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Coherent

Global laser technologies and systems supplier

Silicon Photonics and Heterogeneous Integration R&D Engineer

Hardware EngineeringConfirmed live in the last 24 hours
Full-timeSanta Clara, CA, USANo salary listed

About the Job

Requirements

  • A Ph.D. in Electrical Engineering, Applied Physics, Photonics, Materials Science, or a related field is required.
  • More than 7 years of experience in silicon photonics design, integrated photonics research and development, silicon photonics fabrication-aware design, prototype development, device verification, or related semiconductor photonics work.
  • Hands-on silicon photonics fabrication experience or close collaboration with silicon photonics fabrication teams is required, with sufficient process understanding to design realistic prototype trials and interpret results.
  • Experience connecting design choices to optical, electrical, thermal, mechanical, reliability, process-integration, and packaging outcomes for photonic or optoelectronic devices.
  • Experience with simulation, data analysis, design of experiments, documentation, and research and development decision support using Python, Lumerical, COMSOL, JMP, Excel, or equivalent tools.
  • Strong foundation in silicon photonics design, device physics, test vehicles, materials interfaces, process design kits-based design, and process-integration constraints.
  • Structured problem-solving ability and comfort defining technical direction from trade-offs, incomplete data, and early prototype results.
  • Ability to influence across design, process integration, packaging, reliability, business groups, suppliers, and external partners.
  • Clear written and verbal communication with senior technical, product, manufacturing, and business audiences.
  • Ability to work in laboratory or cleanroom-adjacent environments, follow personal protective equipment requirements, handle wafers or samples when needed, and review process, metrology, and test data.
  • All employees are required to follow site environmental, health, and safety procedures and corporate environmental, health, and safety standards.

Responsibilities

  • Develop silicon photonics and heterogeneously integrated device and circuit concepts for datacom, optical input/output, and related platforms.
  • Model optical, electrical, thermal, and link-level behavior to guide design choices before prototype builds.
  • Define prototype verification objectives and use early trial results to refine designs.
  • Apply process-integration awareness to keep designs compatible with fabrication, test, and metrology constraints.
  • Evaluate heterogeneous integration options when they may improve silicon photonics performance or functionality.
  • Shape early-stage concepts, feasibility objectives, risk-reduction plans, and prototype approaches for CTO Office topics, including possible architectures such as co-packaged optics and optical input/output.
  • Lead technical evaluations, modeling, design reviews, and trade-off studies with internal or external contributors.
  • Develop recommendations on performance, manufacturability, integration path, scalability, reliability, and transition readiness.
  • Contribute technical input to roadmap discussions in optical interconnect, co-packaged optics and optical input/output, artificial intelligence and high-performance computing infrastructure, silicon photonics, detector technologies, and related platforms.
  • Translate emerging technology options into milestones, risks, decision points, and recommended next steps.
  • Coordinate work across design, process design kit, fabrication, process-integration, packaging, reliability, test, and external partner teams, including tapeout readiness and handoff to fabrication partners.
  • Prepare design reviews, prototype summaries, and recommendations for senior technical, product, and business stakeholders.
  • Support partner, supplier, university, and ecosystem discussions when technical representation is needed.
  • Ensure adherence to the company’s values in all aspects of the position.

Desired Qualifications

  • Experience with heterogeneous integration of non-silicon materials on silicon, including wafer bonding, die bonding, transfer printing, direct bonding, adhesive bonding, or thin-film transfer.
  • Packaging experience, including co-packaged optics, optical coupling, fiber attach, photonic integrated circuit/electronic integrated circuit integration, outsourced semiconductor assembly and test engagement, or prototype assembly.
  • Familiarity with process design kits from multiple fabs, silicon photonics tapeout flows, and layout reviews.
  • Experience with silicon photonics tapeouts.

About the Company

Coherent

Global laser technologies and systems supplier

Coherent provides lasers, laser-based technologies, and system solutions across Commercial Lasers and Components, Industrial Lasers and Systems, and Aerospace and Defense. Its products include laser sources, components, and complete laser systems used in microelectronics, materials processing, medical diagnostics, and research, sold with after-sales services and recurring software and consumables revenue. The company differentiates itself by offering a broad, integrated portfolio of hardware, services, and software across many industries and regions, serving OEMs, end-users, and government customers. Its goal is to grow by expanding product lines and software-enabled services so customers can deploy and scale laser technology in manufacturing, research, and defense applications.

Company size
5,001-10,000
Company stage
IPO
Headquarters
Santa Clara, CA
Founded
1966

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