PIC Design and modulator Development

In an increasingly connected world, the pandemic has highlighted just how essential telecom networks are to keeping society running. The Network Infrastructure group is at the heart of a revolution to connectivity, pushing the boundaries to deliver more and faster network capacity to people worldwide through our ambition, innovation, and technical expertise​.

 Join Optical Networks division, where innovation meets scale in the AI-driven data center era. With the recent acquisition of Infinera, we’ve united two industry leaders to create an optical networking powerhouse—combining cutting-edge technology with proven leadership to redefine the future of connectivity.​

 NION2026

Ph.D in Electrical Engineering, Photonics or a related discipline with emphasis in optical communications and high speed optical components. Desired are candidates with significant industrial experience in the optical components industry.

 

• Deep understanding and hands-on experience with electro-absorption modulators.
• Experience with RF design, simulation, and use of optical and electrical modeling tools such as HFSS, ADS to design electro-optical devices.
• Experience with RF device testing, electrical/optical s-parameter measurements, familiarity with optical components testing methodology including equipment setup, algorithms and sensitivity analysis.
• Strong background with semiconductor optical devices such as laser, detectors, modulators and other integrated waveguide devices along with a working level understanding of associated electronic circuitry. 
• A strong understanding of optical components design for performance and reliability, especially for devices such as lasers, SOAs, high speed modulators and detectors.
• Experience in creating designed experiments to map device performance
• Ability to work in an integrated team environment.
• Ability to work with a large body of data and the necessary statistical analysis tools, and the ability to present the data and ideas to a diverse audience.
• Job will require frequent interaction with fab, test and reliability engineering, packaging and system engineering groups, as well as with product engineering personnel.
  
   

Salary Range: US Salary range: $139,283.72 - $258,669.77 * Plus potential incentive/variable compensation for eligible roles