Working Student - m/f/d, Wafer Process Development and Design
About the job
- Be an enrolled student in Physics, Electrical Engineering, Materials Science, or a similar field.
- Have hands-on experience with laboratory work.
- Be able to communicate in a team and collaborate with colleagues.
- Demonstrate analytical thinking.
- Have a reliable, conscientious, and clean working mindset.
- Be fluent in German and English, written and verbal.
- Support the failure analysis laboratory with sample preparation and different analysis methods.
- Review, analyze, and document analysis results.
- Support the process development group in the Hamburg semiconductor fabrication facility.
- Preferably have knowledge of semiconductor technology, basic analysis methods, and Microsoft Office.
About the company
Nexperia operates as a global supplier of semiconductor components, focusing on discrete semiconductors, logic devices, and MOSFETs. It serves automotive and industrial customers, providing parts that help electronic systems manage power, process signals, and protect data. The company designs, manufactures, and distributes these high-performance components, which are used in applications such as power management, autonomous driving, and data protection. Compared with competitors, Nexperia emphasizes reliability, quality, and targeted expertise in automotive and industrial markets, supported by ongoing improvement and product development. Its goal is to maintain leadership in supplying essential semiconductor parts that enable safer, more efficient, and more capable electronic systems.
Company Size
1,001-5,000
Company Stage
Acquired
Total Funding
$880M
Headquarters
Nijmegen, Netherlands
Founded
1953
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Simplify's Take
What believers are saying
- Q2 2026 revenue reached $355.6 million, up 18.4% sequentially.
- September 2026 Tata partnership opens India-based wafer, assembly, and testing capacity.
- June 2026 GaN expansion and Aurobay collaboration deepen automotive and AI infrastructure demand.
What critics are saying
- Wingtech's control fight continues; Dutch courts kept voting freezes and investigation through 2026.
- A Chinese court froze Nexperia assets in August 2026, complicating global operations.
- Persistent China-Europe fragmentation can sever supply continuity and permanently split Nexperia's manufacturing network.
What makes Nexperia unique
- Nexperia leads small-signal MOSFETs and ranks top three in automotive power MOSFETs.
- Its 2026 12-inch automotive MOSFET line cuts chip costs up to 50%.
- GaN and SiC portfolios target automotive, datacenter, telecom, and industrial power conversion.
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Benefits
Flexible Work Hours
Paid Vacation
Commuter Benefits
Employee Discounts
Company Social Events
Performance Bonus
Paid Sick Leave
Life Insurance
Parental Leave
Professional Development Budget
Growth & Insights and Company News
6 month growth
↑ 2%1 year growth
↑ 2%2 year growth
↑ 2%Tata-Nexperia India chip route is not supply yet. September 19, 2026 by jimmy India's semiconductor buildout just gained a named customer and a two-site production sketch. That is not the same thing as extra MOSFETs on a distributor shelf. On September 17, Tata Electronics and Nexperia announced a strategic partnership to prepare Nexperia MOSFET production at Tata's upcoming 300 mm fab in Dholera, Gujarat, and to assemble and test Nexperia discrete products at Tata's packaging plant in Jagiroad, Assam. Electronics Weekly reported the deal on September 18. A separate September 18 memorandum with Sumitomo Chemical adds an upstream materials signal around the same Dholera project. The market question is narrower than "will India have another fab?" It is whether an identifiable product portfolio can actually travel a complete, commercially useful route - wafer in, packaged device out - under Nexperia's name. What the Tata-Nexperia partnership actually covers. The joint announcement hosted by Nexperia frames a long-term manufacturing, technology, and ecosystem relationship. MOSFET wafers are the disclosed front-end target at Dholera. Discrete assembly and test are the disclosed back-end target at Jagiroad. What the release does not give is equally important. There is no equity split, no product-level shipment schedule, and no purchase volume. Electronics Weekly's headline uses "jv." The primary text supports calling this a strategic partnership. It does not support asserting that a separately owned joint-venture company has already been formed. The same release puts Tata's combined investment in the two facilities at $14 billion. That is a stated facility investment. It is not the price of the Nexperia agreement, a new payment by Nexperia, or the value of its orders. Treat those dollars as project scale, not as a demand forecast. Why a supplier relationship is not a capacity print. A planned fab is potential capacity. A named manufacturing customer is different evidence: someone intends to use part of that capacity. Linking the two makes the Dholera-Jagiroad story more commercially specific than a generic "addressable market" slide. It still does not justify an immediate utilization number. The disclosed MOSFET scope does not name devices, transfer sequence, wafer allocation, or the customer approvals that would have to travel with a production move. Do not assign Tata's total fab output to Nexperia unless an allocation is disclosed. Do not treat the entire Nexperia discrete catalog as transferable to India on the strength of this announcement. For market analysis, the agreement is a customer-development milestone. It is stronger than a vague statement of demand. It is weaker than a qualified product release and a shipping schedule. Why wafer fab and packaging have to be read together. Diversifying only the front end can leave assembly and test sitting on the same concentrated backend. Diversifying only packaging can leave incoming wafers on the same concentrated fab. A relationship that sketches both stages is commercially more interesting because it creates the option of a more complete additional route. That is an inference about potential, not proof that the route is independent today. Buyers would still need to know where materials originate, which process steps stay shared with existing supply, how test programs are maintained, and