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SK hynix

Global producer of DRAM and NAND.

Principal Engineer, Signal-Integrity and Power-Integrity

Full-Time
$185k - $220k
Senior
Master's, PhD
San Jose, CA, USA
In PersonOnsite in San Jose, California.
Hardware EngineeringBoard & Electronics Design

About the job

Requirements
  • A Ph.D. in Electrical Engineering or a related field, or a Master's degree with at least 5 years of relevant industry experience.
  • At least 5 years of hands-on signal-integrity and power-integrity engineering in advanced semiconductor packaging.
  • Deep knowledge of 2.5D/3D package architectures, HBM, interposers, through-silicon vias, high-speed I/O standards, and power-delivery networks.
  • Proficiency with signal-integrity and power-integrity simulation tools such as Ansys SIwave, RedHawk, and Cadence Sigrity.
  • Strong background in electromagnetic extraction, multi-port S-parameter analysis, power-network optimization, and tape-out sign-off processes for complex packages.
  • Demonstrated ability to influence multidisciplinary teams, drive technical decisions, and mentor senior engineers.
  • Ability to communicate technical concepts verbally and in writing to engineering and executive audiences.
Responsibilities
  • Define and own the signal-integrity and power-integrity roadmap for advanced packaging families, aligning technical direction with product and business goals.
  • Lead creation of high-performance system-in-package architectures, including HBM, interposers, and 3D stacks, and validate power delivery and signal integrity across the full stack from silicon to substrate.
  • Develop and propagate signal-integrity and power-integrity methodologies, including electromagnetic extraction, multi-port S-parameter modeling, and power-network analysis for complex packaging environments.
  • Oversee the end-to-end design flow, including package definition, simulation, layout sign-off, and tape-out, and improve tools, scripts, and automation.
  • Coach senior and junior engineers in signal-integrity and power-integrity analysis, tool usage, and design verification, and promote knowledge-sharing across global teams.
  • Conduct risk assessments, lead design reviews, and deliver final signal-integrity and power-integrity sign-off packages that meet performance, reliability, and schedule targets.
Desired Qualifications
  • Hands-on experience with 2.5D/3D packaging for HBM, interposers, or GPU-memory integration.
  • Expertise in power integrity for 3D-stacked memory systems, including power-delivery-network impedance profiling and IBIS model validation for HBM.
  • In-depth familiarity with PCIe Gen5/Gen6, CXL, UCIe, and JEDEC memory specifications.
  • Familiarity with advanced packaging workflows from ball map definition to tape-out for interposer-based designs.
  • Proficiency in Python, TCL, or SKILL scripting and automation to create custom analysis flows and improve productivity.
  • Experience validating high-speed memory interfaces using oscilloscopes, VNAs, and compliance test platforms specific to 3D packaging.
  • Published technical papers, patents, or conference presentations in advanced packaging or signal-integrity and power-integrity.

About the company

S

SK hynix

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Summary of SK hynix: 1) What does the company do? It is a global producer of semiconductor memory, specializing in DRAM and NAND Flash that power IT devices like computers, phones, and servers. 2) How do its products work? DRAM stores data using tiny capacitors and requires periodic refreshing to keep data, providing fast volatile memory. NAND Flash stores data in non-volatile memory cells and preserves data without power, serving as durable storage. Both chips are mounted in devices to enable fast processing and data retention. 3) How is the company different from competitors? It ranks as the second-largest memory chip maker with a broad product portfolio and strong technology, backed by the SK Group, giving it scale, resources, and global reach. 4) What is the company's goal? To become the world’s best semiconductor company by meeting diverse customer needs and leading in memory technology.

Company Size

5,001-10,000

Company Stage

IPO

Headquarters

Seoul, South Korea

Founded

1983

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Simplify's Take

What believers are saying

  • 2Q26 revenue reached 79.3 trillion won, up 257%, with 76% operating margin.
  • SK hynix won TSMC's 2026 Partner of the Year again, reinforcing ecosystem leadership.
  • OpenAI, Nvidia, and Microsoft deals locked HBM demand through 2030, sustaining utilization.

What critics are saying

  • Samsung raised HBM share to 33% by 2Q26, attacking SK hynix's lead aggressively.
  • Indiana packaging starts October 2028, leaving U.S. customers dependent on Korea through 2029.
  • Nvidia allocation drives HBM pricing and share, making SK hynix vulnerable to customer concentration.

What makes SK hynix unique

  • SK hynix shipped HBM4 in 2Q26 and supplies Nvidia's Vera Rubin platform.
  • TSMC awarded SK hynix Partner of the Year for HBM5-CoWoS collaboration in September 2026.
  • Indiana's $4 billion HBM packaging fab creates first U.S. back-end base by 2029.

