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Micron Technology

Makes memory and storage chips for AI and PCs

MTS System Architect

Hardware Systems IntegrationPosted on Nov 9
Full-timeIn-person

About the Job

Requirements

  • AI proficiency is required.
  • Ability to provide system-level technical leadership for storage products across architecture, development, integration, validation, and qualification.
  • Ability to translate product, customer, and platform requirements into system architecture, technical requirements, development constraints, and validation criteria.
  • Expertise evaluating tradeoffs involving NAND, controllers/ASICs, packaging, PCBs, host interfaces, power, performance, thermal behavior, and reliability.
  • Ability to analyze high-speed interfaces, signal and power integrity, power delivery, low-power operation, and platform integration.
  • Ability to evaluate NAND, controller, and firmware interactions affecting performance, power, endurance, reliability, error recovery, and qualification.
  • Knowledge of system power requirements, characterization methodologies, qualification strategies, mission profiles, reliability requirements, and system-level test coverage.
  • Ability to perform root-cause analysis across hardware, firmware, NAND, interfaces, power, performance, reliability, and system integration.
  • Ability to assess architecture, component, and build changes for impacts on performance, reliability, compatibility, manufacturability, qualification, cost, and schedule.
  • Ability to apply data-driven engineering analysis using AI tools to characterization, validation, reliability, power, performance, and manufacturing data.
  • Ability to review schematics, PCB builds, component specifications, electrical requirements, characterization results, and qualification evidence.
  • Ability to communicate technical risks, tradeoffs, recommendations, and product readiness to engineering leadership and product teams.

Responsibilities

  • Deliver system architecture and technical direction for UFS, client SSD, and automotive SSD products throughout the product lifecycle.
  • Translate product, customer, and platform requirements into system-level architecture, technical requirements, development constraints, and validation criteria.
  • Define and evaluate tradeoffs involving NAND, controller/ASIC, package, PCB, host interfaces, power, performance, thermal behavior, and reliability.
  • Lead technical analysis and build mentorship, using AI tools, for high-speed interfaces, signal and power integrity, power delivery, low-power operation, and platform integration.
  • Evaluate NAND, controller, and firmware interactions and their impact on performance, power, endurance, reliability, error recovery, and qualification.
  • Define and review system power requirements, characterization methodologies, qualification strategies, mission profiles, reliability requirements, and system-level test coverage.
  • Lead cross-functional root-cause analysis and resolution of complex hardware, firmware, NAND, interface, power, performance, reliability, and system integration issues.
  • Assess architecture, component, and build changes for impacts to performance, reliability, compatibility, manufacturability, qualification, cost, and schedule.
  • Apply data-driven engineering analysis using AI tools to characterization, validation, reliability, power, performance, and manufacturing data to support technical decisions and risk mitigation.
  • Review and provide technical mentorship on schematics, PCB builds, component specifications, electrical requirements, characterization results, and qualification evidence.
  • Serve as a technical subject-matter guide and cross-functional leader, communicating technical risks, tradeoffs, recommendations, and product readiness to engineering leadership and product teams.
  • Drive architectural innovation, technical documentation, build methodologies, training, and knowledge transfer across the Edge Devices Group.

About the Company

Micron Technology

Makes memory and storage chips for AI and PCs

Micron Technology designs and manufactures memory and storage chips, mainly DRAM and NAND flash, used in data centers, PCs, phones, cars and industrial equipment. It is one of only three companies that make HBM, the stacked high-bandwidth memory placed beside processors in AI servers, and it is the largest memory chipmaker based in the United States. Unlike chip designers that outsource production, Micron runs its own fabs and assembly sites in the United States and across Asia. It earns money by selling chips, memory modules and solid-state drives to cloud providers, device makers and distributors. Micron was founded in 1978 and is headquartered in Boise, Idaho.

Company size
10,001+
Company stage
IPO
Headquarters
Boise, ID
Founded
1978

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