how finished devices reach customers. A new geography also does not create a second vendor. Customers may gain another production location inside one supplier's network while keeping the same commercial counterparty and the same product ownership. Location risk can fall without supplier-level exposure disappearing. What the Sumitomo Chemical materials MoU does - and does not - prove. On September 18, Tata Electronics and Sumitomo Chemical signed an MoU to explore supplying semiconductor materials to Dholera and manufacturing some of them in India. The stated scope includes photoresists, functional chemicals, and high-purity process chemicals. Tata describes Dholera as a planned $11 billion, 300 mm fab and cites technology access spanning 28 nm to 110 nm through its PSMC alliance. Those are project-wide statements. They should not be assigned to Nexperia's MOSFET flow unless that mapping is disclosed. The materials MoU matters because an intended device customer and an intended input supplier sit on opposite sides of fab readiness. Neither replaces the other. A MOSFET program needs a repeatable process; that process needs qualified, consistently delivered chemicals. An exploratory memorandum is not an operating local chemical plant, and it is not completed materials qualification. What disclosure would turn this into a sourcing option. Three classes of follow-up would make the supply outlook concrete: * Product scope: named device families, intended applications, and the sequence in which they enter the new route. * Operational evidence: completed process transfer, sample availability, qualification milestones, and confirmed production release. * Commercial evidence: allocated capacity, order commitments, shipment timing, and the share of supply expected to come from the new sites. Those are monitoring items, not conditions the companies have already said they met. Until they appear, the partnership does not establish shorter distributor lead times, lower MOSFET prices, or the end of any existing allocation constraint. Procurement teams can still prepare. Ask for product-specific manufacturing-location data and change-notification plans. There is no basis in the announcement for treating the whole Nexperia portfolio as immediately transferable, interchangeable, or newly available from India. The takeaway. Tata-Nexperia gives India's manufacturing buildout an identifiable prospective product route across both wafer fabrication and packaging. The Sumitomo Chemical materials activity makes the ecosystem story more tangible. The announcements remain different from qualified output. The next useful market signal is a named product moving through that route with a confirmed release and delivery schedule. That is the point at which geographic diversification becomes a sourcing option rather than a strategic intention.
Nexperia and Tata have partnered to manufacture power semiconductors in India. Production will occur at Tata's $11 billion chip plant in Dholera, currently under construction. The companies will also collaborate on chip testing and assembly at Tata's Jagiroad facility. Financial terms were not disclosed. The partnership supports India's semiconductor ambitions, which include incentives for fabrication plants and related investments. The deal comes as Nexperia faces scrutiny over its ties to Chinese parent company Wingtech. A Dutch court has ordered an investigation into Nexperia, whilst separate proceedings examine alleged mismanagement and the relationship with Wingtech.
Nexperia & Aurobay explore GaN and sic powertrain solutions. The companies will evaluate co-design and system-level optimization for traction inverters and power generation systems. September 5, 2026 Nexperia and Aurobay Technologies, part of Horse Powertrain, are considering a strategic partnership to develop advanced power semiconductor technologies for automotive applications. The potential collaboration would bring together Nexperia's capabilities in gallium nitride (GaN) and silicon carbide (SiC) semiconductors with Aurobay Technologies' expertise in powertrain engineering, system design, and integration. The companies are building on earlier work involving Nexperia's GaN devices in Aurobay Technologies' compact power generation system designed for range-extender vehicles. That project highlighted how wide-bandgap (WBG) semiconductor technologies can deliver higher power-conversion efficiency while helping reduce system weight and footprint. It also showed their ability to operate reliably under demanding automotive conditions. Following these results, Nexperia and Aurobay Technologies plan to examine additional opportunities to enhance power electronics architectures for hybrid and electrified vehicles. Potential areas include traction inverters and power generation systems, where semiconductor performance and effective system integration play an important role in determining efficiency, power density, and overall vehicle architecture. The proposed cooperation would place greater emphasis on integrating semiconductor development with powertrain engineering from the early stages of product development. The companies will explore joint engineering and co-design strategies that evaluate semiconductor properties alongside specific powertrain requirements. This system-level approach could help uncover new ways to enhance electrical performance, improve efficiency, and create smaller, more highly integrated powertrain systems. Wide-bandgap (WBG) semiconductors are gaining greater attention in the automotive sector as manufacturers work to improve powertrain efficiency while making electrical systems smaller and lighter. Gallium nitride (GaN) enables fast switching and efficient power conversion, whereas silicon carbide (SiC) is well suited for high-voltage, high-power applications that demand strong thermal performance. Through their collaboration, Nexperia and Aurobay Technologies will examine how both technologies can be integrated into various powertrain designs. The initiative aims to help advance scalable, high-performance propulsion and power-generation systems for upcoming electric and hybrid vehicles. By combining semiconductor innovation with powertrain engineering and integration expertise, the companies hope to identify practical ways to expand the use of WBG power devices across automotive applications.
