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Substrate

Develops advanced X-ray lithography chipmaking system

Senior Process Engineer

Design EngineeringConfirmed live in the last 24 hours
Full-timeSan Francisco, CA, USA$200k - $300k

About the Job

Requirements

  • At least 7 years of hands-on micro- or nanofabrication experience in cleanroom user facilities.
  • Demonstrated ability to lead work safely and collaboratively in a cleanroom user facility.
  • Willingness and ability to work in several user facilities around the San Francisco Bay Area several days per week.
  • Demonstrated experience handling delicate samples and operating complex fabrication and characterization equipment.
  • Deep understanding of micro- and nanofabrication considerations, including top-down versus bottom-up approaches, pattern transfer, material compatibilities, etch selectivity and directionality, and thin-film and surface engineering, and the ability to design based on these considerations.
  • Deep understanding of the mechanical, optical, and chemical properties of materials that typically determine the performance of nanofabricated devices.
  • Strong written and oral communication skills, attention to detail, and organizational skills.
  • Ability to solve complex design challenges independently and as part of a team.
  • Ability to collaborate with a large, multidisciplinary technical group.
  • M.S. or higher degree in chemical engineering, electrical engineering, materials science, mechanical engineering, physics, or a related discipline in the physical or engineering sciences.
  • Legally authorized to work in the United States.

Responsibilities

  • Collaborate closely with the technical team to conceptualize, design, prototype, and characterize nanofabricated optical devices.
  • Fabricate MEMS/NEMS devices hands-on using techniques such as photolithography, electron-beam lithography, thin-film deposition, and wet and dry etching at user facilities, primarily around the San Francisco Bay Area, with possible travel beyond the Bay Area.
  • Own fabrication strategies in lithography, deposition, and etching; design process flows, material compatibility studies, and mask layout computer-aided design.
  • Iterate structural designs and tune lithography, deposition, and etch parameters to optimize processes and improve performance.
  • Characterize the mechanical, optical, and chemical properties of thin films using techniques such as profilometry, ellipsometry, and X-ray photoelectron spectroscopy.
  • Characterize pattern fidelity and resolution using techniques such as scanning electron microscopy and atomic force microscopy.
  • Select and scope bulk material, nanopatterned structure, and thin-film characterization strategies to better study the mechanical, chemical, and optical properties that drive device performance.
  • Design, coordinate, and conduct experiments in various user facilities.
  • Contribute to the build-up and installation of the company's internal research facilities.
  • Record, process, and interpret data and results for the wider team.

Desired Qualifications

  • At least 5 years of hands-on experience with characterization techniques such as electron microscopy and scanning probe microscopy.
  • Experience operating a Raith EBPG 5200/5200+, including aligned exposures.
  • At least 3 years of hands-on experience in inductively coupled plasma etching, with a strong understanding of plasma etching principles and recipe parameters.
  • At least 3 years of experience in industrial research and development.
  • Experience with instrument scoping, procurement, installation, and commissioning.
  • Experience with safety procedures and best practices when working with potentially hazardous liquid chemicals.

About the Company

Substrate

Develops advanced X-ray lithography chipmaking system

Substrate develops a new chipmaking platform that uses advanced X-ray lithography powered by a proprietary particle accelerator to pattern circuitry on silicon wafers, with the aim of building a vertically integrated U.S. foundry. The technology claims to cut lithography costs roughly in half and has been demonstrated at national laboratories and its own facilities, with first chips targeted for 2028. Unlike traditional suppliers, Substrate pursues domestic production to reduce reliance on overseas fabs and focuses on cost-efficient, leading-edge wafers for AI and robotics. Its goal is to restore U.S. leadership in advanced semiconductor manufacturing and improve supply‑chain resilience by offering a domestic, cost-effective path to making high-end chips.

Company size
11-50
Company stage
Late Stage VC
Total funding
$100M
Headquarters
San Francisco, CA
Founded
2022

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