and analytical skills, with experience in or willingness to learn mathematical modelling tools such as MATLAB
• Experience with, or a willingness to learn, RF/electromagnetic computer-aided design (CAD) tools, such as Keysight ADS
• Experience with, or a willingness to develop skills in, RF/mm-wave measurement and characterisation, including the use of equipment such as vector network analysers (VNAs), spectrum analysers and probe stations
• An interest in experimental research, device fabrication and IC packaging
• The ability to work independently, solve complex technical problems, support and contribute effectively within a multidisciplinary research team
• Proficiency in written and spoken English.

Desirable Criteria
The following qualifications, experience and skills would be considered advantageous:

• A master’s degree (MSc/MEng or equivalent) in Electrical/Electronic Engineering, Physics, RF/Microwave Engineering, or a closely related discipline
• Academic or industrial experience in relevant areas such as RF/microwave or mm-wave circuit design, electromagnetic modelling, RF and IC packaging, device fabrication, or RF/mm-wave testing and characterisation
• Experience in the design and analysis of RF/mm-wave components, including baluns, antennas or other passive electromagnetic structures
• Practical experience with electromagnetic and circuit-level simulation and modelling, using tools such as Keysight ADS, CST Microwave Studio, HFSS, MATLAB or equivalent
• Experience with RF/mm-wave measurement and characterisation, including the use of vector network analysers, probe stations or other high-frequency measurement equipment
• Practical laboratory experience in device fabrication, assembly and integration of RF hardware, including soldering and related prototyping skills
• Experience in scientific research and technical communication, including preparation of journal and conference papers, technical reports and presentations

What We Offer 

• Full PhD funding, including tuition fees and a tax-free stipend. 
• A position within Rinn Semiconductor — Ireland’s Centre for Semiconductor Innovation, working at the interface of photonics, semiconductors, and digital healthcare. 
• Access to world-class fabrication and characterisation facilities at Tyndall National Institute / UCC. 
• Cross-theme collaboration with the HET (heterogeneous integration), NET, and PACK (packaging) themes, alongside an extensive network of industry and clinical partners. 
• The opportunity to contribute to a next-generation medical diagnostic platform with direct clinical translation. 

Terms of Studentship 

Contract : Full time/ Fixed Term
Duration of Study: 4 years 

The annual stipend is €25,000.00.  In addition, annual tuition fees will be paid by the Tyndall National Institute. 

Informal enquiries can be made in confidence to supervisor Dr Senad Bulja
The closing date for applications is 1pm on Friday 27th November 2026

Application Instructions 

Please make sure to attach an up-to-date CV/Resume AND a brief motivation letter outlining how you meet the ‘Essential Criteria’ for this role. 

Postgraduate applicants whose first language is not English must provide evidence of English language proficiency as per UCC regulations (https://www.ucc.ie/en/study/comparison/english/postgraduate/). Certificates should be valid (usually less than 2 years old) and should be uploaded with their application.