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Micron Technology

Makes memory and storage chips for AI and PCs

Process Integration Engineer - Advanced Packaging Technology Development

Process EngineeringConfirmed live in the last 24 hours
Full-timeBoise, ID, USANo salary listedIn-person

About the Job

Requirements

  • A BS in Electrical, Chemical, or Mechanical Engineering, Materials Science and Engineering, Physics, or a related technical field with 5+ years of semiconductor experience; an MS in a related field with 4+ years of semiconductor experience; or a PhD with 2+ years of semiconductor experience.
  • Experience delivering technical results in process integration, process development, or device development, including experiment design, execution, and analysis.
  • Knowledge of semiconductor process integration and memory technologies such as DRAM, NAND, and/or emerging memory architectures.
  • Experience solving technical problems using data-driven methods such as statistical analysis, Design of Experiments, and root-cause analysis.
  • Experience leading technical projects, collaborating across functions, communicating complex technical information, and using AI tools to improve technical workflows.

Responsibilities

  • Lead technical integration projects for new memory and advanced packaging technologies.
  • Design and complete experiments to assess process performance, variability, reliability, and yield.
  • Solve complex integration issues using data from inline, defect, parametric, probe, reliability, and package-level testing.
  • Partner across Process Integration, Process Development, Device Engineering, Package Design, Product Engineering, Reliability, Materials, and Manufacturing to develop and qualify new technologies.
  • Apply AI tools to data analysis, experiment planning, documentation, and technical problem-solving.

Desired Qualifications

  • Experience with advanced packaging technologies such as wafer-level packaging, fan-out packaging, 2.5D/3D integration, TSV, microbump, bonding, or chiplet integration.
  • Experience with Wafer-Level Technology or reconstituted wafer flows, including die shift, warpage, thickness/TTV, edge integrity, defectivity, or handling.
  • Experience developing, qualifying, and transferring semiconductor processes or integration solutions to high-volume manufacturing, including multi-site development.
  • Experience with device or package reliability and test methodologies, including probe, final test, burn-in, stress testing, or reliability qualification.
  • Experience applying AI or machine-learning tools to engineering data analysis, anomaly detection, yield improvement, or other engineering workflows.

About the Company

Micron Technology

Makes memory and storage chips for AI and PCs

Micron Technology designs and manufactures memory and storage chips, mainly DRAM and NAND flash, used in data centers, PCs, phones, cars and industrial equipment. It is one of only three companies that make HBM, the stacked high-bandwidth memory placed beside processors in AI servers, and it is the largest memory chipmaker based in the United States. Unlike chip designers that outsource production, Micron runs its own fabs and assembly sites in the United States and across Asia. It earns money by selling chips, memory modules and solid-state drives to cloud providers, device makers and distributors. Micron was founded in 1978 and is headquartered in Boise, Idaho.

Company size
10,001+
Company stage
IPO
Headquarters
Boise, ID
Founded
1978

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