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Omni Design Technologies

Licenses high-performance IP cores for SoCs

Applications Engineer

Solution EngineeringConfirmed live in the last 24 hours
Full-timeMilpitas, CA, USANo salary listed

About the Job

Requirements

  • Solid understanding of integrated circuit design technology and analog design.
  • Familiarity with high-speed, high-resolution analog-to-digital or digital-to-analog data converters.
  • Some experience in high-performance mixed-signal design.
  • Some experience conducting technical presentations and training, as well as product demonstrations.
  • Strong written and verbal communication skills and ability to work with teams spread across geographic locations.
  • Ability to deliver high-quality results in a fast-paced and dynamic environment.
  • Ability to seek help proactively and share knowledge.
  • Bachelor's or master's degree in Electrical Engineering.
  • At least 2 years of experience.

Responsibilities

  • Provide pre-sales and/or post-sales support to customers.
  • Assist customers in adopting Omni Design intellectual property through training, demonstrations, presentations, technical issue resolution, and leading technical engagements.
  • Understand customers' analog and mixed-signal design challenges, especially at advanced process nodes, and guide them in refining requirements and integrating Omni Design intellectual property into products.
  • Communicate customer requirements and feedback to marketing and engineering for issue resolution and to improve product features and quality.
  • Travel as required.

About the Company

Omni Design Technologies

Licenses high-performance IP cores for SoCs

Omni Design Technologies delivers high-performance, ultra-low power IP cores for mixed-signal SoCs that power devices across 5G, LiDAR, automotive networks, AI, image sensing, and IoT. It develops and validates IP blocks and licenses them to chip makers, offering customization and support to ensure seamless integration into customer designs. The cores are designed to work on FinFET processes down to 28nm, with proven silicon such as gigasample low-power ADCs and DACs on TSMC 28nm. The company differentiates itself through validated, silicon-proven IP, deep collaboration with customers and partners (e.g., LeddarTech, MegaChips), and a global design footprint (new Fort Collins design center). Its goal is to enable customers to build sophisticated, power-efficient, mixed-signal SoCs quickly by providing ready-to-license IP plus engineering services that fit their specific needs.

Company size
51-200
Company stage
Series A
Total funding
$35M
Headquarters
Milpitas, CA
Founded
2015

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