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viaPhoton

Custom-engineered fiber-optic connectivity for edge

High-Speed Digital Design Engineer

Board & Electronics DesignPosted on Nov 9
Full-timeNaperville, IL, USA

About the Job

Requirements

  • Have a Bachelor of Science in Electrical Engineering and 3+ years of hands-on high-speed design experience.
  • Bring a background in high-speed transceiver or transponder development, ideally for 200G/PAM4+ interconnect.
  • Have experience designing and applying 224G/448G PAM4 or PAM6 interconnect and related OIF-CEI or IEEE standards.
  • Be well-versed in high-speed signaling fundamentals, channel behavior, PCB technologies, and radio frequency design techniques.
  • Be comfortable with signal-integrity simulation tools such as ADS or HFSS, and with EMI/EMC evaluation and mitigation.

Responsibilities

  • Advance the development of 200G+ systems and interfaces for NPO and CPO products, including 224G/448G PAM4 signal and power integrity.
  • Own technology selection, architecture, development, integration, and productization of CPO solutions.
  • Define PCB material selection and stack-ups, and evaluate S-parameters, eye diagrams, crosstalk, jitter, and COM performance.
  • Assess host switch fabric and xPU technologies, including compute fabrics and scale-up/scale-out topologies.
  • Guide the electrical data path from concept to production and mentor junior design team members.

About the Company

viaPhoton

Custom-engineered fiber-optic connectivity for edge

ViaPhoton designs and manufactures fiber-optic connectivity solutions in the United States for edge data centers, 5G networks, and broadband infrastructure. Its product lineup includes fiber trunks, patch cords, modules, and integrated systems like the HyperReach high-density cabling solution, as well as tower-mounted enclosures, network interface devices for FWA and FTTH, and the ViaPhoton Fischer intelligent backup-power solution. The company differentiates itself through mass customization and shorter lead times achieved by integrating software, industrial automation, and Robotic Process Automation into its manufacturing processes. Its goal is to deliver flexible, edge-ready fiber connectivity that reduces installation time and operating costs for communications networks.

Company size
51-200
Company stage
Early VC
Total funding
$112M
Headquarters
Naperville, IL
Founded
2020

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