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Renesas Electronics

Automotive-focused MCUs, SoCs, analog devices

Staff Process Engineer

Manufacturing EngineeringConfirmed live in the last 24 hours
Full-timeBayan Lepas, Penang, MalaysiaNo salary listedIn-person

About the Job

Requirements

  • A degree in Mechanical, Material, Physics, Chemistry, or Applied Sciences is required.
  • A minimum of 5 years of experience in Assembly Engineering is required.
  • Experience in process engineering or package development involving material, process, or design of thin wafer handling and SPS solder attach processes is required.
  • Knowledge of quality and reliability requirements for PQFNs/QFNs/WLCSP and leaded packages is required.
  • Knowledge of wire bonding is required.
  • Knowledge of statistical process control and statistical analysis software such as JMP is required.
  • Strong interpersonal and communication skills in English are required.
  • Strong analytical, written communication, and presentation skills are required.
  • Ability to manage large projects effectively is required.

Responsibilities

  • Design packages and develop processes to qualify PQFN packages for SPS products and associated modules.
  • Ramp up manufacturing volume and qualify required sources.
  • Sustain production lines and improve assembly yield, capacity, quality, and costs.
  • Address internal and external customer feedback and issues in collaboration with Test and Product Engineers and the Quality and Operations organizations.
  • Manage Product Lifecycle Management documents to keep them current.
  • Conduct change management with suppliers to sustain or improve capacity and cost.
  • Partner with Quality and Reliability teams to meet internal, industry, and customer standards.
  • Serve as the key manufacturing engineering interface for NPI-to-production transfers.
  • Manage OSAT and contract manufacturing relationships supporting production.

Desired Qualifications

  • Experience with Cu Clip, Thin Die, or Power QFN.
  • Package development knowledge.
  • Experience transitioning products from Development to Production.
  • Experience supporting NPI to Mass Production.

About the Company

Renesas Electronics

Automotive-focused MCUs, SoCs, analog devices

Renesas manufactures and sells MCUs, SoCs, and analog/power semiconductor devices to OEMs, focusing on automotive, industrial, infrastructure, and IoT markets. Its chips are building blocks that run embedded software and manage power and signals, and its Winning Combinations offer pre-tested system architectures to speed up design. It differentiates itself by growing through acquisitions to offer a broad, integrated portfolio and by moving toward a unified digital design platform to reduce integration work. Its goal is to become a leading supplier of these components and provide a single platform for electronics design that speeds time-to-market.

Company size
10,001+
Company stage
IPO
Headquarters
Tokyo, Japan
Founded
2002

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