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Micron Technology

Makes memory and storage chips for AI and PCs

Lead Principal Engineer

Process EngineeringConfirmed live in the last 24 hours
Full-timeBoise, ID, USANo salary listed

About the Job

Requirements

  • A Master’s degree in Materials Science and Engineering, Chemical Engineering, Electrical Engineering, Mechanical Engineering, or a related field, and 3 years of experience in the job offered or a related occupation.
  • Experience with plasma dry etch technology.
  • Experience leading suppliers and establishing supplier accountability programs.
  • Experience establishing manufacturing team structures, standards, and processes.
  • Experience resolving yield, defectivity, and cycle-time issues in a process area.
  • Experience performing statistical analysis using JMP.
  • Experience driving dry etch area MOR-POR gaps, PMI, SPC, and CSPEC.
  • Experience providing technical guidance to resolve complex capacity or cost-reduction projects.

Responsibilities

  • Develop etch processes on state-of-the-art plasma etch tools using Inductively Coupled Plasma (ICP), Capacitively Coupled Plasma (CCP), and Electron Cyclotron Resonance (ECR) technologies.
  • Collaborate with High Volume Manufacturing (HVM) fabrication facilities to deploy advanced dry etch technologies and accelerate production ramps.
  • Engage with partners in technology development, Operational Central teams, and HVM fabrication facilities.
  • Work with Technology Development (TD) and HVM to develop, deploy, and sustain end-to-end manufacturing excellence through supplier management and central operations execution.
  • Establish global alignment across organizations on commercial cost, efficiency, New Product Introduction (NPI) speed, and quality metrics.
  • Influence HVM fabrication facilities on high-priority Key Performance Indicators (KPIs) for yield enhancement, including improvements in variability and defectivity.
  • Supervise the work of other engineers.
  • Travel internationally 10% of the time.

About the Company

Micron Technology

Makes memory and storage chips for AI and PCs

Micron Technology designs and manufactures memory and storage chips, mainly DRAM and NAND flash, used in data centers, PCs, phones, cars and industrial equipment. It is one of only three companies that make HBM, the stacked high-bandwidth memory placed beside processors in AI servers, and it is the largest memory chipmaker based in the United States. Unlike chip designers that outsource production, Micron runs its own fabs and assembly sites in the United States and across Asia. It earns money by selling chips, memory modules and solid-state drives to cloud providers, device makers and distributors. Micron was founded in 1978 and is headquartered in Boise, Idaho.

Company size
10,001+
Company stage
IPO
Headquarters
Boise, ID
Founded
1978

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