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Micron Technology

Makes memory and storage chips for AI and PCs

Yield Analysis Module Lead Engineer

Process EngineeringConfirmed live in the last 24 hours
Full-timeHyderabad, Telangana, IndiaNo salary listedIn-person

About the Job

Requirements

  • Proficiency in module-based data analysis, part-type ownership analysis, and new-part setup activities.
  • Knowledge of semiconductor processes, defects, and metrology.
  • Ability to use data-extraction query languages and scripting to automate work.
  • Ability to use AI-enabled tools responsibly and effectively for research, analysis, content creation, problem-solving, and operational tasks, while complying with organizational standards and legal requirements.

Responsibilities

  • Lead and maintain a training and development program, coaching and mentoring direct reports to elevate team proficiency and support their growth.
  • Track probe yield performance and trends to identify, characterize, and explain gaps between target and actual yields.
  • Perform advanced data analysis to quantify yield issues and generate accurate yield paretos that guide fab priorities and improvement efforts.
  • Apply statistical and data-mining techniques to identify root causes and uncover opportunities for sustainable yield improvement.
  • Collaborate with PI, Probe, PE, EFA, and PFA teams to correlate electrical signals, probe signatures, and physical findings into actionable insights for process teams.
  • Partner with module, inline monitoring, and global teams to implement, monitor, and standardize yield fixes.
  • Discover yield issues in NAND development and identify metrics or combinations of metrics, such as wafer, die, or tile shading, ECATS, or other custom metrics, to quantify issues.
  • Work with process area, process integration, yield, failure analysis, product engineering, design, and layout teams to define yield, cell, CMOS, qualification, and reliability issues and paretos, and derive improvement actions across technology nodes and designs.
  • Lead non-standard deep-dive statistical analysis of inline, probe, cell, and other critical metrics to define issues, enable early inline detection, and improve product yield and quality. Quantify and track issue hit rate, line impact, and gap to program goals, and quantify yield improvements or downsides from process or probe changes.
  • Initiate data mining and correlation studies on new issues, initiate PFA requests to identify root causes, and perform inline correlation studies to establish inline prediction of yield issues. Make yield projections based on expected improvement or downside, and conduct yield trend analysis to identify root causes in process steps, conversion, algorithm changes, and design for yield shifts.
  • Continuously develop and redefine inline detection in collaboration with metrology and the RDA team.
  • Identify and define gaps in current testing, and co-develop unique parametric or probe bins with product, probe, and parametric engineering teams to detect new failure modes and validate new program releases.
  • Collaborate with module owners to identify and quantify key module deficiencies and technology gaps, and drive cross-functional teams to address them. Optimize existing layouts and develop innovative solutions to meet product requirements and manufacturability.
  • Develop techniques for extracting data from databases through query languages and automate tasks through scripting to improve work efficiency.
  • Support transfer documentation of layout and architecture fundamentals for new technologies from R&D to manufacturing fabs.
  • Integrate AI-assisted tools and insights into daily work to improve efficiency, quality, or effectiveness, using sound judgment and complying with organizational standards and legal requirements.
  • Identify, test, and share AI-enabled enhancements within the role’s scope of work.

About the Company

Micron Technology

Makes memory and storage chips for AI and PCs

Micron Technology designs and manufactures memory and storage chips, mainly DRAM and NAND flash, used in data centers, PCs, phones, cars and industrial equipment. It is one of only three companies that make HBM, the stacked high-bandwidth memory placed beside processors in AI servers, and it is the largest memory chipmaker based in the United States. Unlike chip designers that outsource production, Micron runs its own fabs and assembly sites in the United States and across Asia. It earns money by selling chips, memory modules and solid-state drives to cloud providers, device makers and distributors. Micron was founded in 1978 and is headquartered in Boise, Idaho.

Company size
10,001+
Company stage
IPO
Headquarters
Boise, ID
Founded
1978

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