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Benefits

  • Health Insurance
  • Paid Vacation
  • Paid Holidays
  • Paid Parental Leave
  • 401(k) Company Match
  • Educational reimbursement
  • Donation Matching and volunteering opportunities
  • Corporate discount programs
  • Health Insurance
  • Paid day offs: PTO + Company Holidays + Happy Fridays

Growth & Insights and Company News

6 month growth

7%

1 year growth

9%

2 year growth

9%
Yahoo Finance
Oct 28th, 2026
SK Hynix revenue tops 100 trillion won as it plans 100 trillion won shareholder payout

SK Hynix reported third-quarter revenue of 104.6 trillion South Korean won, passing 100 trillion won for the first time as demand for artificial intelligence (AI) memory grew. The chipmaker announced the results on an earnings call on October 27, 2026. Long-term agreements now cover more than 50% of its 2027 and 2028 capacity, which gives it steadier cash flow and clearer demand. The company plans to return about 100 trillion won to shareholders for fiscal 2026. That includes at least 30 trillion won in cash dividends and at least 60 trillion won in share buybacks and cancellations, including the 40 trillion won announced in August. In the fourth quarter, High Bandwidth Memory 4 (HBM4) is expected to pass HBM3E in both shipment volume share and revenue.

Yahoo Finance
Oct 28th, 2026
SK Hynix's 632% profit surge and $75.5B payout spark chip rally; two oversold stocks poised to rebound

SK Hynix posted a 632% jump in operating profit and plans a $75.5 billion shareholder return. The South Korean chipmaker said the AI memory shortage will last through at least 2030, with over half of its 2027 and 2028 capacity already sold under long-term deals. Easing the shortage requires heavy spending on cleanrooms, wafer fabrication systems, and 3D packaging. Two suppliers stand to gain, and both fell in October's tech pullback. Onto Innovation, which SK Hynix named its Best Partner for Technology Achievement, dropped nearly 32% to about $214. It reported record quarterly revenue of $343.1 million, up 35%, and backlog above $1.1 billion. Applied Materials fell 25.2% to about $395.93. Its DRAM equipment revenue rose 52% year-over-year, lifting net sales to $9.12 billion.

Yahoo Finance
Oct 28th, 2026
SK Hynix shares jump 7% as Q3 profit surges 632% and chip shortage seen lasting to 2030

SK Hynix shares rose about 7% in pre-market trading on Wednesday after the South Korean chipmaker reported a 632% year-over-year jump in third-quarter profit. Operating profit reached $62.5 billion, up roughly seven-fold and more than 7% above projections. The company also announced an extra $45 billion in buybacks and dividends for the rest of the fiscal year, on top of earlier plans. Management said conventional and high bandwidth memory are sold out through 2029 and expects shortages to last through 2030. The stock had fallen 24% last month. Other memory stocks and the Kospi index also rose.

ANI News
Oct 28th, 2026
SK hynix launches $1.5B financing programme for domestic chip suppliers

SK hynix has set up a 2 trillion won ($1.5 billion) financing program with four commercial lenders and a state-run trade insurer to give domestic chip suppliers cheaper funding. The Industry Ministry called it the largest trade financing deal of its kind involving a single company. SK hynix and the four lenders, Hana, KB Kookmin, Shinhan, and Woori, contributed 100 billion won. The Korea Trade Insurance Corporation provided credit guarantees of up to 20 times that sum. Small and medium-sized suppliers of materials, parts, and equipment get larger credit lines at preferential rates and lower guarantee charges. "Building a robust ecosystem of materials, parts and equipment suppliers is essential to securing Korea's global competitiveness," said chief executive officer Kwak Noh-jung. The signing took place at the Yongin semiconductor cluster in Gyeonggi Province.

Yahoo Finance
Oct 28th, 2026
SK Hynix to return $75.4B to shareholders after record results, lifting SKHY 6.6%

SK Hynix will return about 100 trillion won ($75.4 billion) to shareholders this year through dividends, share buybacks, and cancellations. US-listed SKHY rose 6.6% in overnight trading, while the company's Seoul shares gained more than 8%. The plan includes over 30 trillion won in dividends and another 20 trillion won in buybacks, on top of a completed 40 trillion won buyback. Third-quarter revenue rose 328% year over year to 104.6 trillion won, beating analysts' forecast of 98.34 trillion won. Operating profit climbed 632% to 83.33 trillion won. The chipmaker said it has sold out of DRAM and HBM chips until 2029, and expects shortages to last through 2030.