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Black Semiconductor

Graphene photonics enable optical chip interconnects

CD-SEM Expert

Inspection & TestConfirmed live in the last 24 hours
Full-timeAachen, GermanyNo salary listedIn-person

About the Job

Requirements

  • An educational background in Electrical/Electronic Engineering, Mechanical Engineering, or a related field is required.
  • At least 5 years of experience in semiconductor manufacturing environments is required.
  • Hands-on experience with CD-SEM tools, such as Hitachi or Applied Materials, in a fab environment is required.
  • Experience with data analysis tools such as JMP, Python, or MATLAB is required.
  • The ability to work in cleanroom environments and perform under tight production deadlines is required.
  • Strong analytical and problem-solving skills are required.
  • Strong teamwork and communication skills are required for cross-functional collaboration, training, and knowledge sharing.

Responsibilities

  • Operate CD-SEM tools to perform critical dimension, profile, and defect measurements on semiconductor wafers.
  • Ensure the accuracy, repeatability, and reproducibility of CD measurements for process control and yield improvement.
  • Perform preventive maintenance, troubleshooting, and root cause analysis to ensure tool stability and uptime.
  • Collaborate with vendors on equipment repairs, maintenance, and spare parts replacement when needed.
  • Work with process, lithography, and etch teams to correlate CD-SEM data with process performance.
  • Generate reports and dashboards on metrology metrics such as CD bias, line-width roughness, and line-edge roughness to support process monitoring.
  • Act as backup support for broader metrology engineering activities when required.
  • Support colleague training and maintain CD-SEM training documentation.
  • Drive improvements in metrology methods and ensure all activities comply with Environment, Health, and Safety guidelines.

Desired Qualifications

  • Understanding of semiconductor processes such as photolithography and etch.

About the Company

Black Semiconductor

Graphene photonics enable optical chip interconnects

Black Semiconductor develops graphene-based photonics that integrate optical components into the outer layers of CMOS-like chips, enabling direct optical chip-to-chip communication. It works by using graphene as a translator to convert electronic signals to optical signals and back, so electrons on silicon can talk to photons through integrated photonic interconnects. This approach differs from traditional silicon photonics or pure electronic interconnects by being CMOS-compatible, wafer-scale, and capable of linking multiple chips as a single high-performance unit while reducing production steps by about 60%. The company aims to move from pilot production to mass manufacturing, building a 300mm wafer facility (FabONE) in Aachen, with pilot production by 2027 and mass production by 2031, backed by a large European funding round and investors.

Company size
51-200
Company stage
Series A
Total funding
$287.4M
Headquarters
Aachen, Germany
Founded
2020

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