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Renesas Electronics

Automotive-focused MCUs, SoCs, analog devices

Maintenance Engineer - Plating

Mechanical Maintenance and Reliability EngineeringConfirmed live in the last 24 hours
Full-timeBayan Lepas, Penang, MalaysiaNo salary listedIn-person

About the Job

Requirements

  • A bachelor's degree in Engineering, with a specialization in Mechanical, Electrical, Mechatronics, or Manufacturing Engineering.
  • At least 2 years of experience in semiconductor equipment maintenance; wet-process experience is preferred.
  • Strong troubleshooting and root cause analysis capability.
  • A solid understanding of equipment performance metrics, including Overall Equipment Effectiveness (OEE), MTBC, and downtime analysis.
  • Good leadership and cross-functional communication skills.

Responsibilities

  • Drive and improve equipment performance metrics, including Overall Equipment Effectiveness (OEE), MTBC, and unplanned downtime (UDT).
  • Lead troubleshooting and root cause analysis for equipment-related issues.
  • Plan and optimize preventive maintenance strategies and schedules.
  • Monitor equipment performance trends and drive improvement initiatives.
  • Collaborate with production, process, and vendors to implement effective solutions.
  • Coach and guide technicians on technical problem-solving and best practices.

Desired Qualifications

  • Experience with plating, high-pressure water jet, and chemical de-flash equipment, such as MECO EPL, JASTEC ED WJ, and JKS/AGS Chemical De-flash.
  • Familiarity with the PQFN product process flow.
  • Familiarity with structured problem-solving methodologies.
  • Experience in equipment reliability and optimization projects.
  • Hands-on experience in equipment troubleshooting and validation.
  • Ability to prepare clear, structured, and comprehensive technical reports.
  • Knowledge of automation, vision systems, and predictive maintenance approaches.

About the Company

Renesas Electronics

Automotive-focused MCUs, SoCs, analog devices

Renesas manufactures and sells MCUs, SoCs, and analog/power semiconductor devices to OEMs, focusing on automotive, industrial, infrastructure, and IoT markets. Its chips are building blocks that run embedded software and manage power and signals, and its Winning Combinations offer pre-tested system architectures to speed up design. It differentiates itself by growing through acquisitions to offer a broad, integrated portfolio and by moving toward a unified digital design platform to reduce integration work. Its goal is to become a leading supplier of these components and provide a single platform for electronics design that speeds time-to-market.

Company size
10,001+
Company stage
IPO
Headquarters
Tokyo, Japan
Founded
2002

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