Nexperia explores collaboration power semiconductor solutions. 2 September 2026 Nexperia announced it will explore a strategic collaboration on advanced power semiconductor solutions for automotive applications with Aurobay Technologies, a division of Horse Powertrain Ltd. (a joint venture between Renault Group and Geely). The collaboration aims to combine Nexperia's expertise in gallium nitride (GaN) and silicon carbide (SiC) semiconductor technologies with Aurobay Technologies' capabilities in powertrain system design and integration. Building on a successful existing collaboration, the companies aim to evaluate how closer cooperation across semiconductor development and powertrain integration can support the next generation of electrified and hybrid vehicle platforms. The collaboration follows the successful deployment of Nexperia's GaN devices in Aurobay Technologies' highly integrated power generation system for range extender applications. The project demonstrated the potential of wide-bandgap semiconductor technologies to improve efficiency, reduce system size and weight, and enhance overall performance in demanding automotive environments. Building on this foundation, Nexperia and Aurobay Technologies will assess opportunities to further optimise power electronics architectures for applications including traction inverters and power generation systems. By combining Nexperia's WBG expertise with Aurobay Technologies' experience and capabilities in powertrain systems, the companies intend to evaluate joint engineering approaches, including early-stage co-design and system-level optimisation. As vehicle manufacturers seek higher efficiency, greater power density and more compact powertrain architectures, wide-bandgap semiconductor technologies are becoming increasingly important enablers of electrification. Through this collaboration, Nexperia and Aurobay Technologies aim to explore new approaches that accelerate the adoption of advanced power semiconductor solutions and support the development of scalable, high-performance propulsion systems for future mobility. Edoardo Merli, Head of Business Group Wide-Bandgap, IGBTs and Modules at Nexperia, said: "GaN and SiC technologies offer significant opportunities to improve efficiency, power density and system performance in automotive applications. By working closely with Aurobay Technologies, we can better understand system-level requirements and evaluate how advanced semiconductor technologies can deliver measurable benefits at the vehicle level. We look forward to building on our successful collaboration and exploring new opportunities together." Dr. Ma Yongquan, Chief Engineer, Advanced Engineering on Electrical Components at Aurobay Technologies, said: "Our experience integrating Nexperia's GaN technology into a highly integrated power generation system demonstrated the potential of close collaboration across the value chain. By combining our expertise in powertrain systems with Nexperia's semiconductor innovation, we can evaluate new approaches to improving efficiency, performance and packaging for future electrified propulsion systems." Keep up to date with the most important news. Positioning X-FAB as the answer to legacy node obsolescence and supply chain risks. Transense and Unison collaboration advances in hybrid-electric flight. 2 September 2026
Nexperia reports 18% revenue growth in Q2. Nexperia has reported Q2 2026 revenue of USD 355.6 million, an increase of 18.4% compared to Q1. The company says profitability and cash generation also improved QoQ, with operations outside China achieving positive net income and operating cash flow. The revenue improvement reflects capacity ramp-up initiatives and strengthening demand, particularly in computing and data storage applications driven by AI infrastructure investment. Automotive and industrial markets also showed encouraging development, according to a press release from Nexperia. "Our Q2 results demonstrate that the actions we have taken across the business are delivering tangible results. Compared to Q1, we achieved improvements in revenue, profitability and cash generation while continuing to invest in our future. We continue to make progress in stabilising our supply chain, ramping up capacity and supporting our customers reliably," said Stefan Tilger, interim CEO of Nexperia. The Q2 results build on the resilience Nexperia reported for Q1, when the company also posted positive net income and operating cash flow despite what it described at the time as the loss of control over its China operations following a dispute with parent company Wingtech. The company notes that its Chinese entities - Nexperia (China) Ltd. and several others - were deconsolidated with effect from October 1, 2025, and are not included in the reported figures. From manufacturing and design to supply chains and emerging technologies, the electronics industry never stands still. Meet the people driving it forward at the upcoming Evertiq Expo events. The next stop is Evertiq Expo Gothenburg on September 17, where industry professionals gather to exchange knowledge, discover new solutions and build valuable business connections. To stay up to date with the latest developments, sign up for the Newsletter.