Failure Analysis Engineer

Job Req ID: 29047

About Supermicro:

Supermicro® is a Top Tier provider of advanced server, storage, and networking solutions for Data Center, Cloud Computing, Enterprise IT, Hadoop/ Big Data, Hyperscale, HPC and IoT/Embedded customers worldwide. We are the #5 fastest growing company among the Silicon Valley Top 50 technology firms. Our unprecedented global expansion has provided us with the opportunity to offer a large number of new positions to the technology community. We seek talented, passionate, and committed engineers, technologists, and business leaders to join us.

Essential Duties and Responsibilities:

1. Participate in the repair of production defective PCBA boards, following established procedures and guidance.
2. Response for failure analysis activities and repair machine (ex. BGA machine, tooling…etc) for defective boards. Collaborate with R&D on critical non-conformance (NG) symptoms were required.
3. Response for preparing failure analysis reports, repair records, and related documentation, contributing to traceability and continuous improvement efforts.
4. Perform other related duties or technical support tasks as assigned by the supervisor, based on operational needs.
5. Support NPI build activities, including basic debugging, analysis, and repair of defective boards, as part of cross-functional support.
6. Work closely with the product engineering team to identify and resolve production-related issues, including those arising from SMT and PCBA assembly processes.
7. Exposure to PCBA schematics, test points, and debugging tools (e.g., multimeter, oscilloscope) will be an added value.
8. Familiarity with SMT processes, soldering, rework techniques, or IPC standards is preferable and considered an advantage to the candidate.
9. Ability or willingness to support NPI ramp-up activities, pilot runs, or engineering builds is desirable.
10. Willingness to learn and adapt to new products, technologies, and repair methodologies is viewed as an added value.
11. Ability to perform effectively under pressure and meet work demands.
12. Willingness to support company assignments, including overtime and overseas travel (e.g., the U.S., Taiwan) for short-term missions of up to one (1) month.

Qualifications:

1. Bachelor’s degree or higher in Electrical Engineering (BSEE), Mechanical Engineering (BSME), or a related field, with at least 3~5 years of repair experience in the PCBA industry.
2. Excellent communication and interpersonal skills, with the ability to collaborate effectively across departments and with external stakeholders, including customers.
3. Working knowledge or exposure to computer or server operations and common electronic components or devices is preferable and considered an advantage to the candidate.
4. Basic understanding of electronic circuit fundamentals is desirable and viewed as an added value.
5. Experience or familiarity with soldering and desoldering techniques is preferred; exposure to BGA rework will be an added advantage.
6. Understanding or hands-on exposure to computer or server testing and inspection processes is preferable.
7. Comfortable operating common software environments such as Windows; basic exposure to Linux is considered an added value.
8. Ability to support electronic circuit analysis and troubleshooting activities, under guidance when required, is desirable.
9. Demonstrates teamwork, self-motivation, and a positive working attitude, with the willingness to contribute to team objectives and continuous improvement.
10. Experience with Fortune 500 EMS/ODM/OEM electronics manufacturing companies is highly preferred but not necessary.

EEO Statement