Radio Frequency/Mmwave IC & SiP Design Manager

Overview

Keysight is at the forefront of technology innovation, delivering breakthroughs and trusted insights in electronic design, simulation, prototyping, test, manufacturing, and optimization. Our ~16,800 employees create world-class solutions in communications, 5G, automotive, energy, quantum, aerospace, defense, and semiconductor markets for customers in over 100 countries. Learn more about what we do.

Our award-winningculture embraces a bold vision of where technology can take us and a passion for tackling challenging problems with industry-first solutions. We believe that when people feel a sense of belonging, they can be more creative, innovative, and thrive at all points in their careers. 

About the Team

The Keysight Labs MMIC and SiP Design team in Böblingen develops advanced microwave and mmWave integrated circuits and System-in-Package (SiP) technologies supporting next-generation applications in AI, 5G/6G, automotive, and high-performance communications.

The team collaborates closely with Keysight Centers of Excellence, product divisions, and cross-functional R&D organizations to create innovative RF/mmWave technologies that shape future test and measurement solutions.

This is a highly visible engineering leadership role with strong influence on future product architectures, technology strategy, and innovation roadmaps.

About the Role

We are seeking an experienced RF/mmWave IC & SiP Design Manager to lead a high-performing engineering team focused on the development of advanced RF and mmWave semiconductor and packaging solutions.

In this role, you will drive technical execution, team leadership, and strategic R&D initiatives across multiple technology platforms including InP, GaAs, GaN, and SiGe. You will partner closely with Technical Project Managers, product organizations, and external technology partners to deliver high-impact innovations from concept through production.

This role is ideal for a leader who combines deep technical understanding of RF/mmWave technologies with strong people leadership, project execution, and strategic thinking.

Responsibilities

• Lead and develop a high-performing team of MMIC and SiP engineers working across multiple semiconductor technologies and packaging platforms
• Drive the design and development of advanced RF/mmWave products aligned with evolving AI, 5G/6G, automotive, and communication market needs
• Collaborate with Technical Project Managers to define project scope, timelines, deliverables, budgets, and resource planning
• Support the development of next-generation device modeling and validation infrastructures for emerging process technologies
• Optimize trade-offs between performance, cost, manufacturability, schedule, and scalability
• Improve engineering workflows, methodologies, and design tools to accelerate development efficiency and time-to-market
• Contribute to long-term technical strategy, innovation roadmaps, and future product architecture planning
• Partner closely with internal product groups, fabrication partners, and packaging vendors to support successful product development and production transition
• Mentor and support the technical and professional growth of engineering team members
• Communicate project status, technical isks, and strategic recommendations to internal stakeholders and leadership teams

Qualifications

Required Qualifications

• Bachelor’s or Master’s degree in Electrical Engineering or a related field
• Strong experience in RF/mmWave circuit design and related semiconductor packaging technologies
• Experience leading complex engineering or R&D projects from concept through production release
• Demonstrated leadership experience managing or mentoring technical engineering teams
• Strong understanding of MMIC technologies such as GaAs, GaN, InP, or SiGe
• Experience managing technical deliverables, project timelines, and budgets
• Excellent communication and stakeholder management skills within cross-functional engineering environments

Desired Qualifications

• PhD in Electrical Engineering or related discipline
• Experience with System-in-Package (SiP) integration and advanced packaging technologies
• Experience working with semiconductor fabrication houses and external assembly partners
• Familiarity with device modeling, validation infrastructures, and RF measurement methodologies
• Experience supporting high-frequency product development for AI, telecom, aerospace, or automotive applications
• Exposure to strategic technology planning and product platform development

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