Full-Time

Product Software Integration Engineer

Software Engineering

Posted on 7/11/2025

Qualcomm

Qualcomm

10,001+ employees

Designs, manufactures, and licenses wireless semiconductors

Compensation Overview

$94.2k - $141.2k/yr

+ Bonus + RSU Grants

Company Historically Provides H1B Sponsorship

San Diego, CA, USA

In Person

Category
Software Engineering (2)
,
Required Skills
Python
Git
Java
C/C++
Requirements
  • Bachelor's degree in Engineering, Information Systems, Computer Science, or related field and 2+ years of Software Engineering or related work experience.
  • OR Master's degree in Engineering, Information Systems, Computer Science, or related field and 1+ year of Software Engineering or related work experience.
  • OR PhD in Engineering, Information Systems, Computer Science, or related field.
  • 2+ years of academic or work experience with Programming Language such as C, C++, Java, Python, etc.
Responsibilities
  • Integrate software components and configurations to meet product specifications.
  • Maintain and enhance automation for continuous integration systems.
  • Resolve build failures, resolve any software interface dependencies.
  • Create and maintain build scripts to optimize the build generation process.
  • Manage software configuration using version control system (e.g. Perforce or GIT).
  • Announce and release new software baselines.
  • Sanity test the incremental builds to catch any regression issues due to new integration.
  • Debug any sanity test failures.
  • Create scripts to automate the test scenarios and process logs.
Desired Qualifications
  • Industry experience in software development and System Architecture on Arm based RTOS platforms.
  • Android or other High level OS for Mobile, Compute, IoT or Automotive products (e.g. Android, Linux, Windows etc.).
  • Software version control systems (such as GIT, Perforce etc.) for large scale software development.
  • C /C++ programming and debug experience.
  • Software development for embedded platform.
  • One or more of the following Modem protocols: EVDO/WCDMA/LTE/5G system architecture.
  • RTOS software development.
  • Scripting language such as Perl or Python.
  • Multimedia (Audio, Video, Camera) software development/debug/integration.
  • Understanding of ARM processor family and software development on ARM processors.
  • Understanding of Bluetooth, Wifi (802.11 family) drivers and protocol.
  • Embedded system debugging skills (Jtag based).
  • Familiarity with modem log analysis (e.g. WCDMA, LTE, 4g, 5g etc.)

Qualcomm designs and licenses semiconductor technologies for wireless connectivity used in mobile devices, cars, and IoT. Its products include system-on-chips and RF components, plus a large portfolio of patents that it licenses to other companies. The company combines end-to-end semiconductor design with IP licensing to serve mobile, automotive, and IoT markets. Its goal is to expand wireless technology adoption by delivering standards-based silicon solutions and monetizing its intellectual property to support ongoing connectivity innovation.

Company Size

10,001+

Company Stage

IPO

Headquarters

San Diego, California

Founded

1985

Simplify Jobs

Simplify's Take

What believers are saying

  • Dragonfly gives Qualcomm a clearer server branding before June 24 investor day.
  • AI200 and AI250 could create a new rack-scale inference revenue stream.
  • Automotive revenue reached $1.3 billion, validating diversification beyond smartphones.

What critics are saying

  • Nvidia can outmuscle Snapdragon X in Windows on Arm design wins.
  • Dragonfly can disappoint hyperscalers if Qualcomm's server roadmap stays vague.
  • Budget Snapdragon C PCs risk weak margins against Intel and AMD pricing pressure.

What makes Qualcomm unique

  • Qualcomm pairs Snapdragon, Dragonwing, and Dragonfly across mobile, edge, and data centers.
  • Its custom-silicon expertise targets hyperscalers needing energy-efficient inference, CPUs, and ASICs.
  • Microsoft's Project Solara links Qualcomm silicon to agent-first software and cloud.

Help us improve and share your feedback! Did you find this helpful?

Your Connections

People at Qualcomm who can refer or advise you

Benefits

Premium-free health coverage

Onsite health & fitness centers

Retirement programs

Disability & life insurance programs

Tuition reimbursement

Product discounts

Flexible time off

Parental leave

Growth & Insights and Company News

Headcount

6 month growth

0%

1 year growth

-2%

2 year growth

-2%
HotHardware
Jun 2nd, 2026
ASUS Ascent QN10 brings Snapdragon X2 Elite to mini PCs for the first time.

ASUS Ascent QN10 brings Snapdragon X2 Elite to mini PCs for the first time. by Paul Lilly - Tuesday, June 02, 2026, 09:04 AM EDT ASUS once picked up right where Intel left off when the chip maker decided to shift is Next Unit of Computing (NUC) platform to a licensing model, so it's not surprising that ASUS is also first in line to inject Qualcomm's Snadragon X2 Elite into a mini PC form factor. In doing so, the new ASUS Ascent QN20 is the first AI mini PC to feature Qualcomm's flagship SoC series. Video Muted "With the launch of the ASUS Ascent QN10, the first mini-PC powered by the Snapdragon X2 Elite platform, Qualcomm Technologies, together with ASUS, is expanding the Snapdragon X Series beyond Windows laptops, bringing its industry-leading performance and AI leadership squarely into the AI mini-PC space," Qualcomm boasts in a blog post. Qualcomm sees this as a major milestone for Snapdragon and proof that the same platform found in phones and laptops can power a new era of mini PCs. It won't be without competition, though, and not just from x86 solutions by AMD and Intel. It will also eventually go up against a new wave of systems powered by NVIDIA's RTX Spark, which was also announced at Computex 2026. The impact of RTX Spark and NVIDIA's entrance into the PC market (outside of discrete graphics cards and mobile GPUs) will take some time to play out and assess. In the meantime, the Ascent QN10 with its Snapdragon X2 Elite brings a dedicated NPU with 80 TOPS to the mini PC form factor to run AI workloads and agents locally, such as OpenClaw, Hermes, Cursor, Claude Desktop, Open AI codex, and OpenCode. "Enterprise-grade, chip-to-cloud security is built into the platform, helping protect sensitive data at every layer - making Snapdragon X2 Elite an ideal foundation for professional and business environments," Qualcomm says. ASUS stuffed the Snapdragon X2 Elite into a 0.2L chassis that, by the math, is 86% smaller than a standard 5L mini PC desktop form factor. And though small in size, it's big on the port selection, which includes two USB4 ports, a USB 3.2 Gen 2 port, a USB 2.0 port, and a 3.5mm audio jack on the front (plus a power button). Around back, there's another USB4 port, two more USB 3.2 Type-A ports, an HDMI 2.1 output, and a 2.5Gbps LAN port. HotHardware, Inc. did some digging and found a proper spec sheet, which reveals that ASUS using the Snapdragon X2 Elite X2E-88-100. That SKU sits in the middle of the Snapdragon X2 Elite pack and features the full 18 cores, up to a 4.7GHz clock speed, 53MB of cache, and Adreno X2-90 graphics clocked at up to 1.7GHz. The Ascent QN10 supports up to 32GB of LPDDR5X-9600 memory and up to 4TB of PCIe Gen4 solid state drive (SSD) storage by way of dual M.2 2280 slots. It also serves up Wi-Fi 7 and Bluetooth 5.4 for wireless connectivity. ASUS has not yet revealed pricing or a release date. Paul is a seasoned geek who cut this teeth on the Commodore 64. When he's not geeking out to tech, he's out riding his Harley and collecting stray cats.

NEXCOM USA
Jun 2nd, 2026
NEXCOM (8234) forges strategic collaboration with Qualcomm to accelerate Embodied AI robotics development at COMPUTEX.

NEXCOM (8234) forges strategic collaboration with Qualcomm to accelerate Embodied AI robotics development at COMPUTEX. TAIPEI - June 2, 2026 - Today, at COMPUTEX 2026, Qualcomm Technologies, Inc., a global leader in communication and computing, and NexCOBOT Taiwan Co., Ltd. (NEXCOM), a leader in industrial computing, announced their intent to collaborate in the acceleration of the development of next-generation robotics solutions. This collaboration aims to combine Qualcomm Technologies' pioneering position in high-performance edge computing with NEXCOM's deep expertise in robotic functional safety and motion control to develop key technology platforms tailored for embodied AI robots, accelerating the global timeline for mass production. A Next-Generation AI Control Board: Harmonizing Qualcomm Dragonwing(TM) IQ10 Series with NEXCOM Group and Subsidiary: NexCOBOT TAIWAN Co., Ltd. (NEXCOM Robotic Solutions) Real-Time Control and Functional Safety Stack Qualcomm Technologies views intelligent robotics as the ultimate practice platform for physical AI applications. To meet this demand, Qualcomm Technologies is introducing the Dragonwing IQ10 Series, a dedicated processor designed for industrial Embodied AI robotics. The Dragonwing IQ10 Series is designed to feature high performance, low power consumption, and multi-sensor integration capabilities, helping to enable humanoid, embodied, AMR (Autonomous Mobile Robot), and service robot applications. By integrating the Dragonwing IQ10 Series with the real-time motion control and functional safety technologies of NEXCOM, the two companies are assessing the launch of a "Next-Generation AI Control Board." It is envisioned that this solution would seamlessly blend Qualcomm Technologies' cutting-edge AI computing power with NEXCOM's specialized robotics control, aiming to provide the robotics industry with an AI controller defined by three core pillars: Real-Time Ready, EtherCAT Ready, and Functional Safety Ready. Targeting High-End Vertical Applications and the Humanoid Market NEXCOM and Qualcomm Technologies would focus on sectors requiring intensive AI computation and rigorous safety standards, including smart manufacturing, AMRs, and various high-end vertical robotics applications. By providing an "out-of-the-box" high-performance AI robotics solution, the collaboration could support developer goals of significantly shortening R&D cycles and accelerating time-to-market, with a particular emphasis on the burgeoning humanoid robot market. "Robotics is emerging as one of the most demanding applications of AI at the edge, requiring seamless integration of high-performance computing, real-time control, and functional safety," said Anshuman Saxena, VP and GM, ADAS & Robotics, Qualcomm Technologies, Inc. "Through our collaboration with NEXCOM, we are aiming to combine on-device AI with advanced control and safety technologies to help accelerate the development and commercialization of embodied AI robotics." Clement Lin, Founder and CEO of NEXCOM, further stated: "NexCOBOT has deep-rooted expertise in robot core motion control technology, and provides robot controllers that meet international functional safety standards. Having obtained TÜV Rheinland certification in 2024, we are one of the very few companies in the industry to achieve robotic functional safety certification through a modular platform. Through this powerful collaboration with Qualcomm Technologies, we aim to become the preferred provider of core components for humanoid robot developers worldwide, collectively securing a leading position in the Edge AI market."

AMT Pty Ltd
May 15th, 2026
5G Broadcast progressing #ams2026maldives.

5G Broadcast progressing #ams2026maldives. At this year's Asia Media Summit, one of the exhibitors was Qualcomm, showing a 5G Broadcast demonstration. 5G has been talked about for some years, but the latest demonstration showed progress in the delivery system. 5G Broadcasting can deliver live radio and tv broadcast signals to cell phones, bypassing the standard mobile data feed. The demonstration by Qualcomm at AMS26 used a modem transmitter to send the signal to a range of phones, but full installations would use broadcast grade transmission technology. Phones only need an app to view the transmissions. Once the app installed, the phone can receive a signal even if there is no SIM card, or wifi, potentially decoupling it from telcos. Whether the transmission is delivered by broadcasters or telcos is flexible, depending on the agreement between both. Frequency allocation is required. Recently, Qualcomm Technologies, Motorola, and Rohde & Schwarz successfully demonstrated a real-world proof-of-concept of 5G Broadcast, delivering television broadcasting and added-revenue services directly to mobile devices in Brazil. The demonstration used duplex gap broadcasting, delivering strong wide coverage across 5kms, without causing any interference to regular 5G cellular traffic or digital broadcasting. Brazil plans to transition to a TV 3.0 digital ecosystem, using "complementary technologies to enable mobile broadcasting." 5G Broadcast allows for the reception of broadcast television directly on enabled mobile devices. For the demonstration, Rohde & Schwarz installed an R&S TLU9 transmitter connected to an EFTX antenna at the transmission complex on Paulista Avenue in São Paulo. Local specialist LM Telecomunicações managed the implementation, and Qualcomm Technologies provided a test device and expertise. The 5G Broadcast stream was successfully received on Motorola Razr 50 and Moto Edge Plus handsets. Reporting: Steve Ahern Images: S Ahern Discover more TV & Video Mobile Phones Smart Phones

Al Wahda
May 6th, 2026
"E&" and "Qualcomm Technologies": Collaboration to develop systems in robotics and advanced air mobility

"E&" and "Qualcomm Technologies": Collaboration to develop systems in robotics and advanced air mobility Abu Dhabi - Al Wihda: "E&" and "Qualcomm Technologies" announced a new collaboration during the "Make it in the Emirates" event to develop AI-powered autonomous systems in the fields of robotics and advanced air mobility. This collaboration is based on developing a next-generation autonomous management platform for physical AI, combining E&'s intelligent connectivity infrastructure with Qualcomm Technologies' innovations in AI and edge computing, aiming to accelerate the deployment of autonomous systems across the UAE.

Wccftech
Apr 11th, 2026
Qualcomm is now reportedly developing custom DRAM for smartphones with China's CXMT.

Qualcomm is now reportedly developing custom DRAM for smartphones with China's CXMT. - Apr 11, 2026 at 11:47am EDT In what might well turn out to be a watershed moment for the smartphone sphere at large as it continues to contend with a full-blown memory chip crisis, Qualcomm is now reportedly working with China's CXMT to develop custom mobile-centric memory solutions, hoping to ease the chronic bottlenecks that have nearly paralyzed the global mobile industry. Qualcomm and China's CXMT are now reportedly working together to create custom mobile-focused DRAM. Back in February, Qualcomm had conceded during its earnings call that while the "majority" of DRAM that goes with Qualcomm's SoCs is purchased directly by its customers, the chip designer was "among the first to be qualified with every memory provider." Fast forward just a couple of weeks, and JoongAng Ilbo has come forward with a bombshell: Qualcomm is directly working with China's CXMT, which specializes in producing DRAM, to develop custom memory chips for mobile phones. As most of its readers would know by now, the global mobile industry is currently contending with a chronic DRAM shortage as most of the associated fabrication capacity has been allocated towards producing the more lucrative High Bandwidth Memory (HBM) for AI-related workloads. What's more, as Wccftech Inc reported recently, these memory-led pricing pressures are hitting the entry-level and mid-tier smartphone segments particularly hard, especially given their limited pricing-related maneuverability. Consider the fact that DRAM costs now make up a whopping 35 percent of the Bill of Materials (BOM) of a given entry-level handset, while NAND costs add another 19 percent. Together, these two components now make up a whopping 54 percent of a budget smartphone's total cost. This comes as both MediaTek and Qualcomm appear to have slashed their production cadence for 4nm chips, which feature prominently in low and mid-tier smartphones. As such, this production curtailment currently equates to around 20,000 to 30,000 wafers, which corresponds to a volume of between 15 million and 20 million mobile chips. Against this backdrop, it makes sense for Qualcomm to try to develop custom memory solutions with CXMT to salvage its order cadence. Of course, most of these memory chips will likely only go into Chinese smartphones. About the author: Writing is my one incontrovertible passion. Over the past six years, he has authored over 2,200 distinct articles on financial and tech-related topics, spanning nearly 1 million words. And he has been a member of Wcctech mobile team since 2025. As an alumnus of the University of Toronto, Rotman Commerce Program, I bring nuance, in-depth knowledge, and a unique perspective to every topic that I cover. When I'm not writing, I'm traveling the world, exploring hidden confectionaries and restaurants as an aspiring food connoisseur. Follow Wccftech on Google to get more of its news coverage in your feeds.

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