Nexperia

Manufactures discrete semiconductors, logic devices, MOSFETs

Senior Design Engineer/Principal Design Engineer

Hardware Systems IntegrationConfirmed live in the last 24 hours

Full-timeSeremban, Negeri Sembilan, MalaysiaNo salary listed

About the Job

Requirements

A degree in an engineering discipline or materials science is required.
Knowledge of integrated circuit or discrete package design is required.
Experience with simulation, Design Failure Mode and Effects Analysis, and computer-aided design tools is required.
Strong customer focus, proactivity, and ability to work with minimal supervision are required.
Good interpersonal and presentation skills for cross-site and cross-functional teamwork are required.
Good command of written and spoken English is required.
Willingness to travel occasionally is required.

Responsibilities

Develop new packing methods, footprints, carrier tapes, and box designs by identifying gaps between design requirements and supplier capabilities in a timely manner.
Identify technical risks and provide mitigation proposals using appropriate design tools, including Design Failure Mode and Effects Analysis and simulations.
Drive sound design solutions.
Own the packing method, footprint, carrier tape, and box design process.
Ensure the process is effectively implemented across the full development life cycle.
Maintain footprint, carrier tape, and box design rules that correctly reflect assembly and supplier capabilities.
Address customer physical issues with packages, including tape and reel, surface-mount technology, solderability, and packing.

Desired Qualifications

A master's degree or higher is preferred.
Experience designing solder footprints is preferred.
Experience handling customers is an advantage.
Mandarin is an advantage.

What you will do

New packing method/footprint/carrier tape/box design from identify gaps between design requirements and supplier capability timely.
Identify technical risk and provide mitigation proposal at the right time with the use of proper design tools: Design FMEA, simulations
Drive for sound solutions.
Owner of packing method/footprint/carrier tape/box design process
Ensure the process is effectively implemented across the whole development life cycle
Maintain the footprint/carrier tape/box design rule that correctly reflect the assembly and supplier capabilities
Address customers’ physical issues (e.g. T&R, SMT, solderability, packing, etc.) in using our packages

What you will need

Degree in engineering disciplines or materials science, Master degree or higher is preferred
Knowledge of IC/discrete package design
Experience in Design tools such as Simulation, Design FMEA, CAD
Design experiences of solder footprint are preferred.
Creative in new ideas and solutions
Strong customer focus, proactive and able to work with minimal supervision
Experience in handling customer is an advantage
Good interpersonal and presentation skills in cross-site and cross functional team
Good command of written and spoken English. Mandarin is an advantage
Willing to travel in occasion.

Package R&D team deliver crucial competences at enabling new package technologies in product creation process of BCAMX. Package R&D MT always spot and concern accomplishments of team works; they share and engage with team building activities to recognize team's contribution.

D&I Statement

As an equal-opportunity employer, Nexperia values diversity not just because it is the right thing to do but because diverse teams perform better. We are dedicated to being inclusive, and a proof point of this dedication is that we were the main partner of the very first Dutch Paralympic Team NL House during the Paris 2024 Paralympic Games. Our recruitment process is inclusive and accessible to all, and we consider all applicants fairly, as well as providing a safe work environment and reasonable adjustments where requested.

In addition, we offer our colleagues the possibility to join employee resource groups such as the Pride Network Group or global and local Women's groups. Nexperia is committed to increasing women in management positions to 30% by 2030.

About the Company

Nexperia

Manufactures discrete semiconductors, logic devices, MOSFETs

Nexperia operates as a global supplier of semiconductor components, focusing on discrete semiconductors, logic devices, and MOSFETs. It serves automotive and industrial customers, providing parts that help electronic systems manage power, process signals, and protect data. The company designs, manufactures, and distributes these high-performance components, which are used in applications such as power management, autonomous driving, and data protection. Compared with competitors, Nexperia emphasizes reliability, quality, and targeted expertise in automotive and industrial markets, supported by ongoing improvement and product development. Its goal is to maintain leadership in supplying essential semiconductor parts that enable safer, more efficient, and more capable electronic systems.

Company size: 1,001-5,000
Company stage: Acquired
Total funding: $880M
Headquarters: Nijmegen, Netherlands
Founded: 1